JPH0115501Y2 - - Google Patents
Info
- Publication number
- JPH0115501Y2 JPH0115501Y2 JP1981017767U JP1776781U JPH0115501Y2 JP H0115501 Y2 JPH0115501 Y2 JP H0115501Y2 JP 1981017767 U JP1981017767 U JP 1981017767U JP 1776781 U JP1776781 U JP 1776781U JP H0115501 Y2 JPH0115501 Y2 JP H0115501Y2
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- wire mesh
- bond
- diamond
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【考案の詳細な説明】
ダイヤモンド砥石ないしCBN砥石は一般に金
属製の基体(以下台金と称す)の周縁にダイヤモ
ンドまたはCBNの砥粒を含む砥石部分、即ちダ
イヤ層を付設した構造になる。第1図はペリフエ
ラル型砥石、第3図はカツプ型砥石の典型例であ
る。図中1は台金で、機械の回転軸に取付けるた
めの中心穴2を備える。3はダイヤ層で、通常数
mmの厚さに成形される。[Detailed description of the invention] Diamond grinding wheels or CBN grinding wheels generally have a structure in which a grinding wheel portion containing diamond or CBN abrasive grains, that is, a diamond layer, is attached to the periphery of a metal base (hereinafter referred to as the base metal). Fig. 1 shows a typical example of a peripheral type grindstone, and Fig. 3 shows a typical example of a cup type grindstone. In the figure, 1 is a base metal, which has a center hole 2 for attachment to the rotating shaft of the machine. 3 is the diamond layer, the normal number
Molded to a thickness of mm.
ダイヤ層3は金属質、樹脂質、あるいはガラス
質のマトリクス中に砥粒が散在する構造で、マト
リクスはまたボンドと呼ばれる。製造にはボンド
材料の粉末と砥粒との混合体を加熱圧縮して焼結
成形する。 The diamond layer 3 has a structure in which abrasive grains are scattered in a metallic, resinous, or glassy matrix, and the matrix is also called a bond. For manufacturing, a mixture of bond material powder and abrasive grains is heat-compressed and sintered.
台金とダイヤ層との間に中間層を介在させるこ
とがしばしば行われる。第2図はペリフエラル
型、第4図はカツプ型についてこの構造を示す断
面図で、中間層4はボンドと同種あるいは類似の
材質で形成されるが砥粒は含まない。 An intermediate layer is often interposed between the base metal and the diamond layer. FIG. 2 is a sectional view showing this structure for a peripheral type and FIG. 4 for a cup type. The intermediate layer 4 is formed of the same or similar material as the bond, but does not contain abrasive grains.
中間層の効用は緩衝作用にある。即ちダイヤ層
に働く衝撃を吸収することにより、砥石の研削性
能を向上すると共にダイヤ層の破壊を防止する。
時には衝撃的に働く研削抵抗による外力、高速回
転による遠心力、ダイヤ層と台金との熱膨張の差
による応力など、ダイヤ層破壊の要因となる応力
は常に存在する。中間層はこれ等の諸応力を分散
し軽減するので破壊の公算は減少する。 The effectiveness of the middle layer lies in its buffering effect. That is, by absorbing the impact acting on the diamond layer, the grinding performance of the whetstone is improved and destruction of the diamond layer is prevented.
Stresses that cause diamond layer destruction always exist, such as external force due to grinding resistance that sometimes acts shockingly, centrifugal force due to high-speed rotation, and stress due to the difference in thermal expansion between the diamond layer and the base metal. The intermediate layer distributes and relieves these stresses, thereby reducing the likelihood of failure.
前述の3種のボンド中、ガラス質のボンドはビ
トリフアイドボンドと呼ばれる。これを用いた砥
石即ちビトリフアイド砥石は、被削材質や研削目
的によつてはすぐれた性能を顕わすので賞用され
るが、ガラス質のボンドが脆いために、破壊し易
い欠点がある。 Among the three types of bonds mentioned above, the glassy bond is called a vitrified bond. A whetstone using this, that is, a vitrified whetstone, is prized because it exhibits excellent performance depending on the material to be cut and the purpose of grinding, but it has the disadvantage that it is easily broken due to the brittle glass bond.
