JPH0113421Y2 - - Google Patents
Info
- Publication number
- JPH0113421Y2 JPH0113421Y2 JP17784184U JP17784184U JPH0113421Y2 JP H0113421 Y2 JPH0113421 Y2 JP H0113421Y2 JP 17784184 U JP17784184 U JP 17784184U JP 17784184 U JP17784184 U JP 17784184U JP H0113421 Y2 JPH0113421 Y2 JP H0113421Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- ejector
- fixed
- movable
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、半導体素子を樹脂モールド成形す
る金型装置の改良に関するものであり、この種金
型装置の製造技術産業の分野において利用される
ものである。[Detailed description of the invention] (Field of industrial application) This invention relates to the improvement of a mold device for resin molding semiconductor elements, and is used in the field of manufacturing technology industry for this type of mold device. It is something.
（従来の技術）
半導体素子を樹脂モールド成形する金型装置と
してトランスフアーモールド金型装置が従来から
用いられている。この従来装置の一般的構成は、
例えば、第２図に示すように、固定側取付板１を
介して固定盤等の固定部側（図示なし）に取付け
た固定側金型２と、該固定側金型２の対向位置に
可動側取付板３を介して可動盤等の可動部側（図
示なし）に取付けた可動側金型４とから成り、上
記両金型２，４の夫々には、樹脂材料の加熱用ヒ
ータ部５，５と、樹脂成形キヤビテイ部６，６
と、該キヤビテイ内の樹脂成形体突出用のエジエ
クタ部材７，７及び該エジエクタ部材を進退摺動
可能に嵌装させる所要数のサポート８，８を備え
ており、また、該サポート８，８の固着板１1，
３1は、上記エジエクタ部材におけるエジエクタ
プレート７1，７2を嵌装させる空間部形成用のス
ペーサブロツク９，９に固着されると共に、該サ
ポート固着板１1，３1と上記両取付板１，３との
間には、該取付板と同形状の断熱板１０，１０を
配設して、上記ヒータ部５，５から前記した固定
部側及び可動部側への熱伝導防止を図るようにし
ている。なお、固定側金型２のエジエクタ部材に
おけるエジエクタピン７3は、図に示す型締めの
際にはリターンピン（図示なし）によつて所定高
さ位置にまで退動するが、型開きに際してはサポ
ート固着板１1とエジエクタプレート７1との間に
介在させたスプリング７4の弾性によつて進動す
ることにより上記キヤビテイ６内の樹脂成形体を
突出するものであり、また、可動側金型４のエジ
エクタ部材におけるエジエクタピン７5は、型締
めの際には該金型プレート４1とエジエクタプレ
ート７2との間に介在させたスプリング７6の弾性
によつて退動するが、型開きに際してはエジエク
タバー（図示なし）によつてエジエクタプレート
７2を所定高さ位置にまで進動させることにより
上記キヤビテイ６内の樹脂成形体を突出するよう
に設けられている。(Prior Art) Transfer molding equipment has been conventionally used as a molding equipment for resin molding semiconductor elements. The general configuration of this conventional device is:
For example, as shown in FIG. 2, a fixed mold 2 is attached to a fixed part (not shown) such as a fixed plate through a fixed mounting plate 1, and the fixed mold 2 is moved to a position opposite to the fixed mold 2. It consists of a movable mold 4 attached to a movable part side (not shown) such as a movable platen through a side mounting plate 3, and each of the molds 2 and 4 has a heater part 5 for heating resin material. , 5 and resin molded cavity parts 6, 6
and ejector members 7, 7 for protruding the resin molded body in the cavity, and a required number of supports 8, 8 into which the ejector members are fitted so as to be able to move forward and backward, and the supports 8, 8. Fixing plate 1 1 ,
3 1 is fixed to the spacer blocks 9 , 9 for forming a space in which the ejector plates 7 1 , 7 2 of the ejector member are fitted, and is attached to the support fixing plates 1 1 , 3 1 and both the mounting plates. 1 and 3, heat insulating plates 10 and 10 having the same shape as the mounting plate are arranged to prevent heat conduction from the heater parts 5 and 5 to the fixed part side and the movable part side. That's what I do. Note that the ejector pin 73 in the ejector member of the stationary mold 2 is retracted to a predetermined height position by a return pin (not shown) when the mold is closed as shown in the figure, but it is not supported when the mold is opened. The resin molded body in the cavity 6 is moved forward by the elasticity of a spring 74 interposed between the fixed plate 11 and the ejector plate 71 , and the movable side metal The ejector pin 75 in the ejector member of the mold 4 is retracted by the elasticity of the spring 76 interposed between the mold plate 41 and the ejector plate 72 when the mold is closed. When opening, the ejector plate 72 is moved to a predetermined height position by an ejector bar (not shown), thereby protruding the resin molded body within the cavity 6.
