JPH01137593U - - Google Patents

Info

Publication number
JPH01137593U
JPH01137593U JP3277488U JP3277488U JPH01137593U JP H01137593 U JPH01137593 U JP H01137593U JP 3277488 U JP3277488 U JP 3277488U JP 3277488 U JP3277488 U JP 3277488U JP H01137593 U JPH01137593 U JP H01137593U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
heat sink
mounting
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3277488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3277488U priority Critical patent/JPH01137593U/ja
Publication of JPH01137593U publication Critical patent/JPH01137593U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1の実施例の斜視図、第2
図は本考案の第2の実施例の斜視図、第3図およ
び第4図は従来のプリント基板用放熱板を示す図
である。 1……プリント基板、2……プリント基板用放
熱板、3……電子部品、4……プリント基板取付
け金具、5……パイプ状の脚、6……ねじ、7…
…取付け部、8……脚部、9……他の構造物。
Fig. 1 is a perspective view of the first embodiment of the present invention;
The figure is a perspective view of a second embodiment of the present invention, and FIGS. 3 and 4 are views showing conventional heat sinks for printed circuit boards. 1... Printed circuit board, 2... Heat sink for printed circuit board, 3... Electronic component, 4... Printed circuit board mounting bracket, 5... Pipe-shaped leg, 6... Screw, 7...
...Attachment part, 8... Leg part, 9... Other structure.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板用放熱板の構造において、金属板
からなる前記プリント基板用放熱板をそれを使用
するプリント基板より大きくしそのはみ出した部
分を折曲げ加工して前記プリント基板と前記プリ
ント基板用放熱板とを他の構造物に取付けるため
の取付け部分として形成することを特徴とするプ
リント基板用放熱板の構造。
In the structure of a heat sink for a printed circuit board, the heat sink for a printed circuit board made of a metal plate is made larger than the printed circuit board in which it is used, and its protruding portion is bent to form the printed circuit board and the heat sink for a printed circuit board. A structure of a heat sink for a printed circuit board, characterized in that it is formed as a mounting part for mounting on another structure.
JP3277488U 1988-03-11 1988-03-11 Pending JPH01137593U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3277488U JPH01137593U (en) 1988-03-11 1988-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3277488U JPH01137593U (en) 1988-03-11 1988-03-11

Publications (1)

Publication Number Publication Date
JPH01137593U true JPH01137593U (en) 1989-09-20

Family

ID=31259345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3277488U Pending JPH01137593U (en) 1988-03-11 1988-03-11

Country Status (1)

Country Link
JP (1) JPH01137593U (en)

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