JPH0113420B2 - - Google Patents
Info
- Publication number
- JPH0113420B2 JPH0113420B2 JP12959081A JP12959081A JPH0113420B2 JP H0113420 B2 JPH0113420 B2 JP H0113420B2 JP 12959081 A JP12959081 A JP 12959081A JP 12959081 A JP12959081 A JP 12959081A JP H0113420 B2 JPH0113420 B2 JP H0113420B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- copper
- paper
- epoxy resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000004593 Epoxy Substances 0.000 claims description 16
- 239000004014 plasticizer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000000123 paper Substances 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000003063 flame retardant Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
本発明は、耐熱性、耐ミーズリング性、耐溶剤
性等に優れ、しかも加工性および難燃性の良好な
銅張積層板に関する。
エポキシ樹脂銅張積層板やフエノール樹脂銅張
積層板は、各種産業に需要が多く、特に最近は、
宇宙機器、大型、中型、小型のコンピユータ、マ
イクロコンピユータ、無線応用機器、工業計測機
器、医療用機器等への需要が拡大しつつある。
これらの中でも紙を基材として使用する紙―エ
ポキシ銅張積層板においては、孔あけ加工の際、
ドリル穿孔と共に設備経費が安くミスの少ない打
抜加工の方法が用いられているが、樹脂の硬化状
態が良すぎる場合には、この方法では、かなり高
温で打ち抜かなければならず、作業性が悪いばか
りでなく、その際、板の反りや寸法収縮による精
度の低下をまねくという問題があつた。
また、この紙―エポキシ積層板は、NEMAグ
レードがFR―３（難燃性の紙―エポキシ積層板）
であるため、充分な難燃性を有することが要求さ
れていた。
本発明はこれらの問題を解決するためになされ
たもので、エポキシ樹脂100重量部に対して10〜
50重量部のエポキシ系可塑剤と硬化剤、およびそ
の他の添加剤を配合したエポキシ樹脂組成物を、
基材に含浸させてなるプリプレグを、所要枚数積
層し、その片面又は両面に銅箔を重ねて加熱加圧
により一体に成形して成ることを特徴とする銅張
積層板に関する。
本発明におけるエポキシ樹脂としては、ビスフ
エノールＡのグリシジルエーテル、ノボラツクの
グリシジルエーテルのようなグリシジル系エポキ
シ樹脂の他、非グリシジル系エポキシ樹脂も用い
ることができるが、基材への含浸性や特性の点か
ら、これらのうちエポキシ当量が200〜1000程度
のものを用いるのが望ましい。また、これらのエ
ポキシ樹脂の一部或いは全部をハロゲン化ビスフ
エノール型エポキシ樹脂、ハロゲン化ノボラツク
型エポキシ樹脂のようなハロゲン化エポキシ樹脂
に置き換えて、難燃性を付与することもできる。
本発明におけるエポキシ系可塑剤としては、エ
ポキシ化植物油、エポキシ化ダイマー酸のよう
な、天然油脂の不飽和結合をエポキシ化した不飽
和脂肪酸系のものや、エポキシ化ポリブタジエン
のような合成樹脂系のものがあり、いずれも液体
もしくは粘稠な流動体である。
これらのエポキシ系の可塑剤は、エポキシ基を
分子内に有しているため、ベースのエポキシ樹脂
との相溶性がよく、硬化の際、容易にベースと一
体となり、硬化阻害や特性の低下が起こらないと
いう利点がある。
而して、エポキシ系可塑剤は、ベースのエポキ
シ樹脂とできるだけエポキシ当量が近いものを用
いるのが好ましく、ベース100重量部に対して、
10〜50重量部配合するのが望ましい。
エポキシ系可塑剤の配合量が10重量部未満で
は、充分な可塑効果が得られず、反対に50重量部
を越えた場合には、ベース樹脂の硬化が阻害され
るばかりでなく、積層板の特性が低下して実用に
不適当なものとなる。
また、本発明においては、これらのエポキシ系
可塑剤と共に、トリフエニルフオスフエートやク
