JPH0351861U - - Google Patents
Info
- Publication number
- JPH0351861U JPH0351861U JP11214889U JP11214889U JPH0351861U JP H0351861 U JPH0351861 U JP H0351861U JP 11214889 U JP11214889 U JP 11214889U JP 11214889 U JP11214889 U JP 11214889U JP H0351861 U JPH0351861 U JP H0351861U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- substrate
- board substrate
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の一実施例を示し、
第１図は印刷配線板の基板の平面図、第２図は同
基板の断面図であり、第３図及び第４図は従来例
を示し、第３図は印刷配線板の基板の平面図、第
４図は同基板の断面図である。 １……印刷配線板、７……樹脂、８……ベアチ
ツプＩＣ、１０……基板、１４……切欠部。
第１図は印刷配線板の基板の平面図、第２図は同
基板の断面図であり、第３図及び第４図は従来例
を示し、第３図は印刷配線板の基板の平面図、第
４図は同基板の断面図である。 １……印刷配線板、７……樹脂、８……ベアチ
ツプＩＣ、１０……基板、１４……切欠部。
Claims (1)
- 印刷配線板の基板に於て、該基板に搭載した回
路素子へ樹脂をポツテイングすべき部位の縁部に
切欠部を設けたことを特徴とする印刷配線板の基
板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214889U JPH0351861U (ja) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214889U JPH0351861U (ja) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351861U true JPH0351861U (ja) | 1991-05-20 |
Family
ID=31660599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11214889U Pending JPH0351861U (ja) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351861U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107061A (ja) * | 2006-10-27 | 2008-05-08 | Toshiba Corp | 空調ダクト整流板スリットおよび空調ダクト整流板スリットの構築方法ならびに放射性物質貯蔵建屋 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647689A (en) * | 1987-06-30 | 1989-01-11 | Shinwa Print Kogyo Kk | Processing of printed wiring board |
-
1989
- 1989-09-26 JP JP11214889U patent/JPH0351861U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647689A (en) * | 1987-06-30 | 1989-01-11 | Shinwa Print Kogyo Kk | Processing of printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107061A (ja) * | 2006-10-27 | 2008-05-08 | Toshiba Corp | 空調ダクト整流板スリットおよび空調ダクト整流板スリットの構築方法ならびに放射性物質貯蔵建屋 |