JPH01130557U - - Google Patents

Info

Publication number
JPH01130557U
JPH01130557U JP1988025990U JP2599088U JPH01130557U JP H01130557 U JPH01130557 U JP H01130557U JP 1988025990 U JP1988025990 U JP 1988025990U JP 2599088 U JP2599088 U JP 2599088U JP H01130557 U JPH01130557 U JP H01130557U
Authority
JP
Japan
Prior art keywords
external lead
bent
extension part
lead
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988025990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0720923Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988025990U priority Critical patent/JPH0720923Y2/ja
Publication of JPH01130557U publication Critical patent/JPH01130557U/ja
Application granted granted Critical
Publication of JPH0720923Y2 publication Critical patent/JPH0720923Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988025990U 1988-03-01 1988-03-01 電子部品 Expired - Lifetime JPH0720923Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988025990U JPH0720923Y2 (ja) 1988-03-01 1988-03-01 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988025990U JPH0720923Y2 (ja) 1988-03-01 1988-03-01 電子部品

Publications (2)

Publication Number Publication Date
JPH01130557U true JPH01130557U (mo) 1989-09-05
JPH0720923Y2 JPH0720923Y2 (ja) 1995-05-15

Family

ID=31247206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988025990U Expired - Lifetime JPH0720923Y2 (ja) 1988-03-01 1988-03-01 電子部品

Country Status (1)

Country Link
JP (1) JPH0720923Y2 (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
JP2023068517A (ja) * 2021-11-02 2023-05-17 ニデックパワートレインシステムズ株式会社 リード部材の回路基板へのはんだ接合構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414162U (mo) * 1977-06-30 1979-01-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414162U (mo) * 1977-06-30 1979-01-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
JP2023068517A (ja) * 2021-11-02 2023-05-17 ニデックパワートレインシステムズ株式会社 リード部材の回路基板へのはんだ接合構造

Also Published As

Publication number Publication date
JPH0720923Y2 (ja) 1995-05-15

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