JPH01156559U - - Google Patents
Info
- Publication number
- JPH01156559U JPH01156559U JP1988054257U JP5425788U JPH01156559U JP H01156559 U JPH01156559 U JP H01156559U JP 1988054257 U JP1988054257 U JP 1988054257U JP 5425788 U JP5425788 U JP 5425788U JP H01156559 U JPH01156559 U JP H01156559U
- Authority
- JP
- Japan
- Prior art keywords
- surface electrode
- electrical connection
- metal conductor
- diode
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
Description
第１図ａ，ｂ，ｃは本考案の一実施例による組
立を説明するための各縦断面図、第２図は本考案
の他の実施例を示す縦断面図、第３図は従来のガ
ラスダイオードの組立途中の縦断面図である。
１……ガラス外囲器、２……一方の外部リード
、３……チツプマウント用ロー材、４……ダイオ
ードチツプ、５……低融点合金、６，６′……ホ
イスカ、７……もう一方の外部リード、８……チ
ツプ表面電極。
Figures 1a, b, and c are longitudinal cross-sectional views for explaining the assembly according to one embodiment of the present invention, Figure 2 is a vertical cross-sectional view showing another embodiment of the present invention, and Figure 3 is a conventional FIG. 3 is a longitudinal cross-sectional view of the glass diode during assembly. 1... Glass envelope, 2... One external lead, 3... Brazing material for chip mount, 4... Diode chip, 5... Low melting point alloy, 6, 6'... Whisker, 7... Already One external lead, 8... Chip surface electrode.
Claims (1)
つてダイオードチツプの表面電極との電気的接続
が直接とられているガラスダイオードにおいて、
上記金属導体と前記表面電極との電気的接続が両
者の機械的接触だけでなく低融点合金によつても
なされていることを特徴とするガラスダイオード
。 In a glass diode in which the electrical connection is made directly to the surface electrode of the diode chip by means of an external lead and a mechanically fixed metal conductor,
A glass diode characterized in that electrical connection between the metal conductor and the surface electrode is made not only by mechanical contact between the two but also by a low melting point alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988054257U JPH01156559U (en) | 1988-04-21 | 1988-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988054257U JPH01156559U (en) | 1988-04-21 | 1988-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156559U true JPH01156559U (en) | 1989-10-27 |
Family
ID=31280194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988054257U Pending JPH01156559U (en) | 1988-04-21 | 1988-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156559U (en) |
-
1988
- 1988-04-21 JP JP1988054257U patent/JPH01156559U/ja active Pending