JPH01144697A - Method of repairing wiring pattern of circuit board - Google Patents
Method of repairing wiring pattern of circuit boardInfo
- Publication number
- JPH01144697A JPH01144697A JP30427587A JP30427587A JPH01144697A JP H01144697 A JPH01144697 A JP H01144697A JP 30427587 A JP30427587 A JP 30427587A JP 30427587 A JP30427587 A JP 30427587A JP H01144697 A JPH01144697 A JP H01144697A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- wiring pattern
- adhesive
- laser beam
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000012790 adhesive layer Substances 0.000 claims abstract description 16
- 230000002950 deficient Effects 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 17
- 230000007547 defect Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 abstract description 16
- 239000000853 adhesive Substances 0.000 abstract description 14
- 230000001070 adhesive effect Effects 0.000 abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 239000004615 ingredient Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はプリント配線板の回路パターンの欠陥部を修復
するための修復方法に関するもので、プリント配線板の
製造工程に於いて利用されるものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a repair method for repairing a defective portion of a circuit pattern of a printed wiring board. It is used in a variety of ways.
（従来の技術）
本発明に係る従来技術としては、特開昭６１−１８９６
９２号公報がある。(Prior art) As a prior art related to the present invention, Japanese Patent Application Laid-Open No. 61-1896
There is a publication No. 92.
このものは回路パターンのくびれ、断線等の欠陥部の修
正方法として、パターン欠陥部の接続媒体として導体ペ
ーストを用い、この導体ペーストを処理するためにＹＡ
Ｇレーザー光を用いて加熱溶融して両者を互いに溶着す
るもので、特に回路基板の配線パターン修復方法として
金属導体テープをパターン欠陥部に載置しテープ両端を
パターン上にレーザー溶接するか、導体ペーストを加熱
溶融することによりパターン端部とペーストをお互いに
溶着するものである。This method uses conductive paste as a connection medium for pattern defective parts as a method for repairing defective parts such as constrictions and disconnections in circuit patterns.
G laser light is used to heat and melt the two to weld them together.In particular, as a method for repairing wiring patterns on circuit boards, a metal conductor tape is placed on the defective part of the pattern and both ends of the tape are laser welded onto the pattern, or the conductor tape is The pattern end and the paste are welded together by heating and melting the paste.
（発明が解決しようとする問題点）
しかし前記修正方法は１０数μｍの微細パターンの修復
を行う場合に、補修用導体テープをパターン欠陥部に載
置する必要があり、この作業が非常に困難であり、又、
樹脂基板のような導体ペーストが密着し易い基板では有
効であるが、表面がガラスコートされたセラミック基板
のような高硬度で非常に平滑な表面を有する基板上では
密着性を保持するためにガラス溶融温度以上での硬化。(Problem to be Solved by the Invention) However, in the above repair method, when repairing a fine pattern of more than 10 μm, it is necessary to place a repair conductive tape on the defective part of the pattern, which makes this work extremely difficult. And also,
This is effective on substrates to which conductive paste easily adheres, such as resin substrates, but on substrates with high hardness and extremely smooth surfaces, such as glass-coated ceramic substrates, glass is used to maintain adhesion. Curing above the melting temperature.
或いは密着面の改質が必要であり、前記レーザー光によ
る硬化方法では修復部分と基板表面との密着性を保持す
ることは困難である。Alternatively, it is necessary to modify the adhesion surface, and it is difficult to maintain adhesion between the repaired portion and the substrate surface using the laser light curing method.
本発明は回路基板に於ける配線パターン欠陥部を密着用
ペースト、導体ペースト及びＹＡＧレーザー光を用いて
修復する方法に於いて回路基板の表面状態に関係なく密
着性を保持し、かつ微細化されたパターン欠陥部の修復
も容易な修復方法を技術的課題とするものである。The present invention is a method for repairing wiring pattern defects on a circuit board using an adhesive paste, a conductor paste, and a YAG laser beam, which maintains adhesion regardless of the surface condition of the circuit board, and can be miniaturized. A technical challenge is to find an easy repair method for repairing pattern defects.