ダイヤ層ないし中間層に微少な亀裂が生ずれ
ば、前述の諸応力は亀裂を拡大、伝播させるの
で、全面的破壊に至るものである。破壊は砥石を
高速回転して研削作業中に起るので、遠心力で破
片が飛散し周囲に害を及ぼす。殊に作業者にとつ
てはきわめて危険である。中間層は前述のように
破壊防止の作用はあるが危険は皆無ではなく、作
業者に不安が残るのが従来のビトリフアイドダイ
ヤモンド(またはCBN)砥石であつた。 If a minute crack occurs in the diamond layer or intermediate layer, the various stresses mentioned above will cause the crack to expand and propagate, leading to complete destruction. The breakage occurs during grinding when the whetstone is rotated at high speed, and the centrifugal force causes fragments to scatter and harm the surrounding area. It is extremely dangerous, especially for workers. As mentioned above, the intermediate layer has the effect of preventing breakage, but it is not completely dangerous, and conventional vitrified diamond (or CBN) grinding wheels have left workers feeling uneasy.
本考案の目的はこの点にかんがみ、亀裂が発生
し難く、万一発生しても亀裂が拡大伝播すること
なく、したがつて破壊・飛散には至らず安全が確
保されるビトリフアイド砥石を提供することにあ
る。 In view of this point, the purpose of the present invention is to provide a vitrified grindstone that does not easily cause cracks, and even if cracks do occur, the cracks will not spread and spread, thus ensuring safety without causing breakage or scattering. There is a particular thing.
本考案は第5図及び第6図に示すように、中間
層4に金網5を埋込んだことを要旨とするもので
ある。第5図はペリフエラル型、第6図はカツプ
型砥石についての一部断面図で、いずれにおいて
も金網は平面環状である。 The gist of the present invention is that a wire mesh 5 is embedded in the intermediate layer 4, as shown in FIGS. 5 and 6. FIG. 5 is a partial sectional view of a peripheral type whetstone, and FIG. 6 is a partial sectional view of a cup type whetstone, and in both cases, the wire mesh has a planar ring shape.
金網5はガラス質焼結体の中間層4に対して補
強材として働く。これによつて亀裂発生の公算は
低下し、かりに亀裂を生じてもその拡大、伝播が
防止される。第7図のように中間層4を横断する
亀裂6を生じても、亀裂の両側7と8とは金網5
によつて連結されているのでもとの位置を保つて
分離することはない。すなわち亀裂が生じても砥
石は破壊、飛散することがない。 The wire mesh 5 acts as a reinforcing material for the intermediate layer 4 of the glassy sintered body. This reduces the likelihood of cracks occurring and prevents them from expanding and propagating if they do occur. Even if a crack 6 crosses the intermediate layer 4 as shown in FIG. 7, both sides 7 and 8 of the crack are separated by wire mesh 5.
Since they are connected by , they maintain their original positions and never separate. In other words, even if a crack occurs, the grindstone will not be destroyed or scattered.
金網5の材質は、ガラス封着用の合金たとえば
コバールの名称で市販されるFe−Co−Ni合金な
どを最適とする。この種の合金はガラスとの接着
性がよく、熱膨張係数はガラスと整合しているか
らである。しかしニツケルあるいはステンレス鋼
の金網もまた十分に有用であることが実験により
確認された。金網は径0.1〜0.5mmの線材で織つた
ものが適当で、小形の砥石には細い線材、大型の
砥石には太い線材の金網を採用する。 The optimal material for the wire mesh 5 is an alloy for glass sealing, such as an Fe--Co--Ni alloy commercially available under the name Kovar. This is because this type of alloy has good adhesion to glass and has a coefficient of thermal expansion matching that of glass. However, experiments have shown that nickel or stainless steel wire mesh is also fully useful. A wire mesh woven from wire rods with a diameter of 0.1 to 0.5 mm is suitable; a wire mesh made of thin wire rods is used for small whetstones, and a wire mesh made of thick wire rods is used for large whetstones.
本考案のビトリフアイド砥石の製造には、成形
の過程に軽微の追加工程を要する他は従来の方法
がそのまま適用される。以下成形法の一例をあげ
れば、所定の金型にダイヤ層の圧粉体または半焼
結体を置き、中間層の位置に中間層材料粉末の所
定量の半量を装填して押圧し、その上に所定寸法
形状の金網を置く。つぎに残部半量の粉末を装
填、押圧する。以後は従来法と同様に加熱、加圧
してダイヤ層と中間層とを同時一体に焼結成形す
るのである。 To manufacture the vitrified grindstone of the present invention, the conventional method can be applied as is, except that a slight additional step is required in the forming process. To give an example of the forming method below, place a diamond layer compact or semi-sintered body in a predetermined mold, load half of the predetermined amount of intermediate layer material powder into the intermediate layer position, press it, and then Place a wire mesh with the specified dimensions and shape. Next, the remaining half amount of powder is loaded and pressed. Thereafter, the diamond layer and the intermediate layer are sintered and formed simultaneously by heating and pressurizing them as in the conventional method.
