JPH01127249U - - Google Patents

Info

Publication number
JPH01127249U
JPH01127249U JP1988023466U JP2346688U JPH01127249U JP H01127249 U JPH01127249 U JP H01127249U JP 1988023466 U JP1988023466 U JP 1988023466U JP 2346688 U JP2346688 U JP 2346688U JP H01127249 U JPH01127249 U JP H01127249U
Authority
JP
Japan
Prior art keywords
sealed
resin case
terminal
transparent resin
optical transmitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988023466U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988023466U priority Critical patent/JPH01127249U/ja
Publication of JPH01127249U publication Critical patent/JPH01127249U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係る光送受信ユニツトの縦
断正面図、第２図は同上の縦断側面図、第３図乃
至第６図は従来の光送受信ユニツトを示し、第３
図は正面図、第４図は第３図の縦断側面図、第５
図は縦断正面図、第６図は第５図の縦断側面図で
ある。 １……光送受信回路、６……端子、７……内ケ
ース、８……透明樹脂ケース、９……くびれ部、
１０……凹凸。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 光送受信回路の全体をモールド成形された
    透明樹脂ケースで封止し、その透明樹脂ケースの
    外側に上記回路の端子を引出した光送受信ユニツ
    トにおいて、前記透明樹脂ケース内に位置する端
    子の周囲部を、線膨張係数が端子の線膨張係数に
    近く、透明樹脂ケースの線膨張係数より小さい合
    成樹脂から成る内ケースで封止したことを特徴と
    する光送受信ユニツト。 (2) 前記端子の内ケースによつて封止された部
    分にくびれ部を設けた請求項(1)記載の光送受信
    ユニツト。 (3) 前記内ケースの表面に凹凸を設けた請求項(
    1)又は(2)記載の光送受信ユニツト。
JP1988023466U 1988-02-23 1988-02-23 Pending JPH01127249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988023466U JPH01127249U (ja) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988023466U JPH01127249U (ja) 1988-02-23 1988-02-23

Publications (1)

Publication Number Publication Date
JPH01127249U true JPH01127249U (ja) 1989-08-31

Family

ID=31242480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988023466U Pending JPH01127249U (ja) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH01127249U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025005057A1 (ja) * 2023-06-30 2025-01-02 エドワーズ株式会社 真空ポンプ及びハーメチックコネクタ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025005057A1 (ja) * 2023-06-30 2025-01-02 エドワーズ株式会社 真空ポンプ及びハーメチックコネクタ
JP2025007009A (ja) * 2023-06-30 2025-01-17 エドワーズ株式会社 真空ポンプ及びハーメチックコネクタ

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