JPH01154645U - - Google Patents
Info
- Publication number
- JPH01154645U JPH01154645U JP1988051012U JP5101288U JPH01154645U JP H01154645 U JPH01154645 U JP H01154645U JP 1988051012 U JP1988051012 U JP 1988051012U JP 5101288 U JP5101288 U JP 5101288U JP H01154645 U JPH01154645 U JP H01154645U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- input
- semiconductor chip
- output terminals
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/865—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図ａは本考案第一実施例半導体装置の横断
平面図、第１図ｂは同じく縦断側面図、第２図ａ
は本考案第二実施例半導体装置の縦断側面図、第
２図ｂは本考案第三実施例の縦断側面図、第３図
ａは従来の半導体装置の縦断平面図、第３図ｂは
同じく縦断側面図である。 １１：回路基板、１２：回路部品、１３ａ，１
３ｂ，１３ｃ，１３ｄ：入出力端子、１４：半導
体チツプ、１５：放熱体、１５ａ：放熱部、１５
ｂ：入出力部。
平面図、第１図ｂは同じく縦断側面図、第２図ａ
は本考案第二実施例半導体装置の縦断側面図、第
２図ｂは本考案第三実施例の縦断側面図、第３図
ａは従来の半導体装置の縦断平面図、第３図ｂは
同じく縦断側面図である。 １１：回路基板、１２：回路部品、１３ａ，１
３ｂ，１３ｃ，１３ｄ：入出力端子、１４：半導
体チツプ、１５：放熱体、１５ａ：放熱部、１５
ｂ：入出力部。
Claims (1)
- 回路基板と、該回路基板上に搭載された回路部
品と、前記回路基板より外部への接続用の複数の
入出力端子とを備え、前記回路部品中に、半導体
チツプと、該半導体チツプを搭載してその放熱効
果を上げるための電気的導通兼用の放熱体とが設
けられ、該放熱体と前記複数の入出力端子のうち
の一つの入出力端子とは一体形成されたことを特
徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988051012U JPH01154645U (ja) | 1988-04-15 | 1988-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988051012U JPH01154645U (ja) | 1988-04-15 | 1988-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154645U true JPH01154645U (ja) | 1989-10-24 |
Family
ID=31277041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988051012U Pending JPH01154645U (ja) | 1988-04-15 | 1988-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154645U (ja) |
-
1988
- 1988-04-15 JP JP1988051012U patent/JPH01154645U/ja active Pending