（問題点を解決するための手段）
前記技術的課題を解決するために講した技術的手段は次
のようである。すなわち、回路基板上の配線パターン欠
陥端部及び端間に密着用ペーストを適量塗布し、ＹＡＧ
又はＣ０２レーザー等のレーザー光により加熱溶着させ
て密着層を形成後、未硬化の密着用ペーストを除去し、
次に導体ペーストを配線パターン端部上及び密着層上に
適量塗布しレーザー光で加熱溶着した後未硬化導体ペー
ストを除去する修復方法で、前記密着用ペーストとして
金−レジネートを主成分とする有機金属ペーストを用い
、又導体ペーストとして金、銀、又は銅を主成分とする
厚膜用ペーストを用いるものである。(Means for solving the problem) The technical means taken to solve the above technical problem are as follows. That is, an appropriate amount of adhesion paste is applied between the defective ends and ends of the wiring pattern on the circuit board, and YAG
Or, after forming an adhesive layer by heating and welding with a laser beam such as a C02 laser, remove the uncured adhesive paste,
Next, an appropriate amount of conductor paste is applied onto the end of the wiring pattern and the adhesive layer, and the uncured conductor paste is removed after being heated and welded with a laser beam. A metal paste is used, and a thick film paste containing gold, silver, or copper as a main component is used as a conductor paste.
（作用）
前記技術的手段は次のように作用する。すなわち、回路
基板に於ける配線パターン欠陥部を密着用ペースト、及
び導体ペースト及びＹＡＧレーザー光を用いて修復する
ことにより高動的なレーザー光の熱変化により回路基板
表面と導電層との間に密着層を形成し、回路基板の表面
状態に関係なく密着性を保持しかつ微細化されたパター
ン欠陥部の修復も極めて容易で最終的な配線パターンの
修復部の線幅は密着用ペーストの溶着幅、つまり改質さ
れたガラスコート面の幅により決定されるもので修復部
の線幅は密着用ペーストのレーザー照射幅により制御す
ることができ極めて信輔性のある密着性及び導電性を得
ることができるものである。(Operation) The technical means operates as follows. That is, by repairing wiring pattern defects on a circuit board using adhesive paste, conductive paste, and YAG laser light, the gap between the circuit board surface and the conductive layer is created by the highly dynamic thermal change of the laser light. Forms an adhesion layer, maintains adhesion regardless of the surface condition of the circuit board, and is extremely easy to repair fine pattern defects.The line width of the repaired portion of the final wiring pattern is determined by welding of the adhesion paste. The line width of the repaired area is determined by the width of the modified glass coated surface, and can be controlled by the laser irradiation width of the adhesive paste, making it possible to obtain extremely reliable adhesion and conductivity. It is something that can be done.
（実施例） 以下実施例について説明する。(Example) Examples will be described below.
第１図は配線パターン１の欠陥部の１例で、（イ）は断
線で、（ロ）は欠損を示す。FIG. 1 shows an example of a defective portion of the wiring pattern 1, in which (a) shows a disconnection and (b) shows a defect.
第２〜第５図に於いて、２はガラスコートされたセラミ
ック基板で、３はガラスコート部、４は密着用ペースト
で、金−レジネートを主成分とする有機金属ペーストよ
りなり、８はＹＡＧレーザー光線を示し、５は密着層で
、６ば導体ペーストで金、銀又は銅を主成分とする厚膜
用ペーストで、７は導電層である。In Figs. 2 to 5, 2 is a glass-coated ceramic substrate, 3 is a glass coating part, 4 is an adhesion paste made of an organic metal paste whose main component is gold-resinate, and 8 is a YAG A laser beam is shown, 5 is an adhesive layer, 6 is a conductive paste, which is a thick film paste containing gold, silver or copper as a main component, and 7 is a conductive layer.
前記構成に於いて配線パターンの修復について説明すれ
ば、配線パターン１の断線部又は欠陥部に密着用ペース
ト４を注射針等を用いて適量塗布し、次に塗布した密着
用ペーストを乾燥させた後にＹＡＧレーザー光８により
密着用ペースト４とセラミック基板２のガラスコート面
３及びパターン断線端部を加熱溶着する。これにより密
着用ペースト４は加熱されて硬化し配線パターン断線端
部及びガラスコート部に密着する。次にこの溶着部を有
機溶媒中での超音波洗浄により未硬化の密着用ペースト
を除去し密着層５を形成するものである。To explain the repair of the wiring pattern in the above configuration, an appropriate amount of the adhesive paste 4 is applied to the broken or defective part of the wiring pattern 1 using a syringe needle, etc., and then the applied adhesive paste is dried. Afterwards, the adhesive paste 4 is heated and welded to the glass coated surface 3 of the ceramic substrate 2 and the pattern disconnection end using a YAG laser beam 8. As a result, the adhesive paste 4 is heated and hardened, and adheres closely to the disconnected end of the wiring pattern and the glass coated portion. Next, the uncured adhesion paste is removed from this welded portion by ultrasonic cleaning in an organic solvent to form the adhesion layer 5.
