JPH0115151Y2 - - Google Patents
Info
- Publication number
- JPH0115151Y2 JPH0115151Y2 JP8490582U JP8490582U JPH0115151Y2 JP H0115151 Y2 JPH0115151 Y2 JP H0115151Y2 JP 8490582 U JP8490582 U JP 8490582U JP 8490582 U JP8490582 U JP 8490582U JP H0115151 Y2 JPH0115151 Y2 JP H0115151Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- terminal
- integrated circuit
- feedthrough
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
この考案は端子に貫通コンデンサを取付けた集
積回路に関するものである。[Detailed Description of the Invention] This invention relates to an integrated circuit in which feedthrough capacitors are attached to terminals.
電子部品として広く一般に用いられている集積
回路ICには、コンデンサを設けてノイズフイル
タの働きをさせ、集積回路にノイズが入らないよ
うにしている。 Integrated circuit ICs, which are widely used as electronic components, are equipped with capacitors that act as noise filters to prevent noise from entering the integrated circuit.
ところで、従来の集積回路におけるコンデンサ
の組込みは、第1図に示すように集積回路1の端
子2と別の回路3との間にコンデンサ4を挿入し
た外付構造であつたため、集積回路1に対するコ
ンデンサ4のしめる面積が大きく、機器への組込
みに広いスペースを必要とする問題がある。 Incidentally, in the conventional integrated circuit, the capacitor was incorporated in an external structure in which a capacitor 4 was inserted between the terminal 2 of the integrated circuit 1 and another circuit 3 as shown in FIG. There is a problem in that the area occupied by the capacitor 4 is large, and a large space is required for incorporation into equipment.
また、コンデンサ4が外付けであると、リード
インダクタンスまたはパターンによるインダクタ
ンスが大きいのでノイズ除去効果が悪いという欠
点がある。 Furthermore, if the capacitor 4 is externally attached, there is a drawback that the noise removal effect is poor because the lead inductance or the inductance due to the pattern is large.
この考案は、上記のような問題や欠点を解消す
るためになされたものであり、集積回路から引出
された端子に、この端子を貫通端子とする貫通コ
ンデンサを取付けるようにし、集積回路の面積内
にコンデンサの組込みが行なえ、小型化により組
込みスペースが少なくてすみ、しかもノイズ除去
効果の優れた集積回路を提供することを目的とす
る。 This idea was made in order to eliminate the problems and drawbacks mentioned above, and by attaching a feedthrough capacitor that uses this terminal as a feedthrough terminal to the terminal drawn out from the integrated circuit, it is possible to reduce the area within the area of the integrated circuit. It is an object of the present invention to provide an integrated circuit in which a capacitor can be incorporated into a circuit, which requires less space for integration due to miniaturization, and which has an excellent noise removal effect.
以下、この考案の実施例を添付図面の第2図乃
至第11図にもとづいて説明する。 Embodiments of this invention will be described below with reference to FIGS. 2 to 11 of the accompanying drawings.
第2図乃至第5図に示す第1の例は、集積回路
1の両側から下向きに引出された各端子2にこの
端子2を貫通端子とする貫通コンデンサ11を取
付け、各貫通コンデンサ11のアース側電極にシ
ヤーシ基板12またはプリント基板を共用して取
り付けたものである。 In the first example shown in FIGS. 2 to 5, a feedthrough capacitor 11 is attached to each terminal 2 pulled out downward from both sides of the integrated circuit 1, and each feedthrough capacitor 11 is connected to the feedthrough capacitor 11, and each feedthrough capacitor 11 is grounded. A chassis board 12 or a printed circuit board is commonly attached to the side electrodes.
貫通コンデンサ11は、第5図に示すように、
セラミツク等を用いて筒状に形成したコンデンサ
本体13の内外面に電極14と15を設けたもの
であり、内部を貫通する端子2と内側の電極15
を半田16によつて接続すると共に外側アース側
電極14をシヤーシ基板12とを半田17により
接続し、集積回路1に入るノイズを各貫通コンデ
ンサ11でアースに逃がすようになつている。 The feedthrough capacitor 11, as shown in FIG.
Electrodes 14 and 15 are provided on the inner and outer surfaces of a capacitor body 13 formed into a cylindrical shape using ceramic or the like, with terminals 2 passing through the interior and electrodes 15 on the inside.
are connected by solder 16, and the outer ground side electrode 14 is connected to chassis substrate 12 by solder 17, so that noise entering the integrated circuit 1 is released to the ground by each feedthrough capacitor 11.
第2図は、集積回路1から引出されたアース端
子2aにシヤーシ基板12を半田18で接続し、
シヤーシ基板12を各貫通コンデンサ11の共用
アースとしたものであるが、シヤーシ基板12に
直接アースの端子を設けたり、各貫通コンデンサ
11ごとにアース端子を接続するようにしてもよ
い。 In FIG. 2, a chassis board 12 is connected to a ground terminal 2a drawn out from an integrated circuit 1 with solder 18,
Although the chassis board 12 is used as a common ground for each feedthrough capacitor 11, a ground terminal may be provided directly on the chassis board 12, or a ground terminal may be connected to each feedthrough capacitor 11.
第6図乃至第8図は、シヤーシ基板12の具体
的な構造とこれに一体的に設けるアース端子19
の異なつた形状を例示しており、貫通コンデンサ
11の嵌合孔20が形成されたシヤーシ基板12
の両端に第6図は二本づつのアース端子19を、
第7図では端部の中央に第8図では一方のコーナ
に各々一本づゝアース端子19を設けている。 6 to 8 show the specific structure of the chassis board 12 and the ground terminal 19 provided integrally therewith.
The chassis board 12 has a fitting hole 20 for a feedthrough capacitor 11 formed therein.
