JPH01153697U - - Google Patents

Info

Publication number
JPH01153697U
JPH01153697U JP4523888U JP4523888U JPH01153697U JP H01153697 U JPH01153697 U JP H01153697U JP 4523888 U JP4523888 U JP 4523888U JP 4523888 U JP4523888 U JP 4523888U JP H01153697 U JPH01153697 U JP H01153697U
Authority
JP
Japan
Prior art keywords
electronic component
screw
heat dissipation
dissipation structure
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4523888U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4523888U priority Critical patent/JPH01153697U/ja
Publication of JPH01153697U publication Critical patent/JPH01153697U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図ａおよびｂは本考案に係る電子部品の放
熱構造を示す平面図と局部断面図、第２図ａおよ
びｂは同じく本考案における電子部品を示す平面
図と側面図、第３図ａおよびｂは従来の電子部品
の放熱構造を示す平面図と側面図、第４図ａおよ
びｂはその電子部品を示す平面図と側面図である
。 ６……ねじ、１１……プリント基板、１１ａ…
…被接触部、１２……透孔、１３……半導体装置
、１３ａ……放熱部、１４……ねじ孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に対してその一部を接触させ電子部品を取
    り付けてなる電子部品の放熱構造において、前記
    基板の被接触部および前記電子部品の接触部のう
    ちいずれか一方の部位にねじが挿通する透孔を設
    け、他方の部位に前記ねじが螺合するねじ孔を設
    けたことを特徴とする電子部品の放熱構造。
JP4523888U 1988-04-05 1988-04-05 Pending JPH01153697U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4523888U JPH01153697U (ja) 1988-04-05 1988-04-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4523888U JPH01153697U (ja) 1988-04-05 1988-04-05

Publications (1)

Publication Number Publication Date
JPH01153697U true JPH01153697U (ja) 1989-10-23

Family

ID=31271553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4523888U Pending JPH01153697U (ja) 1988-04-05 1988-04-05

Country Status (1)

Country Link
JP (1) JPH01153697U (ja)

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