レジルジフエニルフオスフエート、トリクレジル
フオスフエートのようなリン酸エステル類を、リ
ン分で３重量％程度併用し、加工性をさらに改善
することも可能である。
これらのリン酸エステル類は、エポキシ系可塑
剤の可塑効果を補うばかりでなく、難燃性を付与
する役割を果たすものである。
本発明における硬化剤としては、一般にエポキ
シ樹脂用硬化剤として用いられているものは、全
て使用することができ、例えば、無水フタル酸、
テトラヒドロ無水フタル酸、ヘキサヒドロ無水フ
タル酸、ピロメリツト酸無水物、無水マレイン
酸、テトラクロル無水フタル酸、テトラブロム無
水フタル酸、無水ヘツト酸（ヘキサクロルエンド
メチレンテトラハイドロフタル酸無水物）のよう
な酸無水物や、ジシアンジアミド、ジエチレント
リアミン、トリエチレンテトラミン、メタフエニ
レンジアミン、ジアミノジフエニルメタン、ジア
ミノジフエニルスルフオン、イミダゾールのよう
なアミン類を使用することができる。これらのう
ち、特にテトラクロン無水フタル酸、テトラブロ
ム無水フタル酸、無水ヘツト酸のようなハロゲン
系の酸無水物を用いた場合には、難燃性の高い組
成物が得られるという利点がある。
これらの硬化剤の配合量は、ベースのエポキシ
樹脂およびエポキシ系可塑剤のエポキシ量を加え
た全量に対し、0.8〜1.2当量とするのが望まし
い。
硬化剤の配合量が、0.8当量未満では、エポキ
シ樹脂等が未反応で残り、反対に1.2当量を越え
る場合には、硬化剤が未反応で残るため、この範
囲外ではかえつて耐熱性や耐溶剤性が低下してし
まうので好ましくない。
本発明におけるエポキシ樹脂組成物には、以上
の配合成分の他に、公知の希釈剤、充填剤、顔
料、難燃剤等の添加剤を必要に応じて適宜添加す
ることもできる。
この中で、難燃剤としては、特にテトラブロモ
ビスフエノールＡやハロゲン化ジフエニルエーテ
ル類の使用が好ましい。添加量は、他の配合成分
の種類（難燃性の度合）と配合量により異なる
が、ハロゲン分で３〜15重量％添加するのが望ま
しい。
本発明の基材としては、紙、ガラス繊維布のい
ずれをも使用することができるが、価格の低廉さ
と打抜加工の容易さの点から、クラフト紙、コツ
トンリンター紙、クラフト―コツトンリンター混
抄紙等の紙基材を用いるのが好ましい。
また、三酸化アンチモン、水酸化アルミニウム
のような難燃助剤をこれらの紙にすきこんだもの
を使用することもできる。
本発明の銅張積層板を製造するには、先ず前述
のエポキシ樹脂組成物を、常法により上記紙基材
等に含浸し乾燥させてプリプレグを製作する。こ
のとき、エポキシ樹脂の紙への含浸性を増すため
に、予め、低分子量のフエノール樹脂、メラミン
フエノール樹脂、グアナミンフエノール樹脂等の
下塗り樹脂を、紙基材に塗布含浸させておくこと
もできる。この場合には、電気特性、耐熱性等の
特性の一段と改良された積層板が得られる。
次に、このプリプレグを、所要枚数積層し、そ
の片面或いは両面に銅箔を重ねて、ホツトプレス
により加熱加圧し、一体に成形することにより銅
張積層板が製造される。
このようにして得られる本発明の銅張積層板
は、耐熱性、耐ミーズリング性、耐薬品性の他、
打抜加工性においても優れている。
次に実施例について記載する。
実施例 １〜５
第１表の配合成分を同表の割合で混合し、これ
にアセトン10容量部とジメチルホルムアミド６容
量部とを加えて透明、均一なエポキシ樹脂ワニス
を調製した。これらのワニスをエポキシシラン処
理した厚さ10ミルスのクラフト紙に含浸塗布し、
150℃で５分間乾燥させて樹脂分40％のプリプレ
グを得た。このプリプレグ８枚を重ねた両面に厚
さ35μの銅箔を重ね、150℃で100分間100Kg/cm2の
加熱加圧下で一体に成形し、板厚1.6mmの銅張積
層板を得た。
次に、実施例１〜実施例５ならびに比較例で得
た銅張積層板の特性についての試験を行なつた。
試験結果を第２表に示す。
The present invention relates to a copper-clad laminate having excellent heat resistance, measling resistance, solvent resistance, etc., as well as good workability and flame retardancy. Epoxy resin copper-clad laminates and phenolic resin copper-clad laminates are in high demand in various industries, especially recently.
