JPH01126380U - - Google Patents

Info

Publication number: JPH01126380U
Authority: JP; Japan
Prior art keywords: bonding wire; spool; flange; fixed; starting end
Prior art date: 1988-02-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1988022767U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-02-23

Filing date

1988-02-23

Publication date

1989-08-29

1988-02-23 Application filed filed Critical

1988-02-23 Priority to JP1988022767U priority Critical patent/JPH01126380U/ja

1989-08-29 Publication of JPH01126380U publication Critical patent/JPH01126380U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Storage Of Web-Like Or Filamentary Materials (AREA)
Wire Bonding (AREA)

JP1988022767U 1988-02-23 1988-02-23 Pending JPH01126380U (da)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988022767U JPH01126380U (da)	1988-02-23	1988-02-23

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988022767U JPH01126380U (da)	1988-02-23	1988-02-23

Publications (1)

Publication Number	Publication Date
JPH01126380U true JPH01126380U (da)	1989-08-29

Family

ID=31241173

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988022767U Pending JPH01126380U (da)	1988-02-23	1988-02-23

Country Status (1)

Country	Link
JP (1)	JPH01126380U (da)

1988
- 1988-02-23 JP JP1988022767U patent/JPH01126380U/ja active Pending

Publication	Publication Date	Title
JPH01126381U (da)	1989-08-29
JPH01126377U (da)	1989-08-29
JPH01126382U (da)	1989-08-29
JPS6432875U (da)	1989-03-01
JPS63174442U (da)	1988-11-11
JPH0348909U (da)	1991-05-13
JPS6370794U (da)	1988-05-12
JPH02104747U (da)	1990-08-21
JPH0479406U (da)	1992-07-10
JPH033117U (da)	1991-01-14
JPH0426046U (da)	1992-03-02
JPS63178265U (da)	1988-11-18
JPH0417936U (da)	1992-02-14
JPS645548U (da)	1989-01-12
JPS6347511U (da)	1988-03-31
JPS61131198U (da)	1986-08-16
JPS63142997U (da)	1988-09-20
JPH03104735U (da)	1991-10-30
JPH0179279U (da)	1989-05-29
JPS6241367U (da)	1987-03-12
JPS6350938U (da)	1988-04-06
JPS6281786U (da)	1987-05-25
JPS6371533U (da)	1988-05-13
JPS6329322U (da)	1988-02-26
JPH01122693U (da)	1989-08-21