JPH0163140U - - Google Patents
Info
- Publication number
- JPH0163140U JPH0163140U JP1987157980U JP15798087U JPH0163140U JP H0163140 U JPH0163140 U JP H0163140U JP 1987157980 U JP1987157980 U JP 1987157980U JP 15798087 U JP15798087 U JP 15798087U JP H0163140 U JPH0163140 U JP H0163140U
- Authority
- JP
- Japan
- Prior art keywords
- envelope
- optical semiconductor
- semiconductor device
- lens
- concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の一実施例を示す断面図、第2
図は本考案の他の実施例を示す断面図、第3図は
本考案のさらに他の実施例を示す断面図、第4図
および第5図はそれぞれ異なる従来例を示す断面
図である。 1…受光素子、2…リードフレーム、4…透光
性樹脂、6…落し込み部、7…発光素子、8…レ
ンズ。
図は本考案の他の実施例を示す断面図、第3図は
本考案のさらに他の実施例を示す断面図、第4図
および第5図はそれぞれ異なる従来例を示す断面
図である。 1…受光素子、2…リードフレーム、4…透光
性樹脂、6…落し込み部、7…発光素子、8…レ
ンズ。
Claims (1)
- 【実用新案登録請求の範囲】 1 光半導体素子を透光性樹脂外囲器で被覆して
なる光半導体装置において、上記外囲器の前面を
外側より凹状に落し込んだ形状にしかつ上記外囲
器の外面を粗面状にしたことを特徴とする光半導
体装置。 2 上記外囲器の落し込み部の底面がレンズ状に
なされたことを特徴とする実用新案登録請求の範
囲第1項記載の光半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157980U JPH0163140U (ja) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157980U JPH0163140U (ja) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163140U true JPH0163140U (ja) | 1989-04-24 |
Family
ID=31437898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987157980U Pending JPH0163140U (ja) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163140U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (ja) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | 発光装置および照明装置 |
| JP2018190861A (ja) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | 光学装置 |
-
1987
- 1987-10-15 JP JP1987157980U patent/JPH0163140U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (ja) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | 発光装置および照明装置 |
| JP2018190861A (ja) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | 光学装置 |