次に導電層７を形成するために第４図に示すように密着
層形成の場合と同様に密着層５及びパターン断線上に金
、銀又は銅を主成分とする厚膜用ペーストである導体ペ
ースト６を適量塗布する。Next, in order to form a conductive layer 7, as shown in FIG. 4, a conductor, which is a thick film paste containing gold, silver, or copper as a main component, is applied on the adhesive layer 5 and the pattern disconnection, as in the case of forming the adhesive layer. Apply an appropriate amount of paste 6.
次に導体ペースト乾燥後、ＹＡＧレーザー光８を用いて
導体ペースト６と密着層５及びパターン断線端部とを加
熱溶着する。Next, after drying the conductive paste, the conductive paste 6, the adhesive layer 5, and the pattern disconnection ends are heat-welded using a YAG laser beam 8.
第５図は未硬化の導体ペーストを有機溶媒中で超音波洗
浄し除去した後の状態を示すもので、導電層７は密着層
上でのみ基板表面上に保持されるものである。FIG. 5 shows the state after the uncured conductive paste is removed by ultrasonic cleaning in an organic solvent, and the conductive layer 7 is held on the substrate surface only on the adhesive layer.
導電層７の幅は密着層５の幅により制御できるので、導
電層形成時のレーザー光照射幅の制御は必要ない。以上
述べた各工程により回路基板の配線パターン断線部の修
復作業は完了する。Since the width of the conductive layer 7 can be controlled by the width of the adhesive layer 5, it is not necessary to control the laser beam irradiation width when forming the conductive layer. Through each of the steps described above, the repair work for the disconnected portion of the wiring pattern on the circuit board is completed.
この様に配線パターン欠陥部の修復が容易に行うことが
でき、導体ペーストの硬化、密着保持が困難なガラスコ
ートされたセラミック基板上の修復にも利用できるもの
である。In this way, defective portions of wiring patterns can be easily repaired, and the present invention can also be used to repair glass-coated ceramic substrates where it is difficult to harden and maintain close contact with the conductive paste.
本発明は次の効果を有する。すなわち、導電層と基板表
面間に密着層を形成することにより、高硬度、高耐熱で
非常に平滑な表面を有する回路基板上においても、密着
性を保持した配線パターンの修復が可能であり、又この
ような特徴を有する基板上では密着層上にのみ導電層は
保持されるために導電層の形状制御は密着層成形時のレ
ーザー光照射幅の制御により決定されるものである。The present invention has the following effects. In other words, by forming an adhesion layer between the conductive layer and the substrate surface, it is possible to repair wiring patterns that maintain adhesion even on circuit boards that have high hardness, high heat resistance, and a very smooth surface. Further, on a substrate having such characteristics, since the conductive layer is held only on the adhesive layer, control of the shape of the conductive layer is determined by controlling the laser beam irradiation width when forming the adhesive layer.
このことは金等の熱伝導性の大きな導体ペーストを用い
る場合に、加熱溶着レーザービーム径よりも広範囲・で
熱伝導による溶着が発生し形成される導電層の線幅はレ
ーザービーム径より大きなものとなる。然し本発明では
導体層の線幅は密着層の線幅によって決定されるために
、導体ペーストの熱伝導性の違いによる影響は小さく、
熱伝導性の大きなペーストを用いても微細な加工部分の
修復が可能である。This means that when using a conductive paste with high thermal conductivity such as gold, welding occurs over a wider range than the laser beam diameter for thermal welding, and the line width of the conductive layer formed is larger than the laser beam diameter. becomes. However, in the present invention, the line width of the conductor layer is determined by the line width of the adhesive layer, so the difference in thermal conductivity of the conductor paste has little effect.
Even using a paste with high thermal conductivity, it is possible to repair finely machined parts.
