JPH01150829A - Method for adjusting mechanical impact force in processing electronic chip parts and mechanical impact force sensor - Google Patents

Abstract

PURPOSE:To derive impact force which electronic chip parts receive by an exact value and to surely prevent the generation of a physical failure of the electronic chip parts caused by impact by providing a mechanical impact force sensor consisting of the same shape as the electronic chip parts and having piezoelectric property. CONSTITUTION:First of all, the mechanical impact force sensor 1 which consists of the same shape as electronic chip parts and has a piezoelectric property is prepared, and the sensor 1 is inserted into the recessed part 10 of a base 6. Subsequently, a measuring terminal 7 and a measuring terminal 8 are moved to the upper part and the lower part, respectively, and both the measuring terminals 7, 8 are allowed to abut on the external electrode 3 of the sensor 1. By impact force in this case, a voltage corresponding to whether the impact force is large or small is generated in the sensor 1. This output voltage is measured and recorded by the oscilloscope of a measuring instrument 9 through the measuring terminals 7, 8. Subsequently, the peak value of the output voltage generated first is converted to impact force by using a piezoelectric constant measured in advance with regard to the sensor 1, and impact force generated due to a fact that the measuring terminals 7, 8 abut on the sensor 1 at the time of measurement is derived. In such a way, the generation of a physical failure of the electronic chip parts caused by an impact can be prevented surely.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a mechanical impact force adjustment method and a mechanical impact force sensor, and in particular to a mechanical impact force adjustment method and a mechanical impact force adjustment method during processing of electronic chip parts. Regarding the mechanical impact force sensor used.

[Prior Art] Many electronic chip components that constitute reactance, conductance, resistance, etc. are mainly made of porcelain. Furthermore, electronic chip components are becoming smaller and thinner due to the so-called light, thin, and short market needs.
The mechanical strength of these electronic chip components, especially the strength against mechanical impact forces, tends to decrease.

On the other hand, the speed of characteristic sorting machines and placement machines for electronic chip components tends to increase, and electronic chip components receive large mechanical impact forces from measurement terminals of characteristic sorting machines, positioning claws of placement machines, and the like. Therefore, it is necessary to accurately grasp the magnitude of this mechanical impact force and adjust the impact force that the electronic chip component receives to an appropriate value.

For the adjustment, a sensor called a load cell has conventionally been used as a mechanical impact force sensor. This sensor has a structure in which a resistor is attached to the side surface of a metal substrate, and is configured to detect a mechanical impact force applied to the metal substrate based on a change in resistance.

[Problems to be Solved by the Invention] The load cell not only has a completely different shape from the electronic chip component whose mechanical impact force is to be measured, but also is much larger than the electronic chip component. For this reason,
According to the above-mentioned conventional configuration, when measuring the mechanical impact force received when processing electronic chip parts with a characteristic sorter or a loading machine, it is necessary to remove or change the parts and jigs of the equipment. must be done. Moreover, the mechanical impact force must be measured under conditions that are quite different from the actual situation. Further, the load cell has a substrate made of metal,
Because it has a different rigidity and coefficient of repulsion than porcelain, the impact force measured will be quite different from the impact force actually experienced by electronic chip components.

In this way, with the conventional configuration, it is only possible to measure a mechanical impact force that is far removed from the actual impact force that electronic chip components receive, which requires adjustment of the impact force. It cannot be used as an accurate standard for adjustment.

An object of the present invention is to provide a mechanical shock during the processing of electronic chip parts that can accurately determine the impact force applied to electronic chip parts and reliably prevent the occurrence of physical defects in electronic chip parts due to impact. An object of the present invention is to provide a force adjustment method and a mechanical impact force sensor.

[Means for Solving the Problems] The method for adjusting mechanical impact force during electronic chip component processing according to the present invention includes the following steps.

■ The process of preparing a piezoelectric mechanical shock force sensor that has the same shape as the electronic chip component.

■ A process in which sensors are processed using processing equipment in the same way that electronic chip components are processed.

■ The process of measuring the output voltage generated by the impact that the sensor receives when processing the sensor, and then calculating the impact force that the sensor receives.

■ The process of adjusting the processing operation of the processing equipment based on the calculated impact force.

■ After that, the process of processing the electronic chip components using processing equipment.

Note that the processing device is, for example, a characteristic sorter that measures and sorts the electrical characteristics of electronic chip components, or a chip mounting machine that mounts electronic chip components onto a substrate.

The mechanical impact force sensor according to the present invention includes a sensor body made of piezoelectric ceramic and a pair of external electrodes provided on the sensor body. The entire mechanical impact force sensor is formed in the same shape as an electronic chip component that requires mechanical impact force adjustment during processing.

