JPH02129793U - - Google Patents
Info
- Publication number
- JPH02129793U JPH02129793U JP3653489U JP3653489U JPH02129793U JP H02129793 U JPH02129793 U JP H02129793U JP 3653489 U JP3653489 U JP 3653489U JP 3653489 U JP3653489 U JP 3653489U JP H02129793 U JPH02129793 U JP H02129793U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipating
- support plate
- heat dissipation
- electronic component
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１実施例における放熱部材
の斜視図、第２図は同実施例の放熱構造を示す断
面図、第３図は本考案の第２実施例における放熱
部材の斜視図、第４図は従来における電子部品の
放熱構造の一例を示す図である。
１０，２０……放熱部材、１２……放熱フイン
、１５……電子部品、１７……支持板。
Fig. 1 is a perspective view of a heat dissipation member in a first embodiment of the present invention, Fig. 2 is a sectional view showing the heat dissipation structure of the same embodiment, and Fig. 3 is a perspective view of a heat dissipation member in a second embodiment of the present invention. , FIG. 4 is a diagram showing an example of a conventional heat dissipation structure for electronic components. 10, 20... Heat radiation member, 12... Heat radiation fin, 15... Electronic component, 17... Support plate.
Claims (1)
えた放熱部材の一端を電子部品に当接させ、他端
側を支持板に固定することにより、電子部品と支
持板の間に該放熱部材を挟持固定したことを特徴
とする電子部品の放熱構造。 One end of the heat dissipating member, which is elastic in the direction intersecting the heat dissipating surface of the heat dissipating fin, is brought into contact with the electronic component and the other end is fixed to the support plate, thereby clamping and fixing the heat dissipation member between the electronic component and the support plate. A heat dissipation structure for electronic components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3653489U JPH02129793U (en) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3653489U JPH02129793U (en) | 1989-03-31 | 1989-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129793U true JPH02129793U (en) | 1990-10-25 |
Family
ID=31542847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3653489U Pending JPH02129793U (en) | 1989-03-31 | 1989-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129793U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715449A (en) * | 1980-07-02 | 1982-01-26 | Mitsubishi Electric Corp | Cooler for electronic circuit components |
-
1989
- 1989-03-31 JP JP3653489U patent/JPH02129793U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5715449A (en) * | 1980-07-02 | 1982-01-26 | Mitsubishi Electric Corp | Cooler for electronic circuit components |
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