第１図は配線パターンの欠陥部の平面図で、（イ）は断
線部、（ロ）は欠損部を示し、第２図〜第５図は欠陥部
の修復方法の説明図で、第２図の（イ）は密着用ペース
トを塗布した平面図、（ロ）は加熱溶着中の断面図、第
３図は未硬化の密着用ペーストの洗浄後の状況で、（イ
）は平面図、（ロ）は断面図、第４図の（イ）は導体ペ
ーストを塗布した平面図、（ロ）は加熱溶着中の断面図
、第５図は未硬化の導体ペーストの洗浄後の状況で、（
イ）は平面図、（ロ）は断面図である。
１・・・配線パターン。
４・・・密着用ペースト。
５・・・密着層。
６・・・導体ペースト。
７・・・導体層。Fig. 1 is a plan view of a defective part of a wiring pattern, (a) shows a broken part and (b) shows a defective part, and Figs. In the figure, (a) is a plan view after applying the adhesive paste, (b) is a cross-sectional view during heat welding, Figure 3 is the state after cleaning the uncured adhesive paste, and (a) is a plan view. (B) is a cross-sectional view, (A) in Figure 4 is a plan view with the conductive paste applied, (B) is a cross-sectional view during heat welding, and Figure 5 is the state after cleaning the uncured conductor paste. (
A) is a plan view, and (b) is a cross-sectional view. 1...Wiring pattern. 4... Paste for close contact. 5... Adhesive layer. 6... Conductor paste. 7... Conductor layer.
Claims (1)
に於いて、前記欠陥部および欠陥端部に密着用ペースト
を塗布し、次にレーザー光にて加熱溶着し密着層を形成
後、未硬化の密着用ペーストを除去し、次に導体ペース
トを前記密着層上に適量塗布し、レーザー光で加熱溶着
した後、未硬化導体ペーストを除去して導体層を設ける
配線パターン修復方法。In a pattern repair method for a wiring pattern defect on a circuit board, an adhesion paste is applied to the defect and the defective edge, and then heated and welded with laser light to form an adhesion layer, and then an uncured adhesion paste is applied. A method for repairing a wiring pattern, in which a conductive paste is removed, an appropriate amount of a conductive paste is applied onto the adhesive layer, the adhesive layer is heated and welded with a laser beam, and an uncured conductive paste is removed to form a conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30427587A JPH01144697A (en) | 1987-11-30 | 1987-11-30 | Method of repairing wiring pattern of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30427587A JPH01144697A (en) | 1987-11-30 | 1987-11-30 | Method of repairing wiring pattern of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01144697A true JPH01144697A (en) | 1989-06-06 |
Family
ID=17931084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30427587A Pending JPH01144697A (en) | 1987-11-30 | 1987-11-30 | Method of repairing wiring pattern of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01144697A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101188A (en) * | 1988-10-11 | 1990-04-12 | Hitachi Ltd | Metal plating method |
| JPH02246396A (en) * | 1989-03-20 | 1990-10-02 | Rohm Co Ltd | Forming method for wire disconnecting pattern |
| JPH03141135A (en) * | 1989-10-26 | 1991-06-17 | Tanaka Kikinzoku Kogyo Kk | Formation of metallic film |
| US6035526A (en) * | 1997-11-18 | 2000-03-14 | Ntn Corporation | Method of repairing defect and apparatus for repairing defect |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
| CN109561599A (en) * | 2018-12-12 | 2019-04-02 | 广东科翔电子科技有限公司 | A kind of circuit mending method of high-precision fine rule road PCB |
| CN110267452A (en) * | 2019-06-03 | 2019-09-20 | 深圳市华星光电技术有限公司 | A kind of broken wire repair method and device |
| WO2019203050A1 (en) * | 2018-04-16 | 2019-10-24 | 株式会社ブイ・テクノロジー | Wiring correction device and wiring correction method |
-
1987
- 1987-11-30 JP JP30427587A patent/JPH01144697A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02101188A (en) * | 1988-10-11 | 1990-04-12 | Hitachi Ltd | Metal plating method |
| JPH02246396A (en) * | 1989-03-20 | 1990-10-02 | Rohm Co Ltd | Forming method for wire disconnecting pattern |
| JPH03141135A (en) * | 1989-10-26 | 1991-06-17 | Tanaka Kikinzoku Kogyo Kk | Formation of metallic film |
| US6035526A (en) * | 1997-11-18 | 2000-03-14 | Ntn Corporation | Method of repairing defect and apparatus for repairing defect |
| CN109302793A (en) * | 2017-07-25 | 2019-02-01 | 双鸿电子(惠州)有限公司 | A kind of PCB mark mending method |
| WO2019203050A1 (en) * | 2018-04-16 | 2019-10-24 | 株式会社ブイ・テクノロジー | Wiring correction device and wiring correction method |
| CN109561599A (en) * | 2018-12-12 | 2019-04-02 | 广东科翔电子科技有限公司 | A kind of circuit mending method of high-precision fine rule road PCB |
| CN110267452A (en) * | 2019-06-03 | 2019-09-20 | 深圳市华星光电技术有限公司 | A kind of broken wire repair method and device |
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