Note that, for example, the mechanical impact force sensor according to the present invention is
It further includes a lead wire attached to the external electrode.

Further, for example, the external electrodes are respectively provided on a pair of opposing end surfaces of the sensor body.

[Function] In the method for adjusting mechanical impact force during electronic chip component processing according to the present invention, a mechanical impact force sensor having the same shape as the electronic chip component and having piezoelectricity is used. Then, the sensor is processed by a processing device in the same way as when processing electronic chip components.

As a result, the mechanical impact force sensor receives an impact force similar to the impact force applied to the electronic chip component when processed by the processing device.

When the mechanical impact force sensor receives an impact force, the mechanical impact force sensor outputs a voltage corresponding to the magnitude of the impact force. By calculating the impact force based on this output voltage, it is possible to obtain an accurate value of the impact force that the electronic chip component receives when it is processed.

By adjusting the processing operation of the processing device based on the impact force obtained by calculation, it is possible to reliably prevent the occurrence of physical defects in the electronic chip components when processing the electronic chip components thereafter.

The entire mechanical impact force sensor according to the present invention is formed in the same shape as an electronic chip component that requires mechanical impact force adjustment during processing. From this, it is possible to accurately determine the impact force applied to electronic chip components by using the mechanical impact force sensor and performing the processing process in the same processing equipment as when processing electronic chip components. Become.

[Example 1] FIG. 1 shows a mechanical impact force sensor 1 according to the present invention. The mechanical impact force sensor 1 has a generally rectangular parallelepiped shape,
The external shape is the same as that of an electronic chip component to be processed by a processing device to be described later. The mechanical impact force sensor 1 includes a sensor body 2 formed by sintering a material mainly containing titanic acid, zirconate, and lead (PZT-based material), and a sensor body 2 formed on mutually opposing end surfaces of the sensor body 2. It has a pair of external electrodes 3.

The size of the sensor body 2 is, for example, 3.2 x 1.6
1. It is Omm. Further, the sensor main body 2 has been subjected to polarization treatment in advance, and its piezoelectric constant and capacitance have been measured in advance. The external electrodes 3 are formed by printing and baking a paste mainly composed of silver. Polarization of the sensor body 2 is performed by applying a high voltage in hot oil after baking the external electrode 3.

After the polarization process, the piezoelectric constant and capacitance of the sensor 1 are measured.

Next, a mechanical impact force adjustment method according to the present invention will be explained using the mechanical impact force sensor 1 shown in FIG.

Adjustment Method 1 FIG. 2 schematically shows a characteristic sorter 5 that measures and sorts the characteristics of electronic chip components. In FIG. 2, the characteristic sorter 5 includes a stand 6 that holds a large number of electronic chip components;
It has a pair of AIIJ constant terminals 7, 8 that can come into contact with electrodes of electronic chip components, and a characteristic measuring device 9 connected to the A11J constant terminal 7.8 and having an oscilloscope.

The stand 6 has a large number of recesses 10 that open upward, and electronic chip components are inserted into the recesses 10 and held therein. A small diameter hole 11 is formed between the bottom surface of the recess 10 and the lower surface of the base 6, through which the lower measurement terminal 7 can come into contact with the electrode of the electronic chip component. Further, the depth of the recess 10 is set to such an extent that the upper end of the electronic chip component slightly protrudes upward when the electronic chip component is inserted, so that the electrode at the upper end of the electronic chip component is connected to the measurement terminal 8. It is now possible to contact.

When implementing the mechanical impact force adjustment method according to the present invention,
First, a mechanical impact force sensor 1 shown in FIG. 1 having the same shape as an electronic chip component and having piezoelectric properties is prepared.

The mechanical impact force sensor 1 is inserted into the recess 10 of the base 6 as shown in FIG. Then, in the same way as when processing electronic chip components, the measuring terminals 7 and 8 are moved upward and the measuring terminals 8 are moved downward, and both measuring terminals 7 and 8 are brought into contact with the external electrode 3 of the mechanical impact force sensor 1. (Figure 3). Due to the impact force at this time, a voltage is generated in the mechanical impact force sensor 1 according to the magnitude of the impact force. The output voltage is measured with the oscilloscope of the measuring device 9 via the measuring terminal 7.8 and recorded. Incidentally, the change in the output voltage measured by the measuring device is as shown in FIG. 4, for example. The peak value A of the output voltage that occurs first in FIG. 4 is converted into impact force using the piezoelectric constant measured in advance for the mechanical impact force sensor, and the The impact force generated by contacting the force sensor 1 is determined.

At this time, the measurement operation performed is exactly the same as the 11FJ constant operation for electronic chip components, and since the mechanical impact force sensor 1 has the same shape as the electronic chip component, when the electronic chip component is actually measured, The impact force received can be determined with an accurate value.

