JPH01137535U - - Google Patents
Info
- Publication number
- JPH01137535U JPH01137535U JP3257588U JP3257588U JPH01137535U JP H01137535 U JPH01137535 U JP H01137535U JP 3257588 U JP3257588 U JP 3257588U JP 3257588 U JP3257588 U JP 3257588U JP H01137535 U JPH01137535 U JP H01137535U
- Authority
- JP
- Japan
- Prior art keywords
- wafer mounting
- vacuum chamber
- wafer
- pressure
- reducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、本考案に係るウエハ載置台の第一の
実施例を示す平面図、第２図は、同側断面図、第
３図は、本考案に係るウエハ載置台の第二の実施
例を示す平面図、第４図は、同側断面図、第５図
は、従来例を説明する概略構成図、第６図は、従
来例におけるウエハの浮き上がりを説明する側面
図、第７図ａ，ｂは、他の従来例を示す側断面図
である。
１……ウエハ載置台、１ａ……上面、１ｂ……
ウエハ載置部、２……太溝、３，３―１……細溝
、Ｗ……ウエハ。
FIG. 1 is a plan view showing a first embodiment of the wafer mounting table according to the present invention, FIG. 2 is a sectional view of the same side, and FIG. 3 is a second embodiment of the wafer mounting table according to the present invention. 4 is a sectional view of the same side; FIG. 5 is a schematic configuration diagram illustrating the conventional example; FIG. 6 is a side view illustrating wafer lifting in the conventional example; FIG. a and b are side sectional views showing other conventional examples. 1...Wafer mounting table, 1a...Top surface, 1b...
Wafer placement part, 2... Thick groove, 3, 3-1... Thin groove, W... Wafer.
Claims (1)
置され、前記真空室内を大気圧とした状態で前記
上面のウエハ載置部に載置されたウエハに対し、
前記真空室内を減圧して処理を行う為のウエハ載
置台において、 前記ウエハ載置部に、該ウエハ載置部の中心を
通る太溝と、該太溝に連通する複数の細溝とを形
成し、前記真空室内を減圧する際に、前記ウエハ
載置部とウエハ間に存在する大気を前記太溝から
排出させることを特徴とする真空室内のウエハ載
置台。[Claims for Utility Model Registration] For a wafer installed in a vacuum chamber with its smooth upper surface horizontal, and placed on a wafer mounting section on the upper surface with the vacuum chamber at atmospheric pressure,
In the wafer mounting table for performing processing by reducing the pressure in the vacuum chamber, the wafer mounting part is formed with a thick groove passing through the center of the wafer mounting part and a plurality of narrow grooves communicating with the thick groove. A wafer mounting table in a vacuum chamber, characterized in that when reducing the pressure in the vacuum chamber, the atmosphere existing between the wafer mounting section and the wafer is exhausted from the wide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3257588U JPH01137535U (en) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3257588U JPH01137535U (en) | 1988-03-14 | 1988-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137535U true JPH01137535U (en) | 1989-09-20 |
Family
ID=31259123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3257588U Pending JPH01137535U (en) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137535U (en) |
-
1988
- 1988-03-14 JP JP3257588U patent/JPH01137535U/ja active Pending