JPH01127247U - - Google Patents

Info

Publication number
JPH01127247U
JPH01127247U JP2396588U JP2396588U JPH01127247U JP H01127247 U JPH01127247 U JP H01127247U JP 2396588 U JP2396588 U JP 2396588U JP 2396588 U JP2396588 U JP 2396588U JP H01127247 U JPH01127247 U JP H01127247U
Authority
JP
Japan
Prior art keywords
leads
package body
pulled out
package
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2396588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2396588U priority Critical patent/JPH01127247U/ja
Publication of JPH01127247U publication Critical patent/JPH01127247U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは本考案の一実施例の側面図、同図b
は正面図、第2図a,bはそれぞれ本考案の他の
実施例の側面図と正面図、第3図a,bはそれぞ
れ従来の半導体装置用パツケージの側面図と正面
図である。 1……パツケージ本体、2,3……突起、4,
5,6……リード。
Figure 1a is a side view of an embodiment of the present invention, Figure 1b is a side view of an embodiment of the present invention.
2A and 2B are a side view and a front view, respectively, of another embodiment of the present invention, and FIGS. 3A and 3B are a side view and a front view, respectively, of a conventional package for a semiconductor device. 1...Package body, 2, 3...Protrusion, 4,
5, 6...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージ本体と、このパツケージ本体の一つ
の側面から一例に並んで垂直方向に外部に引出さ
れ、さらに一体おきに互い違いに斜め方向に曲げ
られたのち、元の垂直方向に曲げられている多数
のリードとを有するジグザグライン型半導体装置
用パツケージにおいて、前記パツケージ本体のリ
ード引出し部のリード間には、前記外部に引出さ
れたリードを互いに所定位置に保持する突起部が
設けられていることを特徴とする半導体装置用パ
ツケージ。
A package body and a large number of leads that are vertically pulled out from one side of the package body, are bent diagonally in alternating directions, and then are bent back to the vertical direction. A package for a zigzag line type semiconductor device, characterized in that protrusions are provided between the leads of the lead drawer portion of the package body to hold the leads pulled out to the outside in predetermined positions. Packages for semiconductor devices.
JP2396588U 1988-02-24 1988-02-24 Pending JPH01127247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2396588U JPH01127247U (en) 1988-02-24 1988-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2396588U JPH01127247U (en) 1988-02-24 1988-02-24

Publications (1)

Publication Number Publication Date
JPH01127247U true JPH01127247U (en) 1989-08-31

Family

ID=31243405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2396588U Pending JPH01127247U (en) 1988-02-24 1988-02-24

Country Status (1)

Country Link
JP (1) JPH01127247U (en)

Similar Documents

Publication Publication Date Title
JPH01127247U (en)
JPS6422046U (en)
JPH0262684U (en)
JPH0227740U (en)
JPS6420746U (en)
JPS63167749U (en)
JPH0456335U (en)
JPH03117846U (en)
JPS6376676U (en)
JPS6377358U (en)
JPH0267659U (en)
JPS6447056U (en)
JPS6424852U (en)
JPH01129845U (en)
JPH0477262U (en)
JPH0320497U (en)
JPH0330438U (en)
JPH0233450U (en)
JPS63191651U (en)
JPS6262445U (en)
JPH0334243U (en)
JPS63167750U (en)
JPH01140844U (en)
JPH0158944U (en)
JPH01108949U (en)