JPH011264A - Integrated circuit device cooling equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] The present invention uses a three-dimensional flow with good thermal conductivity inside a flexible structure in order to efficiently cool integrated circuit elements that have a high density and generate a large amount of heat. A porous member having a channel is provided inside, and a sealing structure for sealing the refrigerant is provided between the porous member and the refrigerant passage into which the refrigerant flows, thereby making it possible to improve cooling efficiency.

[Industrial application field]

The present invention relates to an integrated circuit device cooling device that efficiently cools integrated circuit devices that generate a large amount of heat. 2. Description of the Related Art Integrated circuit devices used in the communication and information fields are generating more and more heat due to the required processing speed and miniaturization. On the other hand, the operating temperature of integrated circuit devices is regulated, and therefore, an efficient cooling device for integrated circuit devices is required.

[Conventional technology]

Conventionally, an apparatus having a cooling structure shown in FIG. 5 has been used to cool integrated circuit elements. That is, the integrated circuit element 2 comes into contact with the flexible structure 1, and the flexible structure 1 is cooled, thereby cooling the integrated circuit element 2. In order to cool the flexible structure 1, a refrigerant passage 3 and a refrigerant return path 3-1 are formed.

The refrigerant passes through the refrigerant passage 3 and is injected onto the bottom surface of the flexible structure 1 . A refrigerant distribution device 7 is provided on the back side of the integrated circuit element 2.
is the provision. The refrigerant distribution device 7 has a thousand-knob structure, and a groove is formed on the surface that contacts the integrated circuit element 2, and a manifold is provided for introducing the refrigerant from the refrigerant passage 3 into the groove and returning it to the return path 3-1. Problems to be Solved by the Invention The above-mentioned conventional cooling structure uses a refrigerant and an integrated circuit element, that is,
Heat transfer between the flexible structure and the flexible structure is related to the amount of refrigerant and the bottom area of the flexible structure, so a plurality of two-dimensional grooves are formed on the bottom surface to improve cooling performance. However, the groove is 2
Due to the large size, the time the coolant remains at the bottom surface is short, and there is a problem in that the integrated circuit element is not cooled compared to the amount of coolant.

SUMMARY OF THE INVENTION In view of the above-mentioned conventional situation, an object of the present invention is to provide an integrated circuit device cooling device that efficiently cools an integrated circuit device.

[Means for solving problems]

This invention, as shown in FIG. A seal structure 5 is provided to seal the refrigerant.

[Effect]

The refrigerant that has passed through the refrigerant passage 3 and the nozzle 6 passes through a three-dimensional porous member 4, and the area of the porous member 4 that comes into contact with the refrigerant increases during passage, resulting in a three-dimensional structure that is a good conductor of heat. Heat is efficiently transferred to the shaped porous member 4, and the refrigerant returns from the porous member to the return path 3-1.

Therefore, heat transfer efficiency is improved, the integrated circuit element can be cooled efficiently, and performance can be improved compared to conventional methods using two-dimensional grooves or fins.

〔Example〕

FIG. 1 is a cross-sectional view showing one embodiment of the present invention, where ■ is a flexible structure, 2 is an integrated circuit element, 3 is a refrigerant passage, 4 is a porous member, 5 is a seal structure, and 6 is a nozzle. It is.

The refrigerant passes through refrigerant passages 3 and nozzles 6 and is guided to a porous member 4 within the flexible structure 1. The porous member 4 has a recess 4-1 inside, and the opening 6-1 of the nozzle 6 provided in the refrigerant passage 3 is located in this fourth part 4-1. This porous member 4 is made of metal or ceramic.

It is made of a material with high thermal conductivity such as metal mesh. Of course, as shown in FIG. 2, holes 4-2 may be formed by machining a plate of a high thermal conductivity material such as ceramic, and these may be laminated.

Note that when the flexible structure 1 presses the integrated circuit element 2, the relative displacement between the nozzle 6 and the porous member 4 is absorbed by the seal structure 5 and the nozzle 6 or the slide between the porous member 4. However, in order to improve shielding performance, nozzle 6
It is desirable that the material be made of flexible synthetic resin. This ensures shielding and facilitates pressing of the integrated circuit element.

Although the above-mentioned four parts 4-1 have a cylindrical shape, there is no problem even if the four parts 4-1 are not cylindrical but have a spherical recess 4-3 or a prismatic shape as shown in FIG.

A shield structure 5 is provided between the refrigerant passage 3 and the recess 4-1, that is, on the return path of the refrigerant, for shielding the refrigerant from passing through.

This sealing structure 5 may be made of any material that does not allow the refrigerant to pass through. For example, as shown in FIG. It may be composed of

The refrigerant flowing from the refrigerant passage 3 flows into the fourth part 4-1 and is shielded by the seal structure 5.

As a result, the refrigerant passes through the inside of the porous member 4. This porous member 4 is made of a material with high thermal conductivity, and the area in contact with the refrigerant increases significantly, improving the cooling efficiency of the refrigerant. Of course, the refrigerant that has passed through the porous member 4 returns to the return path 3-1.

〔Effect of the invention〕

As is clear from the above description, the present invention has a simple structure in which a porous structure is inserted into a flexible structure and a seal structure seals the coolant, and an integrated circuit element can be efficiently cooled. Demonstrates extremely effective effects in practice.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the porous structure of the present invention, and FIG. 3 is a four-part shape of the porous structure of the present invention. FIG. 4 is a sectional view showing another embodiment of the sealing structure of the present invention. FIG. 5 is a sectional view showing a conventional cooling structure for an integrated circuit element. In the figure, 1 is a flexible structure, 2 is an integrated circuit element, and 3 is a flexible structure.
4 represents a refrigerant passage, 4 represents a porous member, 5 represents a seal structure, and 6 represents a nozzle. ,/'f Invention Example 1
Okokan example wound man two hσh6σ Fig. 4 1, nrnigo [Yo, 2 hrEJ J tJ '1 901r*l: E-FyTf IN (KJ Lz ■ 5th
figure

Claims (3)

[Claims] (1) The flexible structure (1) presses the integrated circuit element (2), and the refrigerant flows out from the refrigerant passage (3) to the bottom surface of the flexible structure (1), and the integrated circuit element (2) is pressed against the integrated circuit element (2). ) A cooling device for an integrated circuit device, characterized in that a three-dimensional porous member (4) with good thermal conductivity is included in the bottom of the flexible structure (1). (2) The integrated circuit device according to claim 1, characterized in that a seal structure (5) for sealing a refrigerant is provided between the porous member (4) and the refrigerant passage (3). Cooling system. (3) The cooling device for an integrated circuit device according to claim 1, wherein the refrigerant passage (3) is a flexible passage made of a synthetic resin nozzle.