従つて、上記従来金型装置においては、取付板
１，３と断熱板１０，１０及びサポート固着板１
１，３1から成る三層構造により、所謂、金型の平
行度維持が良好であるため、型締め或はエジエク
タ部材７による樹脂成形体の突出作用等を阻害す
ることがないといつた利点を有しているが、その
反面、ヒータ部５の熱効率が悪くなるといつた問
題がある。 Therefore, in the conventional mold device described above, the mounting plates 1 and 3, the heat insulating plates 10 and 10, and the support fixing plate 1
Because of the three-layer structure consisting of 1 and 3 1 , the so-called parallelism of the mold can be maintained well, so the advantage is that the mold clamping or ejector member 7 does not interfere with the ejection of the resin molded body. However, on the other hand, there is a problem in that the thermal efficiency of the heater section 5 deteriorates.
このため、熱効率を改善する目的で、第３図に
示すように、断熱板１０′，１０′を、スペーサブ
ロツク９，９と両金型プレート２1，４1との間、
並びに、サポート８，８と両金型プレート２1，
４1との間に配設して構成（サポート８，８の固
着板は両取付板１′，３′を兼ねている）したので
あるが、この場合は、サポート８，８が細く断熱
材の支受面積が少いため金型の平行度維持が困難
となり、更に、断熱材に所要の孔加工を施す必要
があることから金型装置の製作組立作業が面倒で
コストアツプの要因となる等の新たな問題を生じ
たのである。 Therefore, for the purpose of improving thermal efficiency, as shown in FIG .
In addition, supports 8, 8 and both mold plates 2 1 ,
4 and 1 (the fixing plates of supports 8 and 8 also serve as both mounting plates 1' and 3'), but in this case, supports 8 and 8 are thin and are made of heat insulating material. The small supporting area makes it difficult to maintain the parallelism of the mold, and furthermore, it is necessary to drill the required holes in the insulation material, which makes the manufacturing and assembly work of the mold device troublesome and increases costs. This created a new problem.
（考案が解決しようとする問題点）
本考案は、金型の平行維持といつた金型に要求
される構造上の強度・耐久性を損うことなく、ヒ
ータ部の熱効率の改善を図ることによつて、上述
したような従来の問題点を確実に解消することを
目的とするものである。(Problem to be solved by the invention) The invention aims to improve the thermal efficiency of the heater section without compromising the structural strength and durability required for the mold, such as maintaining the mold parallel. The purpose of this invention is to reliably solve the conventional problems as described above.