Demand for space equipment, large, medium, and small computers, microcomputers, wireless application equipment, industrial measurement equipment, medical equipment, etc. is increasing. Among these, paper-epoxy copper-clad laminates that use paper as the base material require
In addition to drilling, a punching method is used that has low equipment costs and fewer mistakes, but if the resin is in a too hardened state, this method requires punching at a fairly high temperature, resulting in poor workability. Not only that, but there was also the problem of a decrease in accuracy due to warpage and dimensional shrinkage of the plate. In addition, this paper-epoxy laminate has a NEMA grade of FR-3 (flame-retardant paper-epoxy laminate).
Therefore, it was required to have sufficient flame retardancy. The present invention was made to solve these problems.
An epoxy resin composition containing 50 parts by weight of an epoxy plasticizer, curing agent, and other additives,
The present invention relates to a copper-clad laminate, characterized in that a required number of prepregs impregnated into a base material are laminated, copper foil is layered on one or both sides of the prepreg, and the prepreg is integrally formed by heating and pressing. As the epoxy resin in the present invention, in addition to glycidyl-based epoxy resins such as glycidyl ether of bisphenol A and glycidyl ether of novolak, non-glycidyl-based epoxy resins can also be used. From this point of view, it is desirable to use those having an epoxy equivalent of about 200 to 1,000. Furthermore, flame retardance can be imparted by replacing part or all of these epoxy resins with halogenated epoxy resins such as halogenated bisphenol type epoxy resins and halogenated novolak type epoxy resins. Epoxy plasticizers used in the present invention include unsaturated fatty acid-based plasticizers that epoxidize the unsaturated bonds of natural oils and fats, such as epoxidized vegetable oils and epoxidized dimer acids, and synthetic resin-based plasticizers such as epoxidized polybutadiene. All of them are liquids or viscous fluids. These epoxy plasticizers have epoxy groups in their molecules, so they have good compatibility with the base epoxy resin and easily integrate with the base during curing, preventing curing inhibition and property deterioration. The advantage is that it doesn't happen. Therefore, it is preferable to use an epoxy plasticizer having an epoxy equivalent as close as possible to that of the base epoxy resin, and based on 100 parts by weight of the base,
It is desirable to mix 10 to 50 parts by weight. If the amount of the epoxy plasticizer is less than 10 parts by weight, a sufficient plasticizing effect will not be obtained, while if it exceeds 50 parts by weight, not only will the curing of the base resin be inhibited, but also the laminate will deteriorate. The properties deteriorate, making it unsuitable for practical use. In addition, in the present invention, in addition to these epoxy plasticizers, phosphoric acid esters such as triphenyl phosphate, cresyl diphenyl phosphate, and tricresyl phosphate are used at a concentration of 3% by weight in terms of phosphorus content. It is also possible to use them in combination to further improve processability. These phosphoric acid esters not only supplement the plasticizing effect of the epoxy plasticizer, but also play the role of imparting flame retardancy. As the curing agent in the present invention, all those commonly used as curing agents for epoxy resins can be used, such as phthalic anhydride,
Acid anhydrides such as tetrahydrophthalic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, maleic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, hexic anhydride (hexachlorendomethylenetetrahydrophthalic anhydride) and amines such as dicyandiamide, diethylenetriamine, triethylenetetramine, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, and imidazole. Among these, the use of halogen-based acid anhydrides such as tetrachlorophthalic anhydride, tetrabromophthalic anhydride, and hettic anhydride has the advantage that a highly flame-retardant composition can be obtained. The blending amount of these curing agents is preferably 0.8 to 1.2 equivalents based on the total amount including the base epoxy resin and the epoxy amount of the epoxy plasticizer. If the amount of the curing agent is less than 0.8 equivalent, the epoxy resin etc. will remain unreacted, and if it exceeds 1.2 equivalent, the curing agent will remain unreacted, so outside this range, the heat resistance and resistance will deteriorate. This is not preferable because the solvent