JPH01127258U - - Google Patents

Info

Publication number
JPH01127258U
JPH01127258U JP1988022885U JP2288588U JPH01127258U JP H01127258 U JPH01127258 U JP H01127258U JP 1988022885 U JP1988022885 U JP 1988022885U JP 2288588 U JP2288588 U JP 2288588U JP H01127258 U JPH01127258 U JP H01127258U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
bonding line
sealed semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988022885U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988022885U priority Critical patent/JPH01127258U/ja
Publication of JPH01127258U publication Critical patent/JPH01127258U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る樹脂封止型半導体装置の
第１の実施例を示す断面図、第２図は本考案によ
る第２の実施例を示す断面図、第３図は従来にお
ける半導体装置の断面図である。 １，１１，２１…半導体素子、２，１２，２２
…ボンデイング線、３，１３，２３…負電位リー
ド、４，１４，２４…正電位リード、５，１５，
２５…樹脂、１６…金属片。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止型半導体装置に於いて、半導体素子か
    らのボンデイング線が接続されるリードの、前記
    ボンデイング線との接続点の樹脂内に位置する部
    分に凸形状部を設けたことを特徴とする樹脂封止
    型半導体装置。
JP1988022885U 1988-02-23 1988-02-23 Pending JPH01127258U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988022885U JPH01127258U (ja) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988022885U JPH01127258U (ja) 1988-02-23 1988-02-23

Publications (1)

Publication Number Publication Date
JPH01127258U true JPH01127258U (ja) 1989-08-31

Family

ID=31241400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988022885U Pending JPH01127258U (ja) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH01127258U (ja)

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