JPH0113417Y2 - - Google Patents
Info
- Publication number
- JPH0113417Y2 JPH0113417Y2 JP989082U JP989082U JPH0113417Y2 JP H0113417 Y2 JPH0113417 Y2 JP H0113417Y2 JP 989082 U JP989082 U JP 989082U JP 989082 U JP989082 U JP 989082U JP H0113417 Y2 JPH0113417 Y2 JP H0113417Y2
- Authority
- JP
- Japan
- Prior art keywords
- anode
- molded body
- wire
- conductive molded
- anode wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 238000004898 kneading Methods 0.000 claims 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Fuses (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案は保安機能を備えた固体電解コンデンサ
に関する。[Detailed Description of the Invention] The present invention relates to a solid electrolytic capacitor with a safety function.
従来この種のコンデンサの構造としては第1図
に示すように弁作用を有する陽極線1を植立し弁
作用を有する金属粉末を成形焼結してなるコンデ
ンサ素子2の前記陽極線1に陽極リード線3を接
続し、つぎにあらかじめ陰極リード線4に接続し
てあるヒユーズ5をコンデンサ素子2にハンダ6
付けし、しかるのち外装(図示せず)を施してな
るものである。 Conventionally, the structure of this type of capacitor is as shown in FIG. 1, in which an anode wire 1 having a valve action is planted and a capacitor element 2 is formed by molding and sintering metal powder having a valve action. Connect the lead wire 3, and then connect the fuse 5, which was previously connected to the cathode lead wire 4, to the capacitor element 2 with solder 6.
After that, an exterior (not shown) is applied.
しかしながら上記のような構成になる固体電解
コンデンサによればコンデンサ素子2にヒユーズ
5をハンダ6付けする場合の加熱が陰極リード線
を直接ハンダ付けする場合より素子に対して悪影
響を及ぼし漏れ電流特性を劣化させると同時にヒ
ユーズ5をコンデンサ素子2に確実に接続するこ
とはきわめて困難であり実用的でないなどの欠点
を有していた。 However, with the solid electrolytic capacitor configured as described above, the heating when the fuse 5 is soldered 6 to the capacitor element 2 has a worse effect on the element than when the cathode lead wire is directly soldered, and the leakage current characteristics are deteriorated. It is extremely difficult to reliably connect the fuse 5 to the capacitor element 2 at the same time that the fuse 5 is deteriorated, and has the disadvantage that it is not practical.
本考案は上記のような点に鑑みてなされたもの
で陽極線と陽極リード線間にヒユーズ機能をもつ
導電性成形体を配設することによつて特性良好に
して短絡電流発生時確実に保安機能を発揮する固
体電解コンデンサを提供することを目的とするも
のである。 The present invention was developed in view of the above points, and by arranging a conductive molded body with a fuse function between the anode wire and the anode lead wire, the characteristics are improved and safety is ensured when a short circuit current occurs. The purpose is to provide a solid electrolytic capacitor that performs its functions.
以下本考案の一実施例につき図面を参照して説
明する。すなわち第2図に示すように弁作用を有
する陽極線11を植立し例えばタンタル、ニオ
ブ、アルミニウムなどの弁作用を有する金属粉末
を成形焼結して陽極体を形成し該陽極体の表面に
酸化皮膜層さらにその表面に二酸化マンガンなど
の半導体酸化物層、カーボンなどのグラフアイト
層および金属導電層を順次積層形成したコンデン
サ素子12に陰極リード線13を接続する。つぎ
に前記陽極線11周囲に該陽極線11を貫通して
例えばテフロン、合成樹脂またはゴムなどからな
る絶縁板14を配設し、該絶縁板14上に第3図
A,Bに示すように略中心部に陽極線嵌合孔15
を形成した導電性成形体16を配設する。該導電
性成形体16は例えばBi,Pb,Sn,Cd,In,
Zn,Sbなどの2元素以上の多元素合金の共晶あ
るいは共晶付近の組合せをもつ融点の低いいわゆ
る可融合金に該可融合金よりも高い融点をもつ例
えばフエノール、エポキシ、ポリエステル系など
の熱硬化性樹脂あるいはそれらに例えばタルク、
シリカ、アルミナなどの充填剤を加えたもの、ま
たは例えばポリエチレン、ポリアミド、ポリイミ
ド、フツ素、けい素、ポリフエニレンサルフアイ
ド、フツ化エチレン系などの熱可塑性樹脂、それ
らに例えばタルク、シリカ、アルミナなどの充填
剤を加えたもの、あるいは例えばフツ素、シリコ
ン、ブタジエン系などの合成ゴムからなるプラス
チツク材料を練り込んだものから構成している。
しかして前記陽極線11の前記絶縁板14上面か
らの突出部を前記陽極線嵌合孔15に嵌合し前記
導電性成形体16を加熱し該導電性成形体16を
構成する樹脂の熱収縮を利用し陽極線11と導電
性成形体16とを一体固着したのち該導電性成形
体16表面に陽極リード線17を接続し、しかる
