JPS63200355U - - Google Patents
Info
- Publication number
- JPS63200355U JPS63200355U JP9259087U JP9259087U JPS63200355U JP S63200355 U JPS63200355 U JP S63200355U JP 9259087 U JP9259087 U JP 9259087U JP 9259087 U JP9259087 U JP 9259087U JP S63200355 U JPS63200355 U JP S63200355U
- Authority
- JP
- Japan
- Prior art keywords
- external circuit
- circuit connection
- connection lead
- light emitting
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す上面図
及びＡ―Ａ′線断面図、第２図ａ，ｂは従来の半
導体装置の一例を示す上面図及びＢ―Ｂ′線断面
図である。
１……発光素子、２……受光素子、３……第１
のボンデイング線、４……第２のボンデイング線
、５……外装樹脂体、１１……第１の外部回路接
続リード、１２……第２の外部回路接続リード、
１３……外部回路接続リード、２１……第３の外
部回路接続リード、２２……第４の外部回路接続
リード、２３……外部回路接続リード、３１……
第１の外部回路接続リード、３２……第２の外部
回路接続リード、３３……外部回路接続リード、
４１……第３の外部回路接続リード、４２……第
４の外部回路接続リード、４３……外部回路接続
リード。
1A and 1B are a top view and a sectional view taken along the line A-A' of an embodiment of the present invention, and FIGS. 2A and 2B are a top view and a sectional view taken along the line B-B' of an example of a conventional semiconductor device. It is a diagram. 1... Light emitting element, 2... Light receiving element, 3... First
bonding wire, 4... second bonding wire, 5... exterior resin body, 11... first external circuit connection lead, 12... second external circuit connection lead,
13... External circuit connection lead, 21... Third external circuit connection lead, 22... Fourth external circuit connection lead, 23... External circuit connection lead, 31...
First external circuit connection lead, 32... Second external circuit connection lead, 33... External circuit connection lead,
41... Third external circuit connection lead, 42... Fourth external circuit connection lead, 43... External circuit connection lead.
Claims (1)
接続リードと、該第１の外部回路接続リードの隣
に設けられた第２の外部回路接続リードと、前記
発光素子搭載部に固着された発光素子と、前記発
光素子の電極と前記第２の外部回路接続リードと
を接続する第１のボンデイング線と、前記発光素
子に対向して先端に受光素子搭載部を有する第３
の外部回路接続リードと、該第３の外部回路接続
リードの隣に設けられた第４の外部回路接続リー
ドと、前記受光素子搭載部に固着された受光素子
と、前記受光素子の電極と前記第４の外部回路接
続リードとを接続する第２のボンデイング線と、
前記発光素子と前記第１、第２のボンデイグ線と
前記第１、第２、第３、第４の外部回路接続リー
ドの一部を封止する外装樹脂体とを有する半導体
装置において、前記第１、第２、第３、第４の外
部回路接続リードの各々の前記外装樹脂体にて被
覆された部分の一部の表面に波形の凹凸を設けた
ことを特徴とする半導体装置。 a first external circuit connection lead having a light emitting element mounting part at its tip; a second external circuit connection lead provided next to the first external circuit connection lead; and a light emitting element fixed to the light emitting element mounting part. a first bonding wire that connects the electrode of the light emitting element and the second external circuit connection lead; and a third bonding wire that faces the light emitting element and has a light receiving element mounting portion at its tip.
a fourth external circuit connection lead provided next to the third external circuit connection lead, a light receiving element fixed to the light receiving element mounting portion, an electrode of the light receiving element, and a fourth external circuit connecting lead provided next to the third external circuit connecting lead; a second bonding wire connecting the fourth external circuit connection lead;
In the semiconductor device, the semiconductor device includes the light emitting element, the first and second bonding wires, and an exterior resin body that seals a portion of the first, second, third, and fourth external circuit connection leads. A semiconductor device characterized in that a part of the surface of a portion of each of the first, second, third, and fourth external circuit connection leads covered with the exterior resin body is provided with wavy irregularities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9259087U JPS63200355U (en) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9259087U JPS63200355U (en) | 1987-06-15 | 1987-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200355U true JPS63200355U (en) | 1988-12-23 |
Family
ID=30954425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9259087U Pending JPS63200355U (en) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200355U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104744U (en) * | 1990-02-14 | 1991-10-30 | ||
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |
-
1987
- 1987-06-15 JP JP9259087U patent/JPS63200355U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104744U (en) * | 1990-02-14 | 1991-10-30 | ||
| WO1999060632A1 (en) * | 1998-05-20 | 1999-11-25 | Rohm Co., Ltd. | Reflective sensor |