JPH02106308U - - Google Patents
Info
- Publication number
- JPH02106308U JPH02106308U JP1429989U JP1429989U JPH02106308U JP H02106308 U JPH02106308 U JP H02106308U JP 1429989 U JP1429989 U JP 1429989U JP 1429989 U JP1429989 U JP 1429989U JP H02106308 U JPH02106308 U JP H02106308U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- large number
- utility
- dicing tape
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Description
第１図は、本考案によるダイシングテープによ
りテープ貼り付けを行つた際の断面図。第２図は
、従来のダイシングテープによりテープ貼り付け
を行つた際の断面図。第３図は、従来のダイシン
グテープでのダイシングを表わす断面図。
１……ダイシングテープ、２……リングフレー
ム、３……半導体ウエーハ、４……小穴、５……
気泡、６……ウエーハテーブル、７……すき間Δ
、８……砥石、９……チツプ。
FIG. 1 is a cross-sectional view when the dicing tape according to the present invention is used to attach the tape. FIG. 2 is a cross-sectional view when tape is pasted using a conventional dicing tape. FIG. 3 is a cross-sectional view showing dicing using a conventional dicing tape. 1... Dicing tape, 2... Ring frame, 3... Semiconductor wafer, 4... Small hole, 5...
Air bubble, 6...Wafer table, 7...Gap Δ
, 8...Whetstone, 9...Chip.
Claims (1)
ムに装着する工程で使用されるダイシングテープ
において、テープ面に多数小穴を設ける事を特徴
とするダイシングテープ。 This dicing tape is used in the process of attaching semiconductor wafers to ring frames via tape, and is characterized by having a large number of small holes on the tape surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1429989U JPH02106308U (en) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1429989U JPH02106308U (en) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106308U true JPH02106308U (en) | 1990-08-23 |
Family
ID=31225376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1429989U Pending JPH02106308U (en) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106308U (en) |
-
1989
- 1989-02-09 JP JP1429989U patent/JPH02106308U/ja active Pending