JPH01167973A - Card edge connector - Google Patents
Card edge connectorInfo
- Publication number
- JPH01167973A JPH01167973A JP62325442A JP32544287A JPH01167973A JP H01167973 A JPH01167973 A JP H01167973A JP 62325442 A JP62325442 A JP 62325442A JP 32544287 A JP32544287 A JP 32544287A JP H01167973 A JPH01167973 A JP H01167973A
- Authority
- JP
- Japan
- Prior art keywords
- board
- insertion opening
- edge connector
- card edge
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 claims abstract description 35
- 230000037431 insertion Effects 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、基板の接続端部を他の基板に接続させる為の
カードエツジコネクタに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a card edge connector for connecting a connecting end of a board to another board.
（従来の技術）
基板の接続端部を略直交した状態に他の基板に接続させ
るカートエツジコネクタとしては、第９図の断面概略図
で示すものがある。このカードエツジコネクタ８は基板
２に実装され、他の基板の接続端部かその上方から装着
される。(Prior Art) As a cart edge connector for connecting the connecting end of a board to another board in a substantially orthogonal state, there is one shown in the schematic cross-sectional view of FIG. 9. This card edge connector 8 is mounted on the board 2 and attached from the connecting end of another board or from above.
カードエツジコネクタ８は絶縁材からなるハウジング８
１の内部に装着孔８２を形成し、この装着孔８Ｚ内にコ
ンタクト片８３ａ、８３ｂを一対とする複数のコンタク
ト８３が配列されている。又ハウジング８１の下面に端
子８４を突設し、基板２上のパターン回路にハンダ付け
されている。装着孔８２の上方すなわちハウジング８１
の上面には長溝状の挿入口８５が設けられており、この
挿入口８５から基板９の接続端部を挿入し、そのパター
ン回路と各コンタクト片８３ａ、８：Ｉｂの接触により
基板２と基板９との電気的接続が得られる。The card edge connector 8 has a housing 8 made of an insulating material.
A mounting hole 82 is formed inside the mounting hole 8Z, and a plurality of contacts 83 including a pair of contact pieces 83a and 83b are arranged in this mounting hole 8Z. Further, a terminal 84 is provided protruding from the lower surface of the housing 81 and is soldered to a pattern circuit on the board 2. Above the mounting hole 82, that is, the housing 81
A long groove-shaped insertion opening 85 is provided on the top surface, and the connection end of the board 9 is inserted through this insertion opening 85, and the pattern circuit and each contact piece 83a, 8:Ib are brought into contact with each other to connect the board 2 and the board. Electrical connection with 9 is obtained.
斯かるカートエツジコネクタ８を基板２にハンダ付は実
装するには、通常デツプソルダリングが用いられる。Depth soldering is usually used to solder and mount such a cart edge connector 8 on the board 2.
すなわちデツプソルダリングでは他の実装部品とともに
、基板の下面をデツピング槽に通過させることにより、
自動的かつ量産的にハンダ付施工を行なう。In other words, in depth soldering, the bottom surface of the board is passed through a depping tank together with other mounted components.
Performs soldering automatically and in mass production.
〈発明か解決しようとする問題点〉
一方基板９を基板２の下面側から接続させる場合は、カ
ートエッジコネクタ８自体を基板の下面側すなわち他の
実装部品とは反対側にハンダ付けしなければならない。<Problem to be solved by the invention> On the other hand, when connecting the board 9 from the bottom side of the board 2, the cart edge connector 8 itself must be soldered to the bottom side of the board, that is, the side opposite to other mounted components. It won't happen.
この場合カートエツジコネクタ８の端子８４が他の実装
部品が実装された面、すなわち基板の上面に突出するの
で、他の実装部品とともにデツピング槽を通過させるこ
とか出来ない。その為カードエツジコネクタ８のみを後
付けし、手作業によって端子８４を基板２にハンダ付け
しなければならず、量産化及゛び実装の自動化を妨げる
原因となっている。In this case, since the terminal 84 of the cart edge connector 8 protrudes from the surface on which other mounted components are mounted, that is, the upper surface of the substrate, it is only possible to pass the cart edge connector 8 through the depping tank together with the other mounted components. Therefore, only the card edge connector 8 must be added later and the terminals 84 must be manually soldered to the board 2, which hinders mass production and automation of mounting.
