JPS636747U - - Google Patents
Info
- Publication number
- JPS636747U JPS636747U JP1986100440U JP10044086U JPS636747U JP S636747 U JPS636747 U JP S636747U JP 1986100440 U JP1986100440 U JP 1986100440U JP 10044086 U JP10044086 U JP 10044086U JP S636747 U JPS636747 U JP S636747U
- Authority
- JP
- Japan
- Prior art keywords
- sides
- leads
- resin
- semiconductor device
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例を示すもので、ａ
は平面図、ｂは正面図、第２図は従来の半導体装
置用のフレームを示すもので、ａは平面図、ｂは
正面図である。
図中、１は樹脂部、２，３，４はリードである
。尚、図中同一符号は同一または相当部分を示す
。
Figure 1 shows an embodiment of this invention.
2 is a plan view, b is a front view, and FIG. 2 shows a conventional frame for a semiconductor device, where a is a plan view and b is a front view. In the figure, 1 is a resin part, and 2, 3, and 4 are leads. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
各々本数が異なるリードを有するものにおいて、
上記両側のリードの曲げ加工を施こす部分のリー
ド断面積を左右で同じく設定したことを特徴とす
る半導体装置用フレーム。 In resin-encapsulated semiconductor devices that have different numbers of leads on the left and right sides of the resin side surface,
A frame for a semiconductor device, characterized in that the lead cross-sectional area of the portion where the leads on both sides are bent is set to be the same on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100440U JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100440U JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636747U true JPS636747U (en) | 1988-01-18 |
| JPH08762Y2 JPH08762Y2 (en) | 1996-01-10 |
Family
ID=30970265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986100440U Expired - Lifetime JPH08762Y2 (en) | 1986-06-30 | 1986-06-30 | Frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08762Y2 (en) |
-
1986
- 1986-06-30 JP JP1986100440U patent/JPH08762Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08762Y2 (en) | 1996-01-10 |