のち外装樹脂18を施してなるものである。 An embodiment of the present invention will be described below with reference to the drawings. That is, as shown in FIG. 2, an anode wire 11 having a valve action is planted, and a metal powder having a valve action, such as tantalum, niobium, or aluminum, is molded and sintered to form an anode body. A cathode lead wire 13 is connected to a capacitor element 12 in which an oxide film layer, a semiconductor oxide layer such as manganese dioxide, a graphite layer such as carbon, and a metal conductive layer are successively laminated on the surface thereof. Next, an insulating plate 14 made of, for example, Teflon, synthetic resin, or rubber is placed around the anode wire 11, passing through the anode wire 11, and placed on the insulating plate 14 as shown in FIGS. 3A and 3B. Anode wire fitting hole 15 approximately in the center
A conductive molded body 16 having a formed thereon is disposed. The conductive molded body 16 is made of, for example, Bi, Pb, Sn, Cd, In,
In addition to so-called fusible alloys with low melting points that have eutectic or near-eutectic combinations of multi-element alloys of two or more elements such as Zn and Sb, for example, phenols, epoxies, polyesters, etc., which have higher melting points than the fusible alloys. Thermosetting resins or them, such as talc,
Added fillers such as silica and alumina, or thermoplastic resins such as polyethylene, polyamide, polyimide, fluorine, silicon, polyphenylene sulfide, and ethylene fluoride, such as talc, silica, alumina, etc. It is made of a plastic material containing fillers such as, for example, or kneaded with a plastic material made of synthetic rubber such as fluorine, silicone, or butadiene.
Then, the protrusion of the anode wire 11 from the upper surface of the insulating plate 14 is fitted into the anode wire fitting hole 15, and the conductive molded body 16 is heated, causing the resin constituting the conductive molded body 16 to undergo thermal contraction. After the anode wire 11 and the conductive molded body 16 are integrally fixed using a method, an anode lead wire 17 is connected to the surface of the conductive molded body 16, and then an exterior resin 18 is applied.
以上のように構成してなる固体電解コンデンサ
を使用中短絡電流が流れた場合コンデンサ素子1
2が発熱しそれによつて陽極線11と陽極リード
線17間に介在している導電性成形体16を構成
している可融合金が溶融し、その結果少なくとも
導電性成形体16の外層に存在する可融合金は押
し出され、導電性成形体16は原形をとどめては
いるものの導電性は喪失し単なる絶縁体化してし
まい、陽極線11と陽極リード線17は電気的に
遮断されることになり回路から開放される。また
従来のようにヒユーズを直接コンデンサ素子にハ
ンダ付けすることがないため必要以上にコンデン
サ素子12を加熱する必要はなく熱による漏れ電
流特性を劣化させることはないなどの利点を有す
る。 When a short-circuit current flows through the solid electrolytic capacitor configured as above while using the solid electrolytic capacitor, capacitor element 1
2 generates heat, thereby melting the fusible metal that constitutes the conductive molded body 16 interposed between the anode wire 11 and the anode lead wire 17, and as a result, the molten metal present in at least the outer layer of the conductive molded body 16 melts. The molten metal is extruded, and although the conductive molded body 16 retains its original shape, it loses its conductivity and becomes a mere insulator, and the anode wire 11 and the anode lead wire 17 are electrically cut off. It is released from the circuit. Further, since the fuse is not soldered directly to the capacitor element as in the conventional method, there is no need to heat the capacitor element 12 more than necessary, and there is an advantage that leakage current characteristics due to heat are not deteriorated.
