JPH01139422U - - Google Patents
Info
- Publication number
- JPH01139422U JPH01139422U JP3609488U JP3609488U JPH01139422U JP H01139422 U JPH01139422 U JP H01139422U JP 3609488 U JP3609488 U JP 3609488U JP 3609488 U JP3609488 U JP 3609488U JP H01139422 U JPH01139422 U JP H01139422U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- electronic component
- case
- component according
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3609488U JPH01139422U (2) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3609488U JPH01139422U (2) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139422U true JPH01139422U (2) | 1989-09-22 |
Family
ID=31262711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3609488U Pending JPH01139422U (2) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139422U (2) |
-
1988
- 1988-03-18 JP JP3609488U patent/JPH01139422U/ja active Pending
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