JPH0330438U - - Google Patents
Info
- Publication number
- JPH0330438U JPH0330438U JP1989091267U JP9126789U JPH0330438U JP H0330438 U JPH0330438 U JP H0330438U JP 1989091267 U JP1989091267 U JP 1989091267U JP 9126789 U JP9126789 U JP 9126789U JP H0330438 U JPH0330438 U JP H0330438U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- semiconductor device
- view
- easily charged
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す半導体装置の
斜視図、第２図は第１図−線における断面図
、第３図第４図は本考案の他の実施例を示す斜視
図、第５図は従来の半導体装置の斜視図、第６図
は第５図−線における断面図である。
図において、１……半導体素子、２……フレー
ム、３……接合材、４……端子、５……リード線
、６……樹脂パツケージ、７……帯電しやすい材
料を示す。なお、図中、同一符号は同一、または
相当部分を示す。
FIG. 1 is a perspective view of a semiconductor device showing one embodiment of the present invention, FIG. 2 is a sectional view taken along the line shown in FIG. 1, FIG. 3 is a perspective view showing another embodiment of the present invention, FIG. 5 is a perspective view of a conventional semiconductor device, and FIG. 6 is a sectional view taken along the line shown in FIG. In the figure, 1...semiconductor element, 2...frame, 3...bonding material, 4...terminal, 5...lead wire, 6...resin package, 7...material that is easily charged. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
置に於いて、前記樹脂パツケージの表面又は裏面
もしくはその両面に帯電しやすい材料を形成した
ことを特徴とする半導体装置。 1. A semiconductor device comprising a semiconductor element packaged in a resin package, characterized in that a material that is easily charged is formed on the front surface, the back surface, or both surfaces of the resin package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091267U JPH0330438U (en) | 1989-08-01 | 1989-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091267U JPH0330438U (en) | 1989-08-01 | 1989-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330438U true JPH0330438U (en) | 1991-03-26 |
Family
ID=31640763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091267U Pending JPH0330438U (en) | 1989-08-01 | 1989-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330438U (en) |
-
1989
- 1989-08-01 JP JP1989091267U patent/JPH0330438U/ja active Pending