以上のように本考案は破壊、飛散の危険を解消
するので、ビトリフアイド砥石の用途は大巾に拡
大する。製造は来の技術、設備がそのまま適用さ
れ、工程も単純であるから、工業的価値が大き
い。 As described above, since the present invention eliminates the risk of breakage and scattering, the applications of vitrified grindstones are greatly expanded. It is manufactured using existing technology and equipment, and the process is simple, so it has great industrial value.
なお以上の説明においては金網は中間層の厚み
の中央部に1枚挿入するものを示したが、中間層
が厚い場合には複数枚の金網を適宜の間隔を置い
て挿入することもできる。 In the above description, one wire mesh is inserted into the center of the thickness of the intermediate layer, but if the intermediate layer is thick, a plurality of wire meshes may be inserted at appropriate intervals.
第1図はペリフエラル型砥石の斜視図、第2図
は同上中間層を有する構造の断面図、第3図はカ
ツプ型砥石の斜視図、第4図は同上中間層を有す
る構造の断面図、第5図及び第6図は本考案に係
るビトリフアイド砥石の一部断面図、第7図は亀
裂が生じた状態を示す断面図である。
1……台板、2……中心穴、3……ダイヤ層、
4……中間層、5……金網。
FIG. 1 is a perspective view of a peripheral type grindstone, FIG. 2 is a cross-sectional view of a structure having an intermediate layer as described above, FIG. 3 is a perspective view of a cup-type grindstone, and FIG. 4 is a cross-sectional view of a structure having an intermediate layer as described above. 5 and 6 are partial cross-sectional views of the vitrified grindstone according to the present invention, and FIG. 7 is a cross-sectional view showing a state in which cracks have occurred. 1... Base plate, 2... Center hole, 3... Diamond layer,
4... middle layer, 5... wire mesh.
Claims (1)
はCBN砥粒を含む砥石部分と台金との間に、前
記ボンドと同種或いは類似の材質の中間層を設け
たものにおいて、前記中間層に金網を埋込んだビ
トリフアイド砥石。 In a bitrified bond, an intermediate layer made of the same or similar material as the bond is provided between the grinding wheel portion containing diamond abrasive grains or CBN abrasive grains and the base metal, and a wire mesh is embedded in the intermediate layer. Bitrifided whetstone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981017767U JPH0115501Y2 (en) | 1981-02-10 | 1981-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981017767U JPH0115501Y2 (en) | 1981-02-10 | 1981-02-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57131255U JPS57131255U (en) | 1982-08-16 |
| JPH0115501Y2 true JPH0115501Y2 (en) | 1989-05-09 |
Family
ID=29815736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981017767U Expired JPH0115501Y2 (en) | 1981-02-10 | 1981-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0115501Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716884B2 (en) * | 1986-09-25 | 1995-03-01 | 豊田工機株式会社 | Thin width whetstone |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5237565Y2 (en) * | 1973-08-18 | 1977-08-26 | ||
| JPS5531593U (en) * | 1978-08-24 | 1980-02-29 |
-
1981
- 1981-02-10 JP JP1981017767U patent/JPH0115501Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57131255U (en) | 1982-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2225193A (en) | Abrasive wheel | |
| US3146561A (en) | Circular saw and method of making the same | |
| KR101820177B1 (en) | Abrasive article with solid core and methods of making the same | |
| US3203774A (en) | Method of making an abrasive cut-off disk | |
| US3028710A (en) | Abrasive cut-off disk | |
| US6827072B2 (en) | Dressing wheel and method of making same | |
| US2479078A (en) | Diamond abrasive wheel | |
| US3498283A (en) | Abrasive cutting tool | |
| JPS58143958A (en) | Grindstone | |
| JPS6288575A (en) | Grinding wheel | |
| JP3018775B2 (en) | Whetstone and manufacturing method thereof | |
| US2334048A (en) | Peripheral diamond grinding wheel | |
| JPH02237759A (en) | Cutter and manufacture thereof | |
| US5014678A (en) | Cutter | |
| US2081843A (en) | Grinding wheel and method of making the same | |
| JP4219077B2 (en) | Disc-shaped grinding wheel | |
| JPS6312747B2 (en) | ||
| JPH0451980Y2 (en) | ||
| JPS63207565A (en) | Composite stone for grinding | |
| JPS6254627B2 (en) | ||
| JPS61152374A (en) | Grindstone wheel | |
| JPS6131817Y2 (en) | ||
| JPS5834431B2 (en) | Composite whetstone and its manufacturing method | |
| JPH11188638A (en) | Grinding wheel and its manufacturing method | |
| JPH05192868A (en) | Vitrified Bond Super Abrasive Wheel |