Next, from the impact force obtained by the above calculation, the measuring terminal 7
．． The degree of contact with the electronic chip component 8 is determined, and the operation of the measurement terminals 7 and 8 of the characteristic sorter 5 is adjusted so that an appropriate contact force is achieved. After the adjustment, the electronic chip component is inserted into the recess 10 of the characteristic sorter 5, the characteristics of the electronic chip component are measured, and the electronic chip component is sorted. In this case, since the impact force applied to the electronic chip components is determined in advance as an accurate value, and the processing operation of the characteristic sorter 5 is adjusted based on it, the occurrence of physical defects in the electronic chip components is reliably prevented. can.

Adjustment method 2 FIG. 5 is a schematic diagram of the chip tube forming machine 15.

In FIG. 5, the suction nozzle 16 arranged above is a generally cylindrical member, and is adapted to suction air from its tip by being connected to a voltage device (not shown). A pair of positioning claws 17, 18 are arranged on both sides of the suction nozzle 16. Below the suction nozzle 16 is a printed circuit board 2 having printed wiring 19 on its upper surface.
0 is located. Further, the mechanical impact force sensor 1 shown in FIG. 5 has lead wires 21 connected to the external electrodes 3 at both ends thereof. Each lead wire 21 is connected to a measuring device 22 having an oscilloscope.

When carrying out this mechanical impact force adjustment method, first, a piezoelectric mechanical impact force sensor 1 having the same shape as an electronic chip component is prepared, a lead wire 21 is connected to the bisexual electrode 3, and a lead wire 21 is connected to the bisexual electrode 3. The external electrode 3 is connected via a line 21 to a measuring device 22 .

Adsorb 1. Next, the positioning claw 17 is brought into contact with the electrode 3 of the mechanical impact force sensor 1, as shown in FIG. As a result, the mechanical impact force sensor is placed at a predetermined position at the lower end of the suction nozzle 16. In this operation, the positioning claws 17, 18 come into contact with the electrode 3, so that the mechanical impact force sensor 1 generates a voltage depending on the magnitude of the impact force. The output voltage is input to the measuring device 22 via the electrode 3 and the lead wire 21. The measuring device 22 converts the peak value of the output voltage into an impact force using a piezoelectric constant measured in advance to determine the impact force.

Next, the positioning claws 17, 18 are released from the mechanical impact force sensor 1 and returned to their original positions, and then the suction nozzle 16 is moved downward. Then, the mechanical impact force sensor 1 is placed on the printed wiring 19 on the printed circuit board 20 using the suction nozzle 16 as shown in FIG. Due to this operation, the mechanical impact force sensor 1 receives the impact force again and generates a voltage. This output voltage is also input manually to the measuring device 22, and the impact force is calculated using the peak value of the output voltage and the piezoelectric constant of the mechanical impact force sensor 1 measured in advance.

Next, from the impact force obtained by calculation, the positioning claw 1
The operation of 7.18 and the operation of the suction nozzle 16 are adjusted so that excessive impact force is not applied to the electronic chip components.

After the adjustment, electronic chip components are mounted onto the printed circuit board 20 using the chip mounting machine 15.

In this case as well, the impact force that the electronic chip component receives is determined as an accurate value, and based on that, the chip mounting machine 15
Since the operation of the electronic chip is regulated, it is possible to reliably prevent the occurrence of physical defects in electronic chip components.

Adjustment Method 3 As shown in FIG. 8, the measuring device 22 may be connected to the positioning claws 17 and 18 of the chip mounting machine 15 used in the adjustment method 2 through lead wires 25. In this case, it is not necessary to provide the mechanical impact force sensor 1 with the lead wire 21. Further, the positioning claws 17 and 18 are made of metal.

In this adjustment method, a piezoelectric mechanical impact force sensor 1 having the same shape as the electronic chip component is prepared, and an operation similar to a normal chip mounting operation is performed using the mechanical impact force sensor. First, as shown in FIG. 8, the mechanical impact sensor 1 is attracted to the lower end of the suction nozzle 16. Next, the positioning claws 17 and 18 are brought into contact with the external electrode 3 of the mechanical impact force sensor 1, and the suction posture of the mechanical impact force sensor 1 by the suction nozzle 16 is corrected (FIG. 9). At this time, the positioning claw 17
．． 18, the mechanical impact force sensor 1 receives an impact force,
A voltage is generated according to the magnitude of the impact force. This output voltage is input to the measuring device 22 via the positioning claws 17 and 18 and the lead wire 25. In the measuring device 22,
Calculate impact force based on input voltage.

