JPH01155162U - - Google Patents
Info
- Publication number
- JPH01155162U JPH01155162U JP4974688U JP4974688U JPH01155162U JP H01155162 U JPH01155162 U JP H01155162U JP 4974688 U JP4974688 U JP 4974688U JP 4974688 U JP4974688 U JP 4974688U JP H01155162 U JPH01155162 U JP H01155162U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- polishing
- semiconductor wafer
- pasting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims 1
Description
第１図ａ，ｂはそれぞれ本考案の半導体ウエハ
研磨装置の一実施例を示す研磨プレートの平面図
および断面図、第２図は従来の研磨プレートの平
面図および断面図である。
２：ウエハ、４：型付研磨プレート、５：貼付
用型。
1A and 1B are a plan view and a sectional view of a polishing plate showing an embodiment of the semiconductor wafer polishing apparatus of the present invention, respectively, and FIG. 2 is a plan view and a sectional view of a conventional polishing plate. 2: Wafer, 4: Polishing plate with mold, 5: Pasting mold.
Claims (1)
方の面を研磨布に押当てて研磨する半導体ウエハ
研磨装置において、前記研磨プレートに、ウエハ
と同一形状を有し、該ウエハの一部を差入れて貼
付する対称形に位置決めして配列された貼付用型
が設けてあることを特徴とする半導体ウエハ研磨
装置。 In a semiconductor wafer polishing device that polishes a wafer by attaching one side of the wafer to a polishing plate and pressing the other side against a polishing cloth, a part of the wafer having the same shape as the wafer is inserted into the polishing plate. 1. A semiconductor wafer polishing apparatus, characterized in that a semiconductor wafer polishing apparatus is provided with symmetrically positioned and arranged pasting molds for pasting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4974688U JPH01155162U (en) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4974688U JPH01155162U (en) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01155162U true JPH01155162U (en) | 1989-10-25 |
Family
ID=31275829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4974688U Pending JPH01155162U (en) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01155162U (en) |
-
1988
- 1988-04-13 JP JP4974688U patent/JPH01155162U/ja active Pending