JPH01143134U - - Google Patents
Info
- Publication number
- JPH01143134U JPH01143134U JP3850488U JP3850488U JPH01143134U JP H01143134 U JPH01143134 U JP H01143134U JP 3850488 U JP3850488 U JP 3850488U JP 3850488 U JP3850488 U JP 3850488U JP H01143134 U JPH01143134 U JP H01143134U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- sealing frame
- metal cap
- metal
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 1
- 239000012768 molten material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850488U JPH01143134U (2) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850488U JPH01143134U (2) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143134U true JPH01143134U (2) | 1989-10-02 |
Family
ID=31265048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3850488U Pending JPH01143134U (2) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143134U (2) |
-
1988
- 1988-03-24 JP JP3850488U patent/JPH01143134U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2515923B2 (ja) | 半導体装置の封止方法 | |
| JPS6364046U (2) | ||
| JPH047026U (2) | ||
| JPS61138275U (2) | ||
| JPS6334275Y2 (2) | ||
| JPS63159841U (2) | ||
| JPH0328739U (2) | ||
| JPH02104184U (2) | ||
| JPH031538U (2) | ||
| JPS6270440U (2) | ||
| JPS5839046U (ja) | 半導体パツケ−ジ | |
| JPS63110004U (2) | ||
| JPH0477259U (2) | ||
| JPS58142940U (ja) | 半導体装置用金属キヤツプ | |
| JPH03119342U (2) | ||
| JPH0276677U (2) | ||
| JPH01161335U (2) | ||
| JPH0178034U (2) | ||
| JPS61121740U (2) | ||
| JPH0319290U (2) | ||
| JPS63110003U (2) | ||
| JPH022843U (2) | ||
| JPS5854504B2 (ja) | 半導体装置 | |
| JPS61151274U (2) | ||
| JPS61141258U (2) |