JPH01157460U - - Google Patents
Info
- Publication number
- JPH01157460U JPH01157460U JP1988047083U JP4708388U JPH01157460U JP H01157460 U JPH01157460 U JP H01157460U JP 1988047083 U JP1988047083 U JP 1988047083U JP 4708388 U JP4708388 U JP 4708388U JP H01157460 U JPH01157460 U JP H01157460U
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- insulator member
- heat sink
- conductor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Description
第１図は本考案の一実施例の模式的斜視図であ
る。 １……ヒートシンク、２……Ｔｉ／Ｐｔ／Ａｕ
、３……Ｔｉ／Ｐｔ／ＡｕＳｎ、４……絶縁体部
材（アルミナ基板）、５……Ｔｉ／Ｐｔ／Ａｕ、
６……ＩｎＰ／ＩｎＧａＡｓＰ半導体レーザ素子
、７……ボンデイングワイヤー。
る。 １……ヒートシンク、２……Ｔｉ／Ｐｔ／Ａｕ
、３……Ｔｉ／Ｐｔ／ＡｕＳｎ、４……絶縁体部
材（アルミナ基板）、５……Ｔｉ／Ｐｔ／Ａｕ、
６……ＩｎＰ／ＩｎＧａＡｓＰ半導体レーザ素子
、７……ボンデイングワイヤー。
Claims (1)
- 光半導体素子をヒートシンクに搭載し、前記ヒ
ートシンクの上面の一部に絶縁体部材を搭載し、
前記絶縁体部材の少なくとも一部上面に導体を備
え、前記光半導体素子と前記絶縁体部材上の導体
とを電気的に接続していることを特徴とする光半
導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047083U JPH01157460U (ja) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047083U JPH01157460U (ja) | 1988-04-06 | 1988-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157460U true JPH01157460U (ja) | 1989-10-30 |
Family
ID=31273313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988047083U Pending JPH01157460U (ja) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157460U (ja) |
-
1988
- 1988-04-06 JP JP1988047083U patent/JPH01157460U/ja active Pending