JPH01162247U - - Google Patents
Info
- Publication number
- JPH01162247U JPH01162247U JP1988055134U JP5513488U JPH01162247U JP H01162247 U JPH01162247 U JP H01162247U JP 1988055134 U JP1988055134 U JP 1988055134U JP 5513488 U JP5513488 U JP 5513488U JP H01162247 U JPH01162247 U JP H01162247U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film substrate
- metal wire
- thin metal
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055134U JPH01162247U (cs) | 1988-04-22 | 1988-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055134U JPH01162247U (cs) | 1988-04-22 | 1988-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162247U true JPH01162247U (cs) | 1989-11-10 |
Family
ID=31281039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988055134U Pending JPH01162247U (cs) | 1988-04-22 | 1988-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162247U (cs) |
-
1988
- 1988-04-22 JP JP1988055134U patent/JPH01162247U/ja active Pending