JPH01165657U - - Google Patents
Info
- Publication number
- JPH01165657U JPH01165657U JP1988063102U JP6310288U JPH01165657U JP H01165657 U JPH01165657 U JP H01165657U JP 1988063102 U JP1988063102 U JP 1988063102U JP 6310288 U JP6310288 U JP 6310288U JP H01165657 U JPH01165657 U JP H01165657U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- body portion
- semiconductor chip
- lead terminals
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例の斜視図、第２
図は第１図の第１の実施例の断面図、第３図は本
考案の第２の実施例の斜視図、第４図は第３図の
第２の実施例の断面図、第５図は従来のパツケー
ジの一例の斜視図である。 １，１ａ，１ｂ……本体部、２，２ａ……リー
ド端子、３……端子、４……露出面、５……ボン
デイングワイヤ、６……半導体チツプ、７……穴
。
図は第１図の第１の実施例の断面図、第３図は本
考案の第２の実施例の斜視図、第４図は第３図の
第２の実施例の断面図、第５図は従来のパツケー
ジの一例の斜視図である。 １，１ａ，１ｂ……本体部、２，２ａ……リー
ド端子、３……端子、４……露出面、５……ボン
デイングワイヤ、６……半導体チツプ、７……穴
。
Claims (1)
- 内部に半導体チツプを収納する本体部と、前記
半導体チツプのそれぞれの電極に接続され前記本
体部から外部に導出される複数のリード端子と、
前記本体部に上面に設けられ前記リード端子それ
ぞれの一部が露出する複数の露出面とを有するこ
とを特徴とするパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063102U JPH01165657U (ja) | 1988-05-12 | 1988-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988063102U JPH01165657U (ja) | 1988-05-12 | 1988-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165657U true JPH01165657U (ja) | 1989-11-20 |
Family
ID=31288631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988063102U Pending JPH01165657U (ja) | 1988-05-12 | 1988-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165657U (ja) |
-
1988
- 1988-05-12 JP JP1988063102U patent/JPH01165657U/ja active Pending