JPH01126381U - - Google Patents

Info

Publication number
JPH01126381U
JPH01126381U JP1988022768U JP2276888U JPH01126381U JP H01126381 U JPH01126381 U JP H01126381U JP 1988022768 U JP1988022768 U JP 1988022768U JP 2276888 U JP2276888 U JP 2276888U JP H01126381 U JPH01126381 U JP H01126381U
Authority
JP
Japan
Prior art keywords
spool
bonding wire
view
winding
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988022768U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988022768U priority Critical patent/JPH01126381U/ja
Publication of JPH01126381U publication Critical patent/JPH01126381U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の半導体装置のボンデイン
グワイヤ用スプールに、ボンデイングワイヤをク
ロス巻線した巻線スプールを示す概略斜視図、第
２図は、この考案の半導体装置のボンデイングワ
イヤ用スプールの平面図、第３図は、第２図にお
けるＡ―Ａ一部断面図、第４図は、この考案の半
導体装置のボンデイングワイヤ用スプールの別の
実施例の平面図、第５図は、この考案の半導体装
置のボンデイングワイヤ用スプールにボンデイン
グワイヤをクロス巻線した巻線スプールを、ボン
デイングマシンにセツトした概略側面図、第６図
は、従来の半導体装置のボンデイングワイヤ用ス
プールにボンデイングワイヤをクロス巻線した巻
線スプールを示す概略斜視図、第７図は、従来の
クロス巻線したボンデイングワイヤ巻線スプール
をボンデイングマシンにセツトした状態の概略側
面図、第８図は、従来のクロス巻線したボンデイ
ングワイヤ巻線スプールの側面図、である。 １……ボンデイングワイヤ、２……フランジ、
３……接地ターミナル、４……ガラス管、５……
スペーサ、６……スプール、７……支持台、８…
…キヤピラリー、９……半導体チツプ、１０……
リード端子、１１，１１′，１１″……切欠き、
１２……接地導電部、１３……テープ、ａ１……
整列巻線部分、ａ２……クロス巻線部分。

Claims (1)

    【実用新案登録請求の範囲】
  1. スプールの片側または両側フランジ外周部に、
    ２個以上の切欠きを設けたことを特徴とする半導
    体装置のボンデイングワイヤ用スプール。
JP1988022768U 1988-02-23 1988-02-23 Pending JPH01126381U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988022768U JPH01126381U (ja) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988022768U JPH01126381U (ja) 1988-02-23 1988-02-23

Publications (1)

Publication Number Publication Date
JPH01126381U true JPH01126381U (ja) 1989-08-29

Family

ID=31241175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988022768U Pending JPH01126381U (ja) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH01126381U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202300006003A1 (it) * 2023-03-29 2024-09-29 Fast Assembler S R L Bobina per il supporto di fili in materiale polimerico

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202300006003A1 (it) * 2023-03-29 2024-09-29 Fast Assembler S R L Bobina per il supporto di fili in materiale polimerico
WO2024201400A1 (en) * 2023-03-29 2024-10-03 Fast Assembler S.R.L. Spool for the support of wires made of polymeric material

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