JPH01161362U - - Google Patents

Info

Publication number
JPH01161362U
JPH01161362U JP5769988U JP5769988U JPH01161362U JP H01161362 U JPH01161362 U JP H01161362U JP 5769988 U JP5769988 U JP 5769988U JP 5769988 U JP5769988 U JP 5769988U JP H01161362 U JPH01161362 U JP H01161362U
Authority
JP
Japan
Prior art keywords
circuit
hole
circuit board
solder
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5769988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5769988U priority Critical patent/JPH01161362U/ja
Publication of JPH01161362U publication Critical patent/JPH01161362U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は実施例の斜視図、第２図は第１図の
―′線断面図、第３図および第４図は他の実施
例の断面図、第５図は製法例の工程図、第６図は
従来例の断面図である。 １……基板、２……回路、３……端子、４……
孔部、５……インク層、６……回路部品、７……
半田、８……電子回路基板、９……半田ペースト
。

Claims (1)

  1. 【実用新案登録請求の範囲】 メンブレンスイツチの回路基板の回路端子に孔
    部を形成し、 該孔部の周囲の回路端子に半田付け可能なイン
    クによるインク層を形成し、 該孔部内も含めて回路基板の表裏に塗布された
    半田ペーストによつて形成された半田により、該
    回路端子に回路部品を実装したことを特徴とする
    電子回路基板。
JP5769988U 1988-04-28 1988-04-28 Pending JPH01161362U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5769988U JPH01161362U (ja) 1988-04-28 1988-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5769988U JPH01161362U (ja) 1988-04-28 1988-04-28

Publications (1)

Publication Number Publication Date
JPH01161362U true JPH01161362U (ja) 1989-11-09

Family

ID=31283542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5769988U Pending JPH01161362U (ja) 1988-04-28 1988-04-28

Country Status (1)

Country Link
JP (1) JPH01161362U (ja)

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