JPH01162249U - - Google Patents

Info

Publication number
JPH01162249U
JPH01162249U JP5433088U JP5433088U JPH01162249U JP H01162249 U JPH01162249 U JP H01162249U JP 5433088 U JP5433088 U JP 5433088U JP 5433088 U JP5433088 U JP 5433088U JP H01162249 U JPH01162249 U JP H01162249U
Authority
JP
Japan
Prior art keywords
clip
fixing
leg
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5433088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5433088U priority Critical patent/JPH01162249U/ja
Publication of JPH01162249U publication Critical patent/JPH01162249U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の半導体素子固定用クリツプの
一実施例を示す斜視図、第2図は本考案の半導体
素子固定用クリツプの使用状態を示す側面図、第
3図は従来の半導体発熱素子と放熱用フインとを
取付ける場合の斜視図、第4図は従来の半導体素
子固定用クリツプを示す斜視図、第5図は従来の
半導体素子固定用クリツプを使用する場合の側面
図である。 1a……クリツプの一方の脚、1b……クリツ
プの他方の脚、2a,2b……突起、3……放熱
用フイン、4……窪み、10……半導体素子固定
用クリツプ。
Fig. 1 is a perspective view showing an embodiment of the clip for fixing a semiconductor element of the present invention, Fig. 2 is a side view showing the state of use of the clip for fixing a semiconductor element of the present invention, and Fig. 3 is a conventional semiconductor heating element. FIG. 4 is a perspective view showing a conventional clip for fixing a semiconductor element, and FIG. 5 is a side view when using a conventional clip for fixing a semiconductor element. 1a... One leg of the clip, 1b... The other leg of the clip, 2a, 2b... Protrusion, 3... Heat dissipation fin, 4... Recess, 10... Clip for fixing a semiconductor element.

Claims (1)

【実用新案登録請求の範囲】 パワートランジスタ等の半導体発熱素子と放熱
用フインとをバネ性のある板材の一方と他方の両
脚間に挾持して固定するようにした半導体素子固
定用クリツプにおいて、 一方の脚と他方の脚の夫々の内側挾持部にズレ
防止用突起を設けたことを特徴とする半導体素子
固定用クリツプ。
[Scope of Claim for Utility Model Registration] In a clip for fixing a semiconductor element, in which a semiconductor heating element such as a power transistor and a heat dissipating fin are held and fixed between the legs of one and the other of a springy plate, one 1. A clip for fixing a semiconductor element, characterized in that projections for preventing slippage are provided on the inner holding parts of one leg and the other leg, respectively.
JP5433088U 1988-04-22 1988-04-22 Pending JPH01162249U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5433088U JPH01162249U (en) 1988-04-22 1988-04-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5433088U JPH01162249U (en) 1988-04-22 1988-04-22

Publications (1)

Publication Number Publication Date
JPH01162249U true JPH01162249U (en) 1989-11-10

Family

ID=31280265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5433088U Pending JPH01162249U (en) 1988-04-22 1988-04-22

Country Status (1)

Country Link
JP (1) JPH01162249U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200450390Y1 (en) * 2008-04-22 2010-10-01 대동전자(주) Clip for attaching the electronic component protective cover
JP2010258437A (en) * 2009-03-31 2010-11-11 Dainippon Printing Co Ltd Power feeder, contactless power transmission device, and joint auxiliary device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247139B2 (en) * 1982-12-10 1987-10-06 Hitachi Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247139B2 (en) * 1982-12-10 1987-10-06 Hitachi Ltd

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200450390Y1 (en) * 2008-04-22 2010-10-01 대동전자(주) Clip for attaching the electronic component protective cover
JP2010258437A (en) * 2009-03-31 2010-11-11 Dainippon Printing Co Ltd Power feeder, contactless power transmission device, and joint auxiliary device

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