JPH01165155A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH01165155A JPH01165155A JP32450587A JP32450587A JPH01165155A JP H01165155 A JPH01165155 A JP H01165155A JP 32450587 A JP32450587 A JP 32450587A JP 32450587 A JP32450587 A JP 32450587A JP H01165155 A JPH01165155 A JP H01165155A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- bending
- thickness
- extending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置に関し、特に半導体装置のリードフ
レームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a lead frame of a semiconductor device.
従来、この種の半導体装置のリードフレームは耐湿性な
どの面より、厚さがうすくなっており厚さ方向に曲がり
易くなっていた。Conventionally, the lead frame of this type of semiconductor device has been thin in terms of moisture resistance and has been prone to bending in the thickness direction.
上述した従来のリードフレームはポンディング後モール
ド封入までの間に作業中リードフレームが曲がりリード
切れやエッヂタッチを起こしてしまい、組立上の歩留り
を下げるという欠点がある。The above-mentioned conventional lead frame has the disadvantage that the lead frame bends during the operation after bonding and before it is inserted into the mold, causing lead breakage and edge touching, which lowers the assembly yield.
上述した従来のリードフレームに対し、本発明は長辺方
向の端を補強し曲がりにくくする構造を有するという内
容を有する。In contrast to the conventional lead frame described above, the present invention has a structure in which the ends in the long side direction are reinforced to make it difficult to bend.
本発明のリードフレームは短辺方向の端すなわち巾方向
の端を曲げることにより、もしくは連続的な凹部を設け
ることにより厚さを変えずに厚さ方向に対する強度を増
すという構造を有する。The lead frame of the present invention has a structure in which the strength in the thickness direction is increased without changing the thickness by bending the ends in the short side direction, that is, the ends in the width direction, or by providing continuous recesses.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例１０図であり、巾方向の端の近
傍に溝３がある。このためリードフレームが曲がりずら
くなっている。すなわち一方向に延在するリードフレー
ム（長手方向にのびるリードフレーム）のアイランド１
．リード２の外側に長手方向に延在する凹部３を一定の
厚さのリードフレームの厚さを変えずに設ける。FIG. 1 shows a tenth embodiment of the present invention, in which a groove 3 is provided near the end in the width direction. This makes it difficult for the lead frame to bend. In other words, island 1 of the lead frame extending in one direction (lead frame extending in the longitudinal direction)
．． A recess 3 extending in the longitudinal direction is provided on the outside of the lead 2 without changing the thickness of a lead frame having a constant thickness.
第２図は本発明の実施例２０図である。４はリードフレ
ームが折り返してあり曲がりずらくなっている。この実
施例でも、リードフレームの厚さは一定であり、−度折
り返すだけなので製造工程が簡単であるという利点があ
る。FIG. 2 is a 20th embodiment of the present invention. In No. 4, the lead frame is folded back, making it difficult to bend. This embodiment also has the advantage that the lead frame has a constant thickness and the manufacturing process is simple because it is simply folded back.
以上説明したように本発明は、リードフレームの長辺方
向の端を曲げる等を行うことにより、半導体装置製造工
程中にリードフレームが曲がることによるリード切れや
エッヂタッチを防ぎ組立上の歩留を向上する効果がある
。As explained above, the present invention prevents lead breakage and edge touching caused by bending of the lead frame during the semiconductor device manufacturing process and improves the assembly yield by bending the long side ends of the lead frame. It has an improving effect.
第１図は本発明の実施例１を示す平面図、第２図は実施
例２を示す平面図である。
１・・・・・・アイランド、２・・・・・・リード、３
・・・・・・溝（凹部）、４・・・・・・返し。
代理人 弁理士 内 原 音FIG. 1 is a plan view showing a first embodiment of the present invention, and FIG. 2 is a plan view showing a second embodiment. 1...Island, 2...Lead, 3
・・・・・・Groove (concave part), 4・・・・・・Turn. Agent Patent Attorney Oto Uchihara
Claims (1)
ドフレームにおいて、その厚さを変えずに、巾方向の端
を折り曲げるかあるいは巾方向の所定部に凹部を設け、
該折り曲げ部もしくは凹部を連続的に前記一方向に延在
させたことを特徴とする半導体装置のリードフレーム。In a lead frame of a semiconductor device having a predetermined width and extending in one direction, without changing the thickness, bending the end in the width direction or providing a recess in a predetermined portion in the width direction,
A lead frame for a semiconductor device, characterized in that the bent portion or the recessed portion extends continuously in the one direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32450587A JPH01165155A (en) | 1987-12-21 | 1987-12-21 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32450587A JPH01165155A (en) | 1987-12-21 | 1987-12-21 | Lead frame for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165155A true JPH01165155A (en) | 1989-06-29 |
Family
ID=18166551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32450587A Pending JPH01165155A (en) | 1987-12-21 | 1987-12-21 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165155A (en) |
-
1987
- 1987-12-21 JP JP32450587A patent/JPH01165155A/en active Pending
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