JPH01158171U - - Google Patents
Info
- Publication number
- JPH01158171U JPH01158171U JP5427788U JP5427788U JPH01158171U JP H01158171 U JPH01158171 U JP H01158171U JP 5427788 U JP5427788 U JP 5427788U JP 5427788 U JP5427788 U JP 5427788U JP H01158171 U JPH01158171 U JP H01158171U
- Authority
- JP
- Japan
- Prior art keywords
- module
- die pad
- storage recess
- chip storage
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案のＩＣモジユール説明図であり
、第２図は本考案の他の実施例のＩＣモジユール
説明図であり、第３図は一般的なＩＣカードの斜
視図であり、第４図及び第５図は従来のＩＣモジ
ユール説明図である。
５……ＩＣチツプ、６，７，８……本考案にお
けるダイパツド、９……従来のダイツド、１１…
…第１の基板、１２……第２の基板、１４……基
板、１８……外部接続端子パターン、２６，２８
……ＩＣチツプ収納凹部。
FIG. 1 is an explanatory diagram of an IC module according to the present invention, FIG. 2 is an explanatory diagram of an IC module according to another embodiment of the present invention, FIG. 3 is a perspective view of a general IC card, and FIG. 1 and 5 are explanatory diagrams of a conventional IC module. 5...IC chip, 6, 7, 8... Die pad in the present invention, 9... Conventional die pad, 11...
...First board, 12... Second board, 14... Board, 18... External connection terminal pattern, 26, 28
...IC chip storage recess.
Claims (1)
プ収納凹部が形成されてなるＩＣモジユールにお
いて、前記ＩＣチツプ収納凹部の底部及び内壁面
に渡つてダイパツドを設けてなることを特徴とす
るＩＣモジユール。 ２ 前記ダイパツドを絞り加工により形成せしめ
る請求項１記載のＩＣモジユール。[Claims for Utility Model Registration] 1. In an IC module in which an IC chip storage recess is formed in a single or a plurality of laminated substrates, a die pad is provided over the bottom and inner wall surface of the IC chip storage recess. An IC module featuring 2. The IC module according to claim 1, wherein the die pad is formed by drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5427788U JPH01158171U (en) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5427788U JPH01158171U (en) | 1988-04-22 | 1988-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01158171U true JPH01158171U (en) | 1989-11-01 |
Family
ID=31280213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5427788U Pending JPH01158171U (en) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01158171U (en) |
-
1988
- 1988-04-22 JP JP5427788U patent/JPH01158171U/ja active Pending
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