JPH01154645U - - Google Patents
Info
- Publication number
- JPH01154645U JPH01154645U JP1988051012U JP5101288U JPH01154645U JP H01154645 U JPH01154645 U JP H01154645U JP 1988051012 U JP1988051012 U JP 1988051012U JP 5101288 U JP5101288 U JP 5101288U JP H01154645 U JPH01154645 U JP H01154645U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- input
- semiconductor chip
- output terminals
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/865—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988051012U JPH01154645U (mo) | 1988-04-15 | 1988-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988051012U JPH01154645U (mo) | 1988-04-15 | 1988-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154645U true JPH01154645U (mo) | 1989-10-24 |
Family
ID=31277041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988051012U Pending JPH01154645U (mo) | 1988-04-15 | 1988-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154645U (mo) |
-
1988
- 1988-04-15 JP JP1988051012U patent/JPH01154645U/ja active Pending