く問題点を解決させるための手段〉
本発明は上記問題点に鑑み成されたもので、ハウジング
の下面にハウジング内の装着孔を介して上部挿入口に連
通ずる下部挿入口を形成したもので、上部挿入口若しく
は下部挿入口の何れか一方から挿入した基板の接続端部
のパターン回路を装着孔内に配列したコンタクトにｖｉ
統させるものである。Means for Solving the Problems> The present invention has been made in view of the above problems, and includes a lower insertion port formed on the lower surface of the housing that communicates with the upper insertion port through the mounting hole in the housing. , the pattern circuit of the connection end of the board inserted from either the upper insertion opening or the lower insertion opening is attached to the contacts arranged in the mounting hole.
It is something that governs.
く作用〉
カートエツジコネクタは上部挿入口とともに下部挿入口
を有する為、基板を他の基板の下面側からも接続させる
ことが出来る。すなわち、カードエツジコネクタを基板
の下面に取付けることなく、従来通り他の実装部品と同
じ側に実装することができる。Function> Since the cart edge connector has an upper insertion opening and a lower insertion opening, it is possible to connect a board to another board from the bottom side. That is, the card edge connector can be mounted on the same side as other mounted components as before, without being attached to the bottom surface of the board.
よって、他の実装部品とともにデツプソルダリングを行
うことか可能となる。更に上部挿入口と下部挿入口を連
通した状態に形成した為、カートエツジコネクタを実装
した複数の基板を、例えば接続基板を用いて多段状に配
置することも可能となる。Therefore, it becomes possible to perform depth soldering together with other mounted components. Furthermore, since the upper insertion port and the lower insertion port are formed in a communicating state, it is possible to arrange a plurality of boards on which cart edge connectors are mounted in a multi-tiered configuration using, for example, connection boards.
〈実施例〉
以下、図面に基づき本発明のカートエツジコネクタにつ
いて詳細に説明する。<Example> Hereinafter, the cart edge connector of the present invention will be described in detail based on the drawings.
第１図はカートエツジコネクタ１の斜視図であり、第２
図は第１図におけるＸ−Ｘ！！矢視断面図である。カー
トエツジコネクタｌは、ポリスチレン樹脂等の絶縁性の
高い材料によってハウジンク１１を形成し、このハウジ
ングｌｌ内には上下方向に貫通させた状態に装着孔１２
か形成されている。ハウジング１１の上面１１ａには長
溝状の上部挿入口１３が、又下面１１ｂにも長溝状の下
部挿入口１４が形成され、両者は上記装着孔１２を介し
て上下方向に連通した状態となっている。又装着孔１２
にはコンタクト片１５ａ、１５ｂを一対とするコンタク
ト１５が複数配列されている。コンタクト片１５ａ 、
１５ｂはリン青銅等のバネ性に富む導電材か用いられ
、コンタクト片１５ａ、１５ｂの一部を装着孔１２内方
向に折曲して所定の接点圧を有する１つのコンタクト部
１５ｃを形成する。又ハウジング１１の下面Ｌｌｂには
上記コンタクト片１５ａ、１５ｂに接続する端子ｉ６．
１６か突設されている。両端子１６．１６は、下部挿入
口１４から装着される基板のパターン回路に接触しない
よう十分な間隔をもって突設されている。FIG. 1 is a perspective view of the cart edge connector 1, and the second
The figure is XX! in Figure 1! ! It is an arrow sectional view. The cart edge connector 1 has a housing 11 made of a highly insulating material such as polystyrene resin, and a mounting hole 12 that extends vertically through the housing 11.
or is formed. A long groove-shaped upper insertion opening 13 is formed on the upper surface 11a of the housing 11, and a long groove-shaped lower insertion opening 14 is formed on the lower surface 11b, and both are in communication with each other in the vertical direction via the mounting hole 12. There is. Also, mounting hole 12
A plurality of contacts 15 each having a pair of contact pieces 15a and 15b are arranged. contact piece 15a,
15b is made of a highly elastic conductive material such as phosphor bronze, and a part of the contact pieces 15a, 15b is bent inward to the mounting hole 12 to form one contact portion 15c having a predetermined contact pressure. Further, on the lower surface Llb of the housing 11, terminals i6.
There are 16 protrusions. Both terminals 16.16 are protruded with a sufficient interval so as not to contact the pattern circuit of the board mounted from the lower insertion opening 14.
通常これらコンタクト１５は１．２７ｍｍ、 ２．５４
ｍｍ等所定のピッチで配列され、その極数も適宜定めら
れる。Usually these contacts 15 are 1.27mm, 2.54
They are arranged at a predetermined pitch such as mm, and the number of poles is also determined as appropriate.
第３図の断面概略図で示す様に、カートエツジコネクタ
ｌを実装する基板２においては、その実装部分に下部挿
入口１４とほぼ整合する孔２１か穿孔される。As shown in the schematic cross-sectional view of FIG. 3, a hole 21 substantially aligned with the lower insertion opening 14 is bored in the mounting portion of the substrate 2 on which the cartridge connector 1 is mounted.
