JPH01165148U - - Google Patents
Info
- Publication number
- JPH01165148U JPH01165148U JP5959488U JP5959488U JPH01165148U JP H01165148 U JPH01165148 U JP H01165148U JP 5959488 U JP5959488 U JP 5959488U JP 5959488 U JP5959488 U JP 5959488U JP H01165148 U JPH01165148 U JP H01165148U
- Authority
- JP
- Japan
- Prior art keywords
- molds
- shell
- detection sensor
- absence
- mold assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000002054 inoculum Substances 0.000 description 2
Landscapes
- Casting Devices For Molds (AREA)
Description
図面はいずれも本考案の実施例を説明するため
のもので、第１図は第１実施例に係るボンデイン
グ装置の正面図、第２図は上記ボンデイング装置
の側面図、第３図はシエル鋳型の下型の平面図、
第４図は第１実施例に係るボンデイング装置の作
動を説明するためのシーケンス構成図、第５図は
第２実施例の要部を説明するための断面説明図、
第６図は第３実施例に係るボンデイング装置上部
の正面図である。
１……下型、８……接種剤収納部、９……フイ
ルタ収納部、１１……接種剤、１２……フイルタ
、２０……ボンデイング装置、２６，５３……受
け具、２７，６１……ボンデイングヘツド、２８
……押圧シリンダ、３１……上型、３３，５１，
５２，６３……検出センサ、３７……渦流探知機
。
The drawings are for explaining embodiments of the present invention, and FIG. 1 is a front view of a bonding device according to the first embodiment, FIG. 2 is a side view of the bonding device, and FIG. 3 is a shell mold. A plan view of the lower mold of
FIG. 4 is a sequence configuration diagram for explaining the operation of the bonding apparatus according to the first embodiment, and FIG. 5 is a cross-sectional explanatory diagram for explaining the main parts of the second embodiment.
FIG. 6 is a front view of the upper part of the bonding apparatus according to the third embodiment. DESCRIPTION OF SYMBOLS 1... Lower mold, 8... Inoculant storage part, 9... Filter storage part, 11... Inoculant, 12... Filter, 20... Bonding device, 26, 53... Receiver, 27, 61... ...bonding head, 28
... Pressing cylinder, 31 ... Upper mold, 33, 51,
52, 63...detection sensor, 37...eddy current detector.
Claims (1)
受け具と、シエル鋳型の上型を上記下型に対して
押圧する押圧部材とを備え、上記上下のシエル鋳
型を組付けるシエル鋳型の組付装置において、 上記受け具側または上記押圧部材のいずれか一
方に、上記上下のシエル鋳型の成形空間に挿入す
る挿入部材の有無を検出する検出センサを取付け
るとともに、該検出センサからの出力信号により
上記挿入部材の有無を判別する判別手段を設けた
ことを特徴とするシエル鋳型の組付判別装置。[Claims for Utility Model Registration] A receiver for placing the lower molds of a pair of upper and lower half-split shell molds, and a pressing member for pressing the upper molds of the shell molds against the lower molds; In a shell mold assembly device for assembling shell molds, a detection sensor is installed on either the receiver side or the pressing member to detect the presence or absence of an insertion member to be inserted into the molding space of the upper and lower shell molds. . A shell mold assembly determination device, comprising a determination means for determining the presence or absence of the insertion member based on an output signal from the detection sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5959488U JPH0527244Y2 (en) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5959488U JPH0527244Y2 (en) | 1988-04-30 | 1988-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165148U true JPH01165148U (en) | 1989-11-17 |
| JPH0527244Y2 JPH0527244Y2 (en) | 1993-07-12 |
Family
ID=31285351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5959488U Expired - Lifetime JPH0527244Y2 (en) | 1988-04-30 | 1988-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0527244Y2 (en) |
-
1988
- 1988-04-30 JP JP5959488U patent/JPH0527244Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527244Y2 (en) | 1993-07-12 |
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