In Fig. 6, two ground terminals 19 are connected to each end of the
One ground terminal 19 is provided at the center of the end in FIG. 7 and one at one corner in FIG. 8.
第6図ないし第8図の例では端子19をアース
として使用するものとして示したが、これをプリ
ント基板や機器のケースへの取付用として兼用あ
るいは単独で用いてもよい。 In the examples shown in FIGS. 6 to 8, the terminal 19 is shown as being used as a ground, but it may also be used for mounting on a printed circuit board or an equipment case, or may be used alone.
次に、第9図乃至第11図に示す例は、フラツ
トパツク集積回路に適用した場合であり、端子2
は集積回路1の両側から平行状態で突出し、各端
子2に、この端子を貫通端子とする貫通コンデン
サ11が取付けられ貫通コンデンサ11を貫通し
た端子2の先端は別のパターン線と接続される。 Next, the examples shown in FIGS. 9 to 11 are cases where the flatpack integrated circuit is applied, and the terminal 2
project in parallel from both sides of the integrated circuit 1, and a feedthrough capacitor 11 with this terminal as a feedthrough terminal is attached to each terminal 2, and the tip of the terminal 2 passing through the feedthrough capacitor 11 is connected to another pattern line.
各貫通コンデンサ11は、第11図のように、
例えばプリント基板21上に重ねられ、半田22
によつて外側電極14がグランドパターン23と
接続される。 Each feedthrough capacitor 11 is, as shown in FIG.
For example, it is stacked on a printed circuit board 21 and soldered 22.
The outer electrode 14 is connected to the ground pattern 23 by.
前記プリント基板21の各貫通コンデンサ11
が重なる面には、貫通コンデンサ11が嵌り合う
適当な形状の凹部24またはうちぬき穴が設けら
れ、貫通コンデンサ11の位置決が安定よく行な
えるようになつている。 Each feedthrough capacitor 11 on the printed circuit board 21
A recess 24 or a cut-out hole of an appropriate shape into which the feedthrough capacitor 11 fits is provided on the surface where the feedthrough capacitors 11 overlap, so that the feedthrough capacitor 11 can be positioned stably.
以上のように、この考案によると集積回路から
引出された端子に直接貫通コンデンサを取付け、
貫通端子の外側電極をアースと接続するようにし
たので、ノイズ除去用や回路時定数用のコンデン
サを集積回路の面積内に納めることができ、従来
の外付けコンデンサを用いたものにくらべて小型
化が可能になり、機器への組込みがスペース的に
有利になる。 As mentioned above, according to this invention, a feed-through capacitor is attached directly to the terminal drawn out from the integrated circuit,
Since the outer electrode of the feed-through terminal is connected to the ground, capacitors for noise removal and circuit time constants can be placed within the area of the integrated circuit, making it smaller than conventional capacitors that use external capacitors. This makes it possible to incorporate it into equipment, making it advantageous in terms of space.
また、端子に直接貫通コンデンサが取付けられ
ているので、リードインダクタンスまたはパター
ンによるインダクタンスによる影響が小さく、ノ
イズ除去効果が大幅に向上する。 Furthermore, since the feedthrough capacitor is directly attached to the terminal, the influence of lead inductance or pattern inductance is small, and the noise removal effect is greatly improved.
第1図は従来のコンデンサ付集積回路を示す斜
面図、第2図はこの考案のコンデンサを示す正面
図、第3図は同側面図、第4図は同横断平面図、
第5図は同上要部を拡大した縦断面図、第6図と
第7図及び第8図の各々はシヤーシ形状の異なつ
た例を示す斜面図、第9図はフラツトパツク集積
回路に適用した平面図、第10図は同縦断側面
図、第11図は同上要部の拡大平面図である。
1……集積回路、2……端子、11……貫通コ
ンデンサ、12……シヤーシ基板、13……コン
デンサ本体、14,15……電極。
Fig. 1 is a perspective view showing a conventional integrated circuit with a capacitor, Fig. 2 is a front view showing the capacitor of this invention, Fig. 3 is a side view of the same, Fig. 4 is a cross-sectional plan view of the same,
Fig. 5 is an enlarged vertical cross-sectional view of the main part of the above, Figs. 6, 7, and 8 are perspective views showing different examples of chassis shapes, and Fig. 9 is a plan view applied to a flat pack integrated circuit. FIG. 10 is a longitudinal sectional side view of the same, and FIG. 11 is an enlarged plan view of the main parts of the same. DESCRIPTION OF SYMBOLS 1... Integrated circuit, 2... Terminal, 11... Feedthrough capacitor, 12... Chassis board, 13... Capacitor body, 14, 15... Electrode.
Claims (1)
を貫通端子とする貫通コンデンサを取付け、貫通
コンデンサの外側電極をアースと接続するように
したことを特徴とするコンデンサ付集積回路。 1. An integrated circuit with a capacitor, characterized in that a feed-through capacitor is attached to a terminal drawn out from the integrated circuit, with the terminal serving as a feed-through terminal, and an outer electrode of the feed-through capacitor is connected to ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8490582U JPS58187129U (en) | 1982-06-07 | 1982-06-07 | Integrated circuit with capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8490582U JPS58187129U (en) | 1982-06-07 | 1982-06-07 | Integrated circuit with capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58187129U JPS58187129U (en) | 1983-12-12 |
| JPH0115151Y2 true JPH0115151Y2 (en) | 1989-05-08 |
Family
ID=30093824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8490582U Granted JPS58187129U (en) | 1982-06-07 | 1982-06-07 | Integrated circuit with capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187129U (en) |
-
1982
- 1982-06-07 JP JP8490582U patent/JPS58187129U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58187129U (en) | 1983-12-12 |
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