Next, the processing operation of the chip mounting machine 15 is adjusted based on the impact force obtained by calculation, and the impact force applied to the electronic chip component by the positioning claws 17, 18 is adjusted.

Thereafter, the chip mounting machine 15 is used to mount electronic chip components onto the printed circuit board 20.

In that case, the electronic chip component is located at the positioning claw 17.
Since the impact force received from the electronic chip component 18 is adjusted in advance based on an accurate value calculated using the mechanical impact force sensor 1, it is possible to reliably prevent the occurrence of physical defects in the electronic chip component.

Note that the mechanical impact force sensor 1 according to the present invention can have various shapes depending on the shape of the electronic chip component. For example, as shown in FIG. 10, the sensor body 2 may have a cylindrical shape, and external electrodes 3 made of metal paste and a metal cap may be provided at both ends of the sensor body 2.

[Effects of the Invention] According to the method for adjusting mechanical impact force during processing of electronic chip parts according to the present invention, it becomes possible to substantially determine the impact force in the actual operating state of the processing equipment for electronic chip parts. ,
It becomes possible to obtain accurate values for the impact force that electronic chip components receive.

Therefore, by applying the mechanical impact force adjustment method according to the present invention to, for example, a characteristic sorter or a chip mounting machine on a production line, it is possible to reliably prevent the occurrence of physical defects in electronic chip components due to impact. become able to.

In addition, according to the mechanical impact force sensor according to the present invention, since the entire sensor is formed in the same shape as an electronic chip component that requires mechanical impact force adjustment during processing, electronic It becomes possible to accurately determine the impact force that chip parts receive.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a mechanical impact force sensor according to the present invention. FIG. 2 is a schematic vertical cross-sectional view of a characteristic sorter used in the method for adjusting mechanical impact force during electronic chip component processing according to the present invention. FIG. 3 is a schematic vertical cross-sectional view showing one operating state of the characteristic sorter. FIG. 4 is a graph showing changes over time in the output voltage of the mechanical impact force sensor. Figure 5 shows
It is a longitudinal cross-sectional schematic diagram of the chip mounting machine used for the mechanical impact force adjustment method in other Examples. 6 and 7 are schematic vertical cross-sectional views showing the operating state of the chip mounting machine in the embodiment of FIG. 5. FIG. FIG. 8 is a schematic diagram of a chip mounting machine used in a mechanical impact force adjustment method according to yet another embodiment. FIG. 9 is a schematic diagram showing one operating state of the chip tube-packing machine in the embodiment of FIG. 8. FIG. 10 is a perspective view of a mechanical impact force sensor in yet another embodiment. 1 is a sensor, 2 is a sensor body, 3 is an external electrode, 5 is a characteristic sorter, 9, 22 is a measuring device, 15 is a chip mounting machine, 7
, 8 is an n1 constant terminal, 17 and 18 are positioning claws, and 21 is a lead wire.

Claims (9)

[Claims] (1) A step of preparing a piezoelectric mechanical impact force sensor having the same shape as an electronic chip component, a step of processing the sensor with a processing device in the same manner as when processing the electronic chip component, and processing the sensor. a step of measuring the output voltage generated by the impact received by the sensor and then calculating the impact force received by the sensor, and adjusting the processing operation of the processing device based on the impact force obtained by the calculation. A method for adjusting mechanical impact force during electronic chip component processing, comprising: a step of processing the electronic chip component with the processing device. (2) Claim 1, wherein the processing device is a characteristic sorter that measures and sorts the electrical characteristics of electronic chip components.
A method for adjusting mechanical impact force during processing of electronic chip parts as described in . (3) The method for adjusting mechanical impact force during electronic chip component processing according to claim 2, wherein the output voltage from the sensor is measured using a measurement terminal of the characteristic sorter. (4) The method for adjusting mechanical impact force during electronic chip component processing according to claim 1, wherein the processing device is a chip mounting machine that mounts the electronic chip component onto a substrate. (5) The method for adjusting mechanical impact force during electronic chip component processing according to claim 4, wherein the output voltage from the sensor is measured through a lead wire provided to the sensor. (6) The method for adjusting mechanical impact force during electronic chip component processing according to claim 4, wherein the output voltage from the sensor is measured through a positioning claw provided on the chip mounting machine. (7) Comprising a sensor body made of piezoelectric porcelain and a pair of external electrodes provided on the sensor body, the whole is formed in the same shape as an electronic chip component that requires mechanical impact force adjustment during processing. A mechanical impact force sensor. (8) The mechanical impact force sensor according to claim 7, further comprising a lead wire attached to the external electrode. (9) The external electrode is provided on a pair of opposing end surfaces of the sensor body, respectively.
Mechanical impact force sensor as described in section.