JPS63145332U - - Google Patents
Info
- Publication number
- JPS63145332U JPS63145332U JP3869987U JP3869987U JPS63145332U JP S63145332 U JPS63145332 U JP S63145332U JP 3869987 U JP3869987 U JP 3869987U JP 3869987 U JP3869987 U JP 3869987U JP S63145332 U JPS63145332 U JP S63145332U
- Authority
- JP
- Japan
- Prior art keywords
- recesses
- stage
- semiconductor wafer
- manufacturing apparatus
- guide groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図は本考案に係る半導体製造装置の概略構
成断面図、第２図は第１図のＡ部拡大図、第３図
はステージの平面図、第４図乃至第６図はウエー
ハの取込み、取出しを説明するための各工程図で
ある。第７図は従来の半導体製造装置の概略構成
断面図、第８図はステージの平面図、第９図は第
７図の要部拡大図である。
３……半導体ウエーハ（ウエーハ）、１１……
半導体製造装置、１２……ステージ、１２ａ……
凹部、１３……ガイド溝、１４……吸着手段（吸
着ペン）。
Fig. 1 is a schematic cross-sectional view of the semiconductor manufacturing apparatus according to the present invention, Fig. 2 is an enlarged view of part A in Fig. 1, Fig. 3 is a plan view of the stage, and Figs. 4 to 6 are wafer loading. , and each process diagram for explaining extraction. FIG. 7 is a schematic cross-sectional view of a conventional semiconductor manufacturing apparatus, FIG. 8 is a plan view of a stage, and FIG. 9 is an enlarged view of the main part of FIG. 7. 3...Semiconductor wafer (wafer), 11...
Semiconductor manufacturing equipment, 12... stage, 12a...
Recessed portion, 13... Guide groove, 14... Suction means (suction pen).
Claims (1)
し、前記凹部に処理面を上方に向けた状態で半導
体ウエーハを載置してエツチングする装置におい
て、 上記ウエーハの吸着手段用のガイド溝を上記凹
部の底面からステージの外端縁に向つて連設した
ことを特徴とする半導体製造装置。[Claims for Utility Model Registration] An apparatus for etching a semiconductor wafer by forming a plurality of recesses on the peripheral edge of a disc-shaped stage and placing a semiconductor wafer in the recesses with the processing surface facing upward, A semiconductor manufacturing apparatus characterized in that a guide groove for a suction means is continuously provided from the bottom surface of the recess toward the outer edge of the stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3869987U JPS63145332U (en) | 1987-03-16 | 1987-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3869987U JPS63145332U (en) | 1987-03-16 | 1987-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145332U true JPS63145332U (en) | 1988-09-26 |
Family
ID=30851185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3869987U Pending JPS63145332U (en) | 1987-03-16 | 1987-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145332U (en) |
-
1987
- 1987-03-16 JP JP3869987U patent/JPS63145332U/ja active Pending
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