（問題点を解決するための手段）
本考案の半導体素子のトランスフアモールド金
型装置は、固定側取付板を介して固定部側に取付
けた固定側金型と該固定側金型の対向位置に、可
動側取付板を介して可動部側に取付けた可動側金
型とから成り、上記両金型の夫々には、樹脂材料
の加熱用ヒータ部と、樹脂成形キヤビテイ部と、
該キヤビテイ内の樹脂成形体突出用のエジエクタ
部材と該エジエクタ部材の嵌装空間形成用のスペ
ーサブロツク、及び、該エジエクタ部材を進退摺
動可能に嵌装させる所要数のサポートとを備えた
半導体素子のトランスフアモールド金型装置にお
いて、上記両スペーサブロツクと両金型における
ヒータ部との間、並びに、上記両取付板とサポー
トとの間に、所要厚の断熱板を夫々配設して構成
したことを特徴とするものである。(Means for Solving the Problems) The semiconductor device transfer molding mold device of the present invention has a fixed side mold attached to a fixed part side via a fixed side mounting plate, and a position where the fixed side mold faces each other. and a movable side mold attached to the movable part side via a movable side mounting plate, and each of the two molds includes a heater part for heating a resin material, a resin molding cavity part,
A semiconductor element comprising an ejector member for protruding a resin molded body within the cavity, a spacer block for forming a fitting space for the ejector member, and a required number of supports for fitting the ejector member so as to be able to move forward and backward. In the transfer molding mold apparatus, heat insulating plates of a required thickness are arranged between the spacer blocks and the heater parts of the molds, and between the mounting plates and the support. It is characterized by this.
（作用）
従つて、本考案の構成によれば、両取付板とサ
ポート及び断熱板の三者による効率的な金型の平
行度維持作用が得られると共に、サポートやスペ
ーサブロツクからの熱伝導を抑制してヒータ部の
熱効率を改善するものである。(Function) Therefore, according to the configuration of the present invention, the two mounting plates, the support, and the heat insulating plate effectively maintain the parallelism of the mold, and the heat conduction from the support and spacer block is reduced. This is to improve the thermal efficiency of the heater section.
（実施例） 次に、本考案を実施例図に基づいて説明する。(Example) Next, the present invention will be explained based on embodiment figures.
第１図は半導体素子のトランスフアモールド金
型装置の要部を示しており、該装置は、固定側取
付板１１を介して固定部側（図示なし）に取付け
た固定側金型１２と、該固定側金型１２の対向位
置に、可動側取付板１３を介して可動部側（図示
なし）に取付けた可動側金型１４とから成り、上
記両金型１２，１４の夫々には、樹脂材料の加熱
用ヒータ部１５，１５と樹脂成形キヤビテイ部１
６，１６と、該キヤビテイ内の樹脂成形体突出用
のエジエクタ部材１７，１７及び該エジエクタ部
材を進退摺動可能に嵌装させる所要数のサポート
１８1，１８2（サポート１８1及びガイドサポート
１８2）を備えており、また、該サポートの固着
板を兼ねる上記取付板１１，１３はエジエクタ部
材におけるエジエクタプレート１７1，１７2を嵌
装させる空間部形成用のスペーサブロツク１９，
１９に固着されると共に、該スペーサブロツク１
９，１９と金型プレート１２1，１４2との間、並
びに、取付板１１，１３とサポート１８1，１８2
との間には、所要厚の断熱板２０1，２０2が夫々
配設されている。（なお、上記サポート１８1，１
８2を熱伝導率の低い素材により形成して、ヒー
タ部１５，１５の熱量を有効に利用することが好
ましい。）
また、取付板１１，１３側に固着される断熱板
２０2は、スペーサブロツク１９，１９を除く該
取付板１１，１３の略全面に取付けられており、
更に、上記断熱板２０2とサポート１８1，１８2
との固着は、該サポートの取付基部１８ａを広幅
に形成することによつて、両者の接触面が大とな
るように設けられている。 FIG. 1 shows the main parts of a transfer molding mold apparatus for semiconductor devices, which includes a fixed side mold 12 attached to a fixed part side (not shown) via a fixed side mounting plate 11, A movable mold 14 is attached to a movable part side (not shown) via a movable mounting plate 13 at a position opposite to the fixed mold 12, and each of the molds 12 and 14 includes: Heater parts 15, 15 for heating resin material and resin molded cavity part 1
6, 16, ejector members 17, 17 for protruding the resin molded body in the cavity, and the required number of supports 18 1 , 18 2 (support 18 1 and guide support 18 2 ), and the mounting plates 11 and 13, which also serve as fixing plates of the supports, are provided with spacer blocks 19, 19, for forming spaces into which the ejector plates 171 , 172 of the ejector member are fitted.
