JPH01153208U - - Google Patents
Info
- Publication number
- JPH01153208U JPH01153208U JP4972388U JP4972388U JPH01153208U JP H01153208 U JPH01153208 U JP H01153208U JP 4972388 U JP4972388 U JP 4972388U JP 4972388 U JP4972388 U JP 4972388U JP H01153208 U JPH01153208 U JP H01153208U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- dicing
- support plate
- cut
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 claims 5
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の一具体例を示すダイシング装
置の縦断面図、第２図は半導体ウエーハに切離し
の残り代を設ける実施態様の説明図、第３図は半
導体ウエーハを厚み方向の全域に亘つて完全に切
断する実施態様の説明図、第４図は支持板の構造
と、支持板への半導体ウエーハの位置決め固定要
領ならびにダイシング要領の説明図である。また
、第５図はＤＨＤ型ダイオードの縦断面図、第６
図はＤＨＤ型ダイオードを構成する半導体ペレツ
トの縦断面図、第７図は従来のダイシング装置の
縦断面図である。
８……半導体ウエーハ、１０……バンプ電極、
１１ａ，１１ｂ……支持板、１４，１５……ダイ
シングブレード。
FIG. 1 is a vertical cross-sectional view of a dicing apparatus showing a specific example of the present invention, FIG. 2 is an explanatory diagram of an embodiment in which a semiconductor wafer is provided with a residual margin after cutting, and FIG. FIG. 4 is an explanatory diagram of an embodiment in which the semiconductor wafer is completely cut. FIG. 4 is an explanatory diagram of the structure of the support plate, the procedure for positioning and fixing the semiconductor wafer to the support plate, and the procedure for dicing. In addition, Fig. 5 is a vertical cross-sectional view of a DHD type diode, and Fig. 6 is a vertical cross-sectional view of a DHD type diode.
The figure is a vertical cross-sectional view of a semiconductor pellet constituting a DHD type diode, and FIG. 7 is a vertical cross-sectional view of a conventional dicing apparatus. 8... Semiconductor wafer, 10... Bump electrode,
11a, 11b... Support plate, 14, 15... Dicing blade.
Claims (1)
装置であつて、 前記支持板は、ダイシングラインに沿つてダイ
シングブレードの挿通溝を有し、 前記半導体ウエーハを挾んでその上方と下方に
、半導体ウエーハを上下から同時に切削する一対
のダイシングブレードを対向配置したことを特徴
とするダイシング装置。[Claims for Utility Model Registration] A semiconductor wafer cutting and separation device fixed to a support plate, wherein the support plate has an insertion groove for a dicing blade along a dicing line, and the semiconductor wafer is sandwiched between the semiconductor wafers and the semiconductor wafer is cut and separated. A dicing device characterized in that a pair of dicing blades are disposed oppositely above and below to simultaneously cut a semiconductor wafer from above and below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972388U JPH01153208U (en) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4972388U JPH01153208U (en) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153208U true JPH01153208U (en) | 1989-10-23 |
Family
ID=31275807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4972388U Pending JPH01153208U (en) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153208U (en) |
-
1988
- 1988-04-12 JP JP4972388U patent/JPH01153208U/ja active Pending