JPH01128882A - Portable medium - Google Patents

Abstract

PURPOSE: To upgrade the uniformity of card thickness and improving reliability through increasing durability to an externally inflicted force and further, dispensing with the working of a projecting part on an outer plate to reduce a manufacturing cost by filling a void part in an outer enclosure part to be formed in an area other than an area for internally mounting electronic parts, using a filling plate. CONSTITUTION: The peripheral parts of two outer plates 1, 2 are joined with an outer framework 3 by holding a wiring board 4 on which electronic parts or the link are mounted and a filling plate 11 which is set against the wiring board 4 between the outer plates 1, 2. After that, an outer enclosure is sandwiched between two templates spaced from each other as specified, so that the thickness of the outer enclosure is constant. An adhesive which is poured properly into the outer enclosure held in the described state becomes cured. In this case, the filling plate 11 is assembled into the void part inside the outer enclosure, so that a molding sink to be generated in the outer plates 1, 2 following the curing process is prevented from occurring. Thus the thickness of an IC card is made uniform. In addition, when using the IC card, a dent is prevented from being generated by the interposition of the filling plate 11 when an externally inflicted force is applied in the thickness direction. Thus it is possible to improve the durability against the externally inflicted force.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to a portable medium such as an IC card.

(Prior art) To explain a portable medium using an IC card as an example, I
A C card has a card-shaped outer casing with a pair of outer plates made of stainless steel or the like attached to an outer frame.
LSI chips and liquid crystal display boards (which make up PU and memory)
Necessary electronic components including an LCD (hereinafter referred to as an LCD) are mounted and installed on a wiring board. Behind the above electronic parts LC
The display section D is functionally installed so that it can be exposed to the outside through a window opened in one of the outer panels. Further, the outer plate portion is provided with contacts for transmitting and receiving required data to and from external devices such as readers/writers.

According to the 180 (International Organization for Standardization) standard, the thickness of an IC card is defined as 0.76 mm, and the vertical and horizontal dimensions are also defined as predetermined dimensions.

For this reason, a very thin wiring board is used, and a gap is created between the wiring board and the outer panel in areas other than the internal parts of the electronic component, but in conventional IC cards, These voids were either left as they were, filled with resin, or even provided with protrusions corresponding to the voids on the outer panel to prevent the formation of voids.

(Problems to be Solved by the Invention) In the conventional example in which the gap between the wiring board and the outer panel in areas other than the interior area of the electronic component is left as is, dents are likely to occur due to external force. Another problem was that it was easy to bend.

In addition, in the case where resin is filled into the gap, it is relatively difficult to control the thickness during filling, and a curing process is required.Furthermore, when the resin filled in the LCD joints hardens, the card There is a problem in that when an external force that causes deformation of the entire display is applied, the joint may come off and the LCD may be damaged.

Furthermore, in the case where a convex portion corresponding to the void is provided on the outer panel, there is a problem in that the cost is high due to the machining of the convex portion.

This invention was made based on the above-mentioned circumstances, and it is easy to control the thickness during manufacturing, improves the uniformity of card thickness, and increases durability against external forces to improve reliability.
Furthermore, it is an object of the present invention to provide a portable medium that does not require the processing of convex portions on the outer panel and can reduce costs.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a portable medium comprising a card-like outer casing with required electronic components. The gist is that a void in the outer casing formed in a portion other than the interior portion of the housing is filled with a filling plate.

(Function) Since the voids in the outer casing that are formed in areas other than the internal parts of the electronic component are filled with the filler plate, thickness control during manufacturing is facilitated and the uniformity of card thickness is improved. . In addition, by interposing the filling plate in the gap, durability against external forces is increased and reliability is improved.

(Example) Hereinafter, an example of the present invention will be described based on FIGS. 1 and 2. This embodiment is applied to a ■C card having multiple functions.

First, to explain the structure of an LC card as a portable medium, in FIGS. 1 and 2, 3 is an outer frame, and a pair of stainless steel outer plates 1.2 are provided on both sides of the outer frame 3. They are joined together to form a card-shaped outer casing. 4 has a thickness of 20
It is a wiring board of about 0 μm, and the wiring board 4 has a CPU
Electronic components such as LSI chips 5a, 5b, batteries 6, chip resistors 7a, 7b, and LCD 8 constituting memories and the like are mounted, and each electronic component is housed in the outer casing in such a mounted state. Among these electronic components, LC
Functionally, the display section of D8 is installed so that it can be exposed to the outside through a window section opened in the outer panel 2. Further, contacts 9 for transmitting and receiving required data to and from an external device such as a reader/writer are attached to the wiring board 4, and these contacts 9 are also exposed to the outside through a window in the outer panel.

As shown in FIG. 2, the wiring board 4 is in contact with the inner surface of one of the outer panels 1, so that the wiring board 4 is in contact with the inner surface of the outer panel 1, so that the inner surface of the outer panel 1 is connected to the other outer panel 2. A gap is created between the filling plate 11 and the filling plate 11.
The filling plate 11 is made of glass epoxy, for example, and has a thickness of about 300 μm.
The LSI chip 5a15b is resin molded, and a frame for this resin mold is integrally formed with the filling plate 11. The portions of the filling plate 11 that come into contact with the wiring board 4 and the outer panel 2 are bonded together with an adhesive.

In the portable medium configured as described above, during the manufacturing process, the wiring board 4 on which electronic components etc. are mounted and the filling plate 11 that is in contact with the wiring board 4 are placed between the two outer panels 1.2. The peripheral edges of both outer panels 1.2 are joined to the outer frame 3 so as to be sandwiched between them, and then the outer casing is sandwiched between the two templates at a specified interval so that its thickness remains constant. The adhesive appropriately poured into the outer casing is cured while the housing is held in place. At this time, the filling plate 1 is filled in the cavity inside the outer casing.
1 is incorporated, "sinking" of both outer roots 1.2 due to hardening is prevented, and uniformity in the thickness of the IC card is achieved.

Also, during use, even if subjected to external force in the thickness direction,
By interposing the filling plate 11, the external force is prevented from causing a dent, and most of the external force is received by the filling plate 11, which functions as a spacer, reducing the external force applied to the internal electronic components. Improved durability against

[Effects of the Invention] As explained above, according to the present invention, since the void in the outer casing formed in the part other than the interior part of the electronic component is filled with the filling plate, the thickness at the time of manufacture is reduced. It is easier to manage and improve the uniformity of card thickness.
Further, there is an advantage that durability against external forces is increased and reliability can be improved. Furthermore, since it is not necessary to process a convex part on the outer panel to prevent the formation of voids, it is possible to reduce costs.

[Brief explanation of the drawing]

FIG. 1 is a dimensional plan view of an embodiment of a portable medium according to the present invention with the outer panel removed, and FIG. 2 is an enlarged sectional view taken along line II--II in FIG. 1.2: Outer plate forming an outer casing together with the outer frame, 3: Outer frame, 4: Wiring board, 5 a, 5 a: LSI chip, 6:
Battery, 7a17b: Chip resistor, 8: LCD
. 11: Filling plate. r゛, Buried J1 Buried Yasuo Futoshi

Claims (2)

[Claims] (1) In a portable medium consisting of a card-shaped outer casing with required electronic components inside, the voids in the outer casing that are formed in areas other than the internal parts of the electronic components are filled with a filling plate. A portable medium featuring: (2) The portable medium according to claim 1, wherein the filling plate is formed with a resin molding frame for the electronic component that requires a resin mold.