JPH01165247U - - Google Patents

Info

Publication number
JPH01165247U
JPH01165247U JP1988061387U JP6138788U JPH01165247U JP H01165247 U JPH01165247 U JP H01165247U JP 1988061387 U JP1988061387 U JP 1988061387U JP 6138788 U JP6138788 U JP 6138788U JP H01165247 U JPH01165247 U JP H01165247U
Authority
JP
Japan
Prior art keywords
chip
printing elements
connection pad
insulating substrate
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988061387U
Other languages
English (en)
Other versions
JPH0711984Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988061387U priority Critical patent/JPH0711984Y2/ja
Publication of JPH01165247U publication Critical patent/JPH01165247U/ja
Application granted granted Critical
Publication of JPH0711984Y2 publication Critical patent/JPH0711984Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electronic Switches (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例熱印字ヘツドの
要部を示すパターン図、第２図は、他の実施例熱
印字ヘツドのリード電極のパターン例図、第３図
及び第４図は従来の熱印字ヘツドのリード電極と
ＩＣ電極のパターン例図、第５図は、一般的な熱
サーマルヘツドの概略構成を説明する図である。 １……絶縁基板、２……発熱抵抗体、３……Ｉ
Ｃチツプ、５……ＩＣの電極、６……リード電極
、７……ワイボンパツド、８……ボンデイングワ
イヤ、９……ＧＮＤパターン。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁基板上に、多数個の印字素子が配列される
    と共に、前記絶縁基板上の前記印字素子とは離れ
    た位置に前記印字素子を駆動するためのＩＣチツ
    プを実装し、かつ絶縁基板上に、一端が前記各印
    字素子に接続され他端に接続パツドを有し、この
    接続パツドが前記ＩＣチツプ近傍に配置されるリ
    ード電極を形成し、前記リード電極の接続パツド
    と前記ＩＣチツプの両側に配置されるＩＣ電極を
    ボンデイングワイヤで接続してなる印字ヘツドに
    おいて、 前記複数のリード電極の少なくとも一部のリー
    ド電極に、前記接続パツドとは別に測定用パツド
    を設け、かつ前記ＩＣチツプの片側と他方側で、
    測定用パツドに兼用するリード電極の接続パツド
    を含む測定用パツドの配列が同一パターンに形成
    されてなることを特徴とする印字ヘツド。
JP1988061387U 1988-05-10 1988-05-10 印字ヘッド Expired - Lifetime JPH0711984Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061387U JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Publications (2)

Publication Number Publication Date
JPH01165247U true JPH01165247U (ja) 1989-11-17
JPH0711984Y2 JPH0711984Y2 (ja) 1995-03-22

Family

ID=31287059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061387U Expired - Lifetime JPH0711984Y2 (ja) 1988-05-10 1988-05-10 印字ヘッド

Country Status (1)

Country Link
JP (1) JPH0711984Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048556A (ja) * 1990-04-26 1992-01-13 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその抵抗値トリミング法
JP2001301219A (ja) * 2000-04-19 2001-10-30 Rohm Co Ltd サーマルプリントヘッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH048556A (ja) * 1990-04-26 1992-01-13 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその抵抗値トリミング法
JP2001301219A (ja) * 2000-04-19 2001-10-30 Rohm Co Ltd サーマルプリントヘッド

Also Published As

Publication number Publication date
JPH0711984Y2 (ja) 1995-03-22

Similar Documents

Publication Publication Date Title
JPS61192847U (ja)
JP3234003B2 (ja) サーマルヘッド
JPS60127935U (ja) サ−マルヘツド
JPH02126845U (ja)
JPH0348230U (ja)
JPS6339542U (ja)
JPS62109477U (ja)
JPH0321855U (ja)
JPS62191437U (ja)
JPS60117152U (ja) 熱印字ヘツド
JP3075900B2 (ja) ライン型サーマルプリントヘッドの構造
JPH02108033U (ja)
JPS6455042U (ja)
JPS61124151U (ja)
JPH01106241U (ja)
JPH01174949U (ja)
JPH0356172U (ja)
JPH01174960U (ja)
JPS63170141U (ja)
JPH0737149B2 (ja) 熱印字ヘツドのｉｃ取付け構造
JPS6420339U (ja)
JPS6226065U (ja)
JPS62135459U (ja)
JPH048431U (ja)
JPS6183078U (ja)