JPH048431U - - Google Patents

Info

Publication number
JPH048431U
JPH048431U JP1990046889U JP4688990U JPH048431U JP H048431 U JPH048431 U JP H048431U JP 1990046889 U JP1990046889 U JP 1990046889U JP 4688990 U JP4688990 U JP 4688990U JP H048431 U JPH048431 U JP H048431U
Authority
JP
Japan
Prior art keywords
wire bonding
bare chip
mounting board
chip mounting
bonding pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990046889U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990046889U priority Critical patent/JPH048431U/ja
Publication of JPH048431U publication Critical patent/JPH048431U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるベアチツプ取付基板の一
実施例を示す概略平面図である。第２図は本考案
によるベアチツプ取付基板の他の実施例を示す概
略平面図である。第３図は従来のベアチツプ取付
基板の一例を示す概略平面図である。 １０……ベアチツプ取付基板；１１……ベアチ
ツプ；１１ｂ……電極端子；１２……ワイヤボン
デイングパツド；１３……ボンデイングワイヤ。

Claims (1)

  1. 【実用新案登録請求の範囲】 取り付けられるべき複数個のベアチツプの側縁
    に沿つて整列するように導電パターンにより構成
    された複数のワイヤボンデイングパツドを備えた
    ベアチツプ取付基板において、 上記ワイヤボンデイングパツドのうち、各ベア
    チツプに関連する少なくとも一方の端部に位置す
    るワイヤボンデイングパツドが、他のワイヤボン
    デイングパツドと異なる形状に形成されているこ
    とを特徴とする、ベアチツプ取付基板。
JP1990046889U 1990-05-07 1990-05-07 Pending JPH048431U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990046889U JPH048431U (ja) 1990-05-07 1990-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990046889U JPH048431U (ja) 1990-05-07 1990-05-07

Publications (1)

Publication Number Publication Date
JPH048431U true JPH048431U (ja) 1992-01-27

Family

ID=31562352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990046889U Pending JPH048431U (ja) 1990-05-07 1990-05-07

Country Status (1)

Country Link
JP (1) JPH048431U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242241B2 (ja) * 1985-01-18 1987-09-07 Yoshio Morita

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6242241B2 (ja) * 1985-01-18 1987-09-07 Yoshio Morita

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