つぎに第2図に示す本考案aと第1図に示す従
来例bにおける漏れ電流特性比較を第4図によつ
て説明する。すなわち第4図は定格20V.DC−
4.7μFのタンタル固体電解コンデンサによる本考
案aと従来例bのa,bそれぞれ試料50個の漏れ
電流特性状況を示したものである。なお本考案a
における導電性成形体はSn67.75% Cd32.25%の
可融合金にシリコンゴムを練り合わせたものを用
いた。第3図から本考案aは平均値およびバラツ
キが小さいのに対して従来例bは平均値およびバ
ラツキも大きく、本考案aが漏れ電流特性改善に
大きく貢献していることを示している。なお上記
実施例ではリード線同一方向形で外装として樹脂
外装に限定して説明したがケース外装構造に適用
しても同効であり、さらにはリード線反対方向形
に適用できることは言うまでもない。 Next, a comparison of leakage current characteristics between the present invention a shown in FIG. 2 and the conventional example b shown in FIG. 1 will be explained with reference to FIG. In other words, Figure 4 shows the rating of 20V.DC-
This figure shows the leakage current characteristics of 50 samples each of a and b of the present invention a and conventional example b using 4.7μF tantalum solid electrolytic capacitors. Furthermore, this invention a
The conductive molded body used was a mixture of silicone rubber and a fusible alloy containing 67.75% Sn and 32.25% Cd. As can be seen from FIG. 3, the present invention a has a small average value and variation, whereas the conventional example b has a large average value and variation, indicating that the present invention a greatly contributes to the improvement of leakage current characteristics. In the above embodiment, the explanation was limited to a case where the lead wires run in the same direction and a resin sheath as the exterior, but it goes without saying that the present invention is equally effective when applied to a case exterior structure, and can also be applied to a case where the lead wires run in opposite directions.
以上述べたように本考案によれば陽極線と陽極
リード線間にヒユーズ機能をもつ可融合金と該可
融合金より高い融点をもつプラスチツク材料を練
り込んだ導電性成形体を配設した構造にすること
によつて漏れ電流特性良好にして短絡電流発生時
確実に保安機能を発揮できる固体電解コンデンサ
を得ることができる。 As described above, according to the present invention, a conductive molded body in which a fusible alloy having a fuse function and a plastic material having a higher melting point than the fusible alloy is disposed between the anode wire and the anode lead wire. By doing so, it is possible to obtain a solid electrolytic capacitor that has good leakage current characteristics and can reliably perform the safety function when a short circuit current occurs.
第1図は従来例に係る固体電解コンデンサを示
す断面図、第2図は本考案の一実施例に係る固体
電解コンデンサを示す断面図、第3図A,Bは第
2図に示す固体電解コンデンサを構成する導電性
成形体に係りAは斜視図、Bはイ−ロ断面図、第
4図は本考案と従来例の漏れ電流特性比較図であ
る。
11……陽極線、12……コンデンサ素子、1
3……陰極リード線、14……絶縁板、16……
導電性成形体、17……陽極リード線。
FIG. 1 is a sectional view showing a solid electrolytic capacitor according to a conventional example, FIG. 2 is a sectional view showing a solid electrolytic capacitor according to an embodiment of the present invention, and FIGS. A is a perspective view, B is a sectional view taken along the line A, and FIG. 4 is a comparison diagram of the leakage current characteristics of the present invention and a conventional example of the conductive molded body constituting the capacitor. 11... Anode wire, 12... Capacitor element, 1
3... Cathode lead wire, 14... Insulating plate, 16...
Conductive molded body, 17... Anode lead wire.
Claims (1)
と、前記陽極線周囲に該陽極線を貫通し配設した
絶縁板と、該絶縁板上に前記陽極線突出部と一体
固着して配設した可融合金と該可融合金より高い
融点をもつプラスチツク材料を練り込んで成形し
た導電性成形体と、該導電性成形体と接続した陽
極リード線と、前記コンデンサ素子に接続した陰
極リード線とを具備してなる固体電解コンデン
サ。 a capacitor element in which an anode wire is planted and molded and sintered; an insulating plate disposed around the anode wire through the anode wire; and an insulating plate disposed integrally with the anode wire protrusion on the insulating plate. A conductive molded body formed by kneading a fusible metal and a plastic material having a higher melting point than the fusible metal, an anode lead wire connected to the conductive molded body, and a cathode lead wire connected to the capacitor element. A solid electrolytic capacitor equipped with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP989082U JPS58111924U (en) | 1982-01-26 | 1982-01-26 | solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP989082U JPS58111924U (en) | 1982-01-26 | 1982-01-26 | solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58111924U JPS58111924U (en) | 1983-07-30 |
| JPH0113417Y2 true JPH0113417Y2 (en) | 1989-04-19 |
Family
ID=30022498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP989082U Granted JPS58111924U (en) | 1982-01-26 | 1982-01-26 | solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58111924U (en) |
-
1982
- 1982-01-26 JP JP989082U patent/JPS58111924U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58111924U (en) | 1983-07-30 |
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