JPH01132120U - - Google Patents
Info
- Publication number
- JPH01132120U JPH01132120U JP2802888U JP2802888U JPH01132120U JP H01132120 U JPH01132120 U JP H01132120U JP 2802888 U JP2802888 U JP 2802888U JP 2802888 U JP2802888 U JP 2802888U JP H01132120 U JPH01132120 U JP H01132120U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- electronic component
- mounting
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例に係る電子部品の実
装構造を示す正断面図、第２図は従来の圧電部品
の構造を示す斜視図、第３図は本考案の背景とな
る電子部品の構造を示す分解斜視図、第４図は第
３図に示した電子部品の組立状態を示す正断面図
、第５図及び第６図はそれぞれ第４図に示した電
子部品の回路基板への取付構造を示す正断面図で
ある。
符号の説明、７…圧電部品、８…取付基板、９
ａ，９ｂ…基板電極、１０…圧電素子、１３…枠
体、１４…蓋板（絶縁性カバー）、１５…回路基
板、１６…回路基板電極、１８…半田、ｈ，Ｈ…
背高。
FIG. 1 is a front cross-sectional view showing the mounting structure of an electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of a conventional piezoelectric component, and FIG. 3 is an electronic component that is the background of the present invention. 4 is a front sectional view showing the assembled state of the electronic components shown in FIG. 3, and FIGS. 5 and 6 are exploded perspective views showing the structure of the electronic components shown in FIG. 4. FIG. 3 is a front sectional view showing the mounting structure. Explanation of symbols, 7... Piezoelectric component, 8... Mounting board, 9
a, 9b... Board electrode, 10... Piezoelectric element, 13... Frame, 14... Lid plate (insulating cover), 15... Circuit board, 16... Circuit board electrode, 18... Solder, h, H...
Tall.
Claims (1)
この基板電極に接続される圧電素子を内蔵した絶
縁性カバーが取り付けられてなる電子部品を回路
基板に実装するための構造において、 上記電子部品をその取付基板の基板電極側が回
路基板の表面に対向するように回路基板上に載置
し、この回路基板上の回路基板電極と基板電極と
を電気的に接合してなることを特徴とする電子部
品の実装構造。[Claims for Utility Model Registration] On the board electrode formed on one side of the mounting board,
In a structure for mounting an electronic component on a circuit board, in which an insulating cover containing a piezoelectric element connected to the board electrode is attached, the electronic component is mounted so that the board electrode side of the mounting board faces the surface of the circuit board. A mounting structure for an electronic component, characterized in that the electronic component is placed on a circuit board so that the electronic component is mounted on the circuit board, and the circuit board electrode on the circuit board and the board electrode are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988028028U JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988028028U JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01132120U true JPH01132120U (en) | 1989-09-07 |
| JPH0746978Y2 JPH0746978Y2 (en) | 1995-10-25 |
Family
ID=31251039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988028028U Expired - Lifetime JPH0746978Y2 (en) | 1988-03-01 | 1988-03-01 | Electronic component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0746978Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5371597A (en) * | 1976-12-08 | 1978-06-26 | Seiko Instr & Electronics Ltd | Structure and fixing method for ceramic sealed crystal unit |
| JPS60141129U (en) * | 1984-02-29 | 1985-09-18 | 富士通株式会社 | Terminal structure of leadless chip carrier |
| JPS61164002U (en) * | 1985-03-29 | 1986-10-11 | ||
| JPS62126836U (en) * | 1986-01-31 | 1987-08-12 |
-
1988
- 1988-03-01 JP JP1988028028U patent/JPH0746978Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5371597A (en) * | 1976-12-08 | 1978-06-26 | Seiko Instr & Electronics Ltd | Structure and fixing method for ceramic sealed crystal unit |
| JPS60141129U (en) * | 1984-02-29 | 1985-09-18 | 富士通株式会社 | Terminal structure of leadless chip carrier |
| JPS61164002U (en) * | 1985-03-29 | 1986-10-11 | ||
| JPS62126836U (en) * | 1986-01-31 | 1987-08-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0746978Y2 (en) | 1995-10-25 |