property is reduced. In addition to the above-mentioned ingredients, known additives such as diluents, fillers, pigments, and flame retardants can be added to the epoxy resin composition of the present invention as needed. Among these, as the flame retardant, it is particularly preferable to use tetrabromobisphenol A and halogenated diphenyl ethers. The amount added varies depending on the types (degrees of flame retardancy) and amounts of other ingredients, but it is desirable to add 3 to 15% by weight of halogen. As the base material of the present invention, either paper or glass fiber cloth can be used, but from the viewpoint of low price and ease of punching, kraft paper, cotton linter paper, kraft-cotton paper, etc. It is preferable to use a paper base material such as linter-mixed paper. It is also possible to use these papers in which flame retardant additives such as antimony trioxide and aluminum hydroxide are injected. To manufacture the copper-clad laminate of the present invention, first, the above-mentioned paper base material or the like is impregnated with the above-mentioned epoxy resin composition by a conventional method and dried to produce a prepreg. At this time, in order to increase the impregnability of the epoxy resin into the paper, an undercoat resin such as a low molecular weight phenol resin, melamine phenol resin, or guanamine phenol resin may be applied and impregnated onto the paper base material in advance. In this case, a laminate with further improved properties such as electrical properties and heat resistance can be obtained. Next, a required number of prepregs are laminated, copper foil is layered on one or both sides of the prepreg, and the prepregs are heated and pressed using a hot press to form a single piece, thereby producing a copper-clad laminate. The copper-clad laminate of the present invention thus obtained has heat resistance, measling resistance, chemical resistance, and other properties.
It also has excellent punching workability. Next, examples will be described. Examples 1 to 5 The components shown in Table 1 were mixed in the proportions shown in the same table, and 10 parts by volume of acetone and 6 parts by volume of dimethylformamide were added thereto to prepare a transparent and uniform epoxy resin varnish. These varnishes are impregnated and coated on 10 mils thick kraft paper treated with epoxy silane.
It was dried at 150°C for 5 minutes to obtain a prepreg with a resin content of 40%. Copper foil with a thickness of 35 μm was layered on both sides of the 8 prepreg sheets, and they were integrally molded at 150° C. for 100 minutes under heat and pressure of 100 kg/cm 2 to obtain a copper-clad laminate with a thickness of 1.6 mm. Next, tests were conducted on the properties of the copper-clad laminates obtained in Examples 1 to 5 and Comparative Examples.
The test results are shown in Table 2.
【表】【table】
【表】【table】
Claims (1)
部のエポキシ系可塑剤、および硬化剤を配合した
エポキシ樹脂組成物を、基材に含浸させてなるプ
リプレグを、所要枚数積層し、その表面に銅箔を
重ねて加熱加圧により一体に成形して成ることを
特徴とする銅張積層板。 ２ 基材が紙であることを特徴とする特許請求の
範囲第１項記載の銅張積層板。[Claims] 1. Prepreg prepared by impregnating a base material with an epoxy resin composition containing 10 to 50 parts by weight of an epoxy plasticizer and a curing agent per 100 parts by weight of an epoxy resin, in the required number. A copper-clad laminate characterized by being laminated, overlapping copper foil on its surface, and integrally molding it by heating and pressing. 2. The copper-clad laminate according to claim 1, wherein the base material is paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12959081A JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12959081A JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831746A JPS5831746A (en) | 1983-02-24 |
| JPH0113420B2 true JPH0113420B2 (en) | 1989-03-06 |
Family
ID=15013200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12959081A Granted JPS5831746A (en) | 1981-08-19 | 1981-08-19 | Copper lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0018791A1 (en) * | 1979-04-26 | 1980-11-12 | Ferrofluidics Corporation | Magnetic seal apparatus for magnetically permeable shaft |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6019431U (en) * | 1983-07-19 | 1985-02-09 | 松下電器産業株式会社 | Glass cloth base epoxy resin laminate |
-
1981
- 1981-08-19 JP JP12959081A patent/JPS5831746A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0018791A1 (en) * | 1979-04-26 | 1980-11-12 | Ferrofluidics Corporation | Magnetic seal apparatus for magnetically permeable shaft |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831746A (en) | 1983-02-24 |
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