JPH01145167U - - Google Patents

Info

Publication number
JPH01145167U
JPH01145167U JP4026588U JP4026588U JPH01145167U JP H01145167 U JPH01145167 U JP H01145167U JP 4026588 U JP4026588 U JP 4026588U JP 4026588 U JP4026588 U JP 4026588U JP H01145167 U JPH01145167 U JP H01145167U
Authority
JP
Japan
Prior art keywords
mounting board
density mounting
electrical
substrate
conduct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4026588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4026588U priority Critical patent/JPH01145167U/ja
Publication of JPH01145167U publication Critical patent/JPH01145167U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案に係る高密度実装基板を構成
とするハイブリツドＩＣの概略図、第２図は、第
１図に示すハイブリツドＩＣの側面図、第３図は
、従来の高密度実装基板を構成とするハイブリツ
ドＩＣの概略図、第４図は、第３図に示すハイブ
リツドＩＣの側面図。 ２…高密度実装基板（基板）、５…パターン（
電気通路）、６…導通端子（導通部材）。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表裏両面に電気通路５が形成された基板２に、
    前記表面と裏面に各々形成されている前記電気通
    路５を導通させる導通部材６を装着してなること
    を特徴とする高密度実装基板。
JP4026588U 1988-03-29 1988-03-29 Pending JPH01145167U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4026588U JPH01145167U (ja) 1988-03-29 1988-03-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4026588U JPH01145167U (ja) 1988-03-29 1988-03-29

Publications (1)

Publication Number Publication Date
JPH01145167U true JPH01145167U (ja) 1989-10-05

Family

ID=31266739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4026588U Pending JPH01145167U (ja) 1988-03-29 1988-03-29

Country Status (1)

Country Link
JP (1) JPH01145167U (ja)

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