JPH01143121U - - Google Patents
Info
- Publication number
- JPH01143121U JPH01143121U JP3850288U JP3850288U JPH01143121U JP H01143121 U JPH01143121 U JP H01143121U JP 3850288 U JP3850288 U JP 3850288U JP 3850288 U JP3850288 U JP 3850288U JP H01143121 U JPH01143121 U JP H01143121U
- Authority
- JP
- Japan
- Prior art keywords
- resist
- semiconductor substrate
- coating device
- pattern
- depending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図はこの考案の一実施例による半導体製造
装置のレジスト塗布装置の正面図、第２図は第１
図のレジスト塗布装置を使用した場合の半導体基
板上のレジスト滴下状態の平面図、第３図は従来
のレジスト塗布装置の正面図、第４図は第３図の
レジスト塗布装置によるレジスト滴下状態を示す
平面図である。
図中、１はノズル１、２はノズル２、３はノズ
ル３、４は半導体基板、５はスピンチヤツク、６
はレジスト滴下ポイント、７はレジスト拡がり方
向、８はダイシングラインを示す。なお、図中、
同一符号は同一、または相当部分を示す。
FIG. 1 is a front view of a resist coating device for semiconductor manufacturing equipment according to an embodiment of this invention, and FIG.
3 is a front view of a conventional resist coating device, and FIG. 4 is a plan view of a resist dropping state on a semiconductor substrate using the resist coating device shown in FIG. 3. FIG. In the figure, 1 is the nozzle 1, 2 is the nozzle 2, 3 is the nozzle 3, 4 is the semiconductor substrate, 5 is the spin chuck, and 6 is the nozzle.
7 indicates a resist dropping point, 7 indicates a resist spreading direction, and 8 indicates a dicing line. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
ジスト塗布装置において、半導体基板のパターン
に依存することなくレジスト塗布を均一に行う為
にレジスト吐出ノズルを多数設けたことを特徴と
する半導体製造装置のレジスト塗布装置。 A resist coating device for a semiconductor manufacturing device using a spin coating method, characterized in that a large number of resist discharge nozzles are provided in order to apply resist uniformly without depending on the pattern of a semiconductor substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850288U JPH01143121U (en) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850288U JPH01143121U (en) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143121U true JPH01143121U (en) | 1989-10-02 |
Family
ID=31265046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3850288U Pending JPH01143121U (en) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143121U (en) |
-
1988
- 1988-03-24 JP JP3850288U patent/JPH01143121U/ja active Pending