JPH01133736U - - Google Patents
Info
- Publication number
- JPH01133736U JPH01133736U JP1988030140U JP3014088U JPH01133736U JP H01133736 U JPH01133736 U JP H01133736U JP 1988030140 U JP1988030140 U JP 1988030140U JP 3014088 U JP3014088 U JP 3014088U JP H01133736 U JPH01133736 U JP H01133736U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- approximately
- insulating film
- semiconductor element
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030140U JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030140U JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01133736U true JPH01133736U (2) | 1989-09-12 |
| JPH0625960Y2 JPH0625960Y2 (ja) | 1994-07-06 |
Family
ID=31254939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988030140U Expired - Lifetime JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625960Y2 (2) |
-
1988
- 1988-03-07 JP JP1988030140U patent/JPH0625960Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625960Y2 (ja) | 1994-07-06 |
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