JPH01165657U - - Google Patents
Info
- Publication number
- JPH01165657U JPH01165657U JP1988063102U JP6310288U JPH01165657U JP H01165657 U JPH01165657 U JP H01165657U JP 1988063102 U JP1988063102 U JP 1988063102U JP 6310288 U JP6310288 U JP 6310288U JP H01165657 U JPH01165657 U JP H01165657U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- body portion
- semiconductor chip
- lead terminals
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例の斜視図、第２
図は第１図の第１の実施例の断面図、第３図は本
考案の第２の実施例の斜視図、第４図は第３図の
第２の実施例の断面図、第５図は従来のパツケー
ジの一例の斜視図である。
１，１ａ，１ｂ……本体部、２，２ａ……リー
ド端子、３……端子、４……露出面、５……ボン
デイングワイヤ、６……半導体チツプ、７……穴
。
Fig. 1 is a perspective view of the first embodiment of the present invention;
The figures are a sectional view of the first embodiment shown in FIG. 1, FIG. 3 is a perspective view of the second embodiment of the present invention, FIG. 4 is a sectional view of the second embodiment shown in FIG. The figure is a perspective view of an example of a conventional package. DESCRIPTION OF SYMBOLS 1, 1a, 1b... Main body part, 2, 2a... Lead terminal, 3... Terminal, 4... Exposed surface, 5... Bonding wire, 6... Semiconductor chip, 7... Hole.
Claims (1)
半導体チツプのそれぞれの電極に接続され前記本
体部から外部に導出される複数のリード端子と、
前記本体部に上面に設けられ前記リード端子それ
ぞれの一部が露出する複数の露出面とを有するこ
とを特徴とするパツケージ。 a main body portion housing a semiconductor chip therein; a plurality of lead terminals connected to respective electrodes of the semiconductor chip and led out from the main body portion;
A package characterized in that the main body portion has a plurality of exposed surfaces provided on the upper surface from which a portion of each of the lead terminals is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063102U JPH01165657U (en) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063102U JPH01165657U (en) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165657U true JPH01165657U (en) | 1989-11-20 |
Family
ID=31288631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063102U Pending JPH01165657U (en) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165657U (en) |
-
1988
- 1988-05-12 JP JP1988063102U patent/JPH01165657U/ja active Pending