19 and the spacer block 1
9, 19 and the mold plates 12 1 , 14 2 and between the mounting plates 11, 13 and the supports 18 1 , 18 2
Insulating plates 20 1 and 20 2 having a required thickness are respectively disposed between them. (In addition, the above support 18 1 , 1
It is preferable that the heater parts 8 2 be formed of a material with low thermal conductivity to effectively utilize the amount of heat of the heater parts 15, 15. ) Furthermore, the heat insulating board 20 2 fixed to the mounting plates 11 and 13 is attached to substantially the entire surface of the mounting plates 11 and 13 except for the spacer blocks 19 and 19,
Furthermore, the above-mentioned heat insulating board 20 2 and supports 18 1 , 18 2
The attachment base 18a of the support is formed wide so that the contact surface between the two is large.
なお、上記サポート１８1，１８2と断熱板２０
２との接触面の増加を図るには、例えば、各サポ
ート１８1，１８2の軸径を拡大すること、また、
上記断熱板２０2と略同一形状の取付基板を形成
して、該取付基板に各サポートを一体に配置する
こと等の手段を採用してもよい。 Note that the supports 18 1 , 18 2 and the heat insulating board 20
In order to increase the contact surface with 2 , for example, the shaft diameter of each support 18 1 and 18 2 may be increased, and
It is also possible to adopt a method such as forming a mounting board having substantially the same shape as the heat insulating board 20 2 and arranging each support integrally on the mounting board.
また、その他の基本的な構成、即ち、固定側金
型１２側のエジエクタピン１７3・エジエクタ用
スプリング１７4、及び、可動側金型１４側のエ
ジエクタピン１７5・スプリング１７6等の配置構
成態様は、前述した従来装置（第２図）のものと
実質的に同一である。 In addition, the other basic configurations, that is, the arrangement configuration of the ejector pin 17 3 and ejector spring 17 4 on the fixed side mold 12 side, and the ejector pin 17 5 and spring 17 6 on the movable side mold 14 side, etc. , which is substantially the same as that of the conventional device described above (FIG. 2).
上記した実施例の構成においては、取付板１
１，１３と断熱板２０2とサポート１８1，１８2
及び該サポートの広幅取付基部１８ａによる取付
部の三層構造的構成によつて金型の平行度維持が
確実に図れると共に、スペーサブロツク１９，１
９とサポート１８1，１８2から取付板１１，１３
側への熱伝導作用を確実に防止し得るため、ヒー
タ部１５，１５の熱効率を向上できる効果があ
る。 In the configuration of the embodiment described above, the mounting plate 1
1, 13 and insulation board 20 2 and support 18 1 , 18 2
The three-layer structural configuration of the mounting portion by the wide mounting base 18a of the support ensures that the parallelism of the mold is maintained, and the spacer blocks 19, 1
9 and supports 18 1 , 18 2 to mounting plates 11, 13
Since heat conduction to the sides can be reliably prevented, there is an effect that the thermal efficiency of the heater parts 15, 15 can be improved.
（考案の効果）
本考案の構成によれば、金型に要求される構造
上の強度・耐久性を損うことがないので、金型の
平行維持を確実に図ることができると共に、金型
ヒータ部の熱効率の向上を図ることができるとい
つた優れた実用的効果を奏するものである。(Effect of the invention) According to the configuration of the invention, the structural strength and durability required for the mold are not impaired, so the parallelism of the mold can be reliably maintained, and the mold This has excellent practical effects such as being able to improve the thermal efficiency of the heater section.
