JPH01125554U - - Google Patents

Info

Publication number
JPH01125554U
JPH01125554U JP1988020265U JP2026588U JPH01125554U JP H01125554 U JPH01125554 U JP H01125554U JP 1988020265 U JP1988020265 U JP 1988020265U JP 2026588 U JP2026588 U JP 2026588U JP H01125554 U JPH01125554 U JP H01125554U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
sealing frame
electronic component
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020265U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020265U priority Critical patent/JPH01125554U/ja
Publication of JPH01125554U publication Critical patent/JPH01125554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の実装プリント基板の断面図
、第２図は、本考案の実装プリント基板の分解斜
面図、第３図及び第４図は、既に提案されている
実装プリント基板の各断面図である。 １……プリント基板、３……半導体素子、４…
…ワイヤー、５……封止用樹脂材、６……電子部
品、７……封止用枠体、８……両面粘着テープ。 FIG. 1 is a sectional view of the mounted printed circuit board of the present invention, FIG. 2 is an exploded perspective view of the mounted printed circuit board of the present invention, and FIGS. 3 and 4 are each of the mounted printed circuit boards that have already been proposed. FIG. 1... Printed circuit board, 3... Semiconductor element, 4...
... wire, 5 ... resin material for sealing, 6 ... electronic component, 7 ... frame for sealing, 8 ... double-sided adhesive tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に電子部品をハンダ付けして装着
し、この電子部品の近傍の上記プリント基板に封
止用枠体を両面粘着テープを介して貼着し、この
封止用枠体内に半導体素子を実装し、この半導体
素子と上記プリント基板とをボンデング配線して
接続し、上記封止用枠体内に封止用樹脂材を充填
して加熱硬化したことを特徴とする実装プリント
基板。 An electronic component is soldered and mounted on a printed circuit board, a sealing frame is attached to the printed circuit board near the electronic component via double-sided adhesive tape, and a semiconductor element is mounted within this sealing frame. A mounted printed circuit board characterized in that the semiconductor element and the printed circuit board are connected by bonding wiring, and a sealing resin material is filled in the sealing frame and cured by heating.
JP1988020265U 1988-02-18 1988-02-18 Pending JPH01125554U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020265U JPH01125554U (en) 1988-02-18 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020265U JPH01125554U (en) 1988-02-18 1988-02-18

Publications (1)

Publication Number Publication Date
JPH01125554U true JPH01125554U (en) 1989-08-28

Family

ID=31236485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020265U Pending JPH01125554U (en) 1988-02-18 1988-02-18

Country Status (1)

Country Link
JP (1) JPH01125554U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247059A (en) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp Manufacture of hybrid integrated circuit device
JPS6239034A (en) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd Manufacture of semiconductor chip carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247059A (en) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp Manufacture of hybrid integrated circuit device
JPS6239034A (en) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd Manufacture of semiconductor chip carrier

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