第１図は本考案の実施例を示すもので、半導体
素子のトランスフアモールド金型装置の一部切欠
縦断面図である。第２図は従来の金型装置を示す
一部切欠縦断面図、第３図は、該金型装置の改良
例を示す一部切欠縦断面図である。
１１……固定側取付板、１２……固定側金型、
１３……可動側取付板、１４……可動側金型、１
５……ヒータ部、１６……キヤビテイ部、１７…
…エジエクタ部材、１８1，１８2……サポート、
１９……スペーサブロツク、２０1，２０2……断
熱板。
FIG. 1 shows an embodiment of the present invention, and is a partially cutaway vertical sectional view of a transfer molding mold apparatus for semiconductor devices. FIG. 2 is a partially cutaway vertical cross-sectional view showing a conventional mold device, and FIG. 3 is a partially cutaway vertical cross-sectional view showing an improved example of the mold device. 11...Fixed side mounting plate, 12...Fixed side mold,
13...Movable side mounting plate, 14...Movable side mold, 1
5... Heater section, 16... Cavity section, 17...
... Ejector member, 18 1 , 18 2 ... Support,
19... Spacer block, 20 1 , 20 2 ... Heat insulation board.
Claims (1)
定側金型と、該固定側金型の対向位置に、可動
側取付板を介して可動部側に取付けた可動側金
型とから成り、上記両金型の夫々には、樹脂材
料の加熱用ヒータ部と、樹脂成形キヤビテイ部
と、該キヤビテイ内の樹脂成形体突出用のエジ
エクタ部材と該エジエクタ部材の嵌装空間部形
成用のスペーサブロツク、及び、該エジエクタ
部材を進退摺動可能に嵌装させる所要数のサポ
ートとを備えた半導体素子のトランスフアモー
ルド金型装置において、上記両スペーサブロツ
クと両金型におけるヒータ部との間、並びに、
上記両取付板とサポートとの間に、所要厚の断
熱板を夫々配設して構成したことを特徴とする
半導体素子のトランスフアモールド金型装置。 (2) サポートを熱伝導率の低い素材により形成し
たことを特徴とする実用新案登録請求の範囲第
(1)項に記載の半導体素子のトランスフアモール
ド金型装置。[Scope of Claim for Utility Model Registration] (1) A fixed side mold attached to the fixed part side via a fixed side mounting plate, and a fixed side mold attached to the movable part side via a movable side mounting plate at a position opposite to the fixed side mold. and a movable side mold attached to the mold, and each of the two molds has a heater part for heating the resin material, a resin molding cavity part, an ejector member for ejecting the resin molded body from the cavity, and the ejector. In a transfer molding mold device for a semiconductor device, which is equipped with a spacer block for forming a space for fitting a member, and a required number of supports for fitting the ejector member so as to be able to move forward and backward, both of the above-mentioned spacer blocks and Between the heater parts in both molds, and
A transfer molding mold device for a semiconductor element, characterized in that a heat insulating plate of a required thickness is disposed between the mounting plates and the support. (2) Utility model registration claim No. 1 characterized in that the support is made of a material with low thermal conductivity.
A transfer molding mold device for a semiconductor device according to item (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17784184U JPH0113421Y2 (en) | 1984-11-22 | 1984-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17784184U JPH0113421Y2 (en) | 1984-11-22 | 1984-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6192056U JPS6192056U (en) | 1986-06-14 |
| JPH0113421Y2 true JPH0113421Y2 (en) | 1989-04-19 |
Family
ID=30735414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17784184U Expired JPH0113421Y2 (en) | 1984-11-22 | 1984-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0113421Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747292B2 (en) * | 1986-06-28 | 1995-05-24 | 三菱マテリアル株式会社 | Transfer mold |
| JP2676231B2 (en) * | 1988-09-07 | 1997-11-12 | 三菱電機株式会社 | Resin encapsulation equipment for semiconductor devices |
-
1984
- 1984-11-22 JP JP17784184U patent/JPH0113421Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6192056U (en) | 1986-06-14 |
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