斯かる状態において、基板２の上面側から他の基板の接
続端部（以下単にカートエツジという）３を接続させる
場合は、上部挿入口１３からカートエツジ３を挿入し、
そのパターン回路３１とコンタクト部１’５ｃを接続さ
せる。又逆に基板２の下面側から基板を接続させる場合
は、基板２の下面側から孔２１を介して下部挿入口１４
にそのカートエツジ４を挿入すれば同様にパターン回路
４１とコンタクト部１５ｃが接続される。In such a state, when connecting the connecting end (hereinafter simply referred to as cart edge) 3 of another board from the top side of the board 2, insert the cart edge 3 from the upper insertion opening 13,
The pattern circuit 31 and the contact portion 1'5c are connected. Conversely, when connecting the board from the bottom side of the board 2, the lower insertion opening 14 is inserted from the bottom side of the board 2 through the hole 21.
When the cart edge 4 is inserted into the holder, the pattern circuit 41 and the contact portion 15c are similarly connected.
更に本発明のカートエツジコネクタ１を用いて基板を所
謂多段状に接続させるには、第４図の分解斜視図及び第
５図の側面図で示す如く、接続基板５を介して各基板２
Ａ、２Ｂ、２Ｃ，２Ｄを順次挿入してゆけばよい。Furthermore, in order to connect boards in a so-called multi-tiered manner using the cart edge connector 1 of the present invention, as shown in the exploded perspective view of FIG. 4 and the side view of FIG.
A, 2B, 2C, and 2D may be inserted in sequence.
接続基板５は、略中夫に固定辺５１を形成するとともに
固定辺５１の上下にそれぞれカートエツジ５２．５３を
形成したものである。又基板２Ａ〜２Ｄの上面には、他
の実装部品とともにカートエツジコネクタｌが第３図で
説明した状態に実装されている。The connection board 5 has a fixed side 51 formed approximately in the middle, and cart edges 52 and 53 formed above and below the fixed side 51, respectively. Further, on the upper surfaces of the boards 2A to 2D, a cart edge connector 1 is mounted together with other mounted components in the state described in FIG. 3.
各基板２Ａ〜２Ｄを多段状に接続させる為には、先ず基
板２Ａの下部挿入口１４にカートエツジ５２を挿入する
。カートエツジ５２は十分な長さを有する為カードエツ
ジコネクタｌを貫通した状態となり、更に基板２Ｂに実
装されたカードエツジコネクタｌの下部挿入口１４に挿
入される。又カードエツジ５３に対しても基板２Ｃに実
装されたカートエツジコネクタｌの上部挿入口１３を挿
入する。前記同様カートエツジ５３は十分な長さを有す
る為、基板２Ｃに実装されたカードエツジコネクタｌを
貫通してその先端か基板２Ｄのカードエツジコネクタｌ
に挿入される。すると第５図のＹ−Ｙ線矢視断面概略図
である第６図に示す様に、接続基板５に対して各基板２
Ａ、２Ｂ、２Ｃ，２Ｄは多段状に接続される。しかもパ
ターン回路５２．５３を長くすることによって、接続す
る基板の数を適宜増減させることか回部である。In order to connect the boards 2A to 2D in a multi-tiered manner, first the cart edge 52 is inserted into the lower insertion opening 14 of the board 2A. Since the cart edge 52 has a sufficient length, it passes through the card edge connector l, and is further inserted into the lower insertion opening 14 of the card edge connector l mounted on the board 2B. Also, the upper insertion opening 13 of the cart edge connector l mounted on the board 2C is inserted into the card edge 53. As described above, the cart edge 53 has a sufficient length, so it passes through the card edge connector l mounted on the board 2C and connects its tip to the card edge connector l of the board 2D.
inserted into. Then, as shown in FIG. 6, which is a schematic cross-sectional view taken along the Y-Y line in FIG.
A, 2B, 2C, and 2D are connected in multiple stages. Furthermore, by lengthening the pattern circuits 52 and 53, the number of connected boards can be increased or decreased as appropriate.
尚接続基板５は基板支持部５４に対し予めビス５５によ
って取付けておくことも出来る。又基板の挿入順序につ
いてを何れか先にするかは装置の形状等によって適宜選
択することが出来る。Note that the connection board 5 can also be attached to the board support part 54 in advance with screws 55. Also, the order in which the boards are inserted can be selected as appropriate depending on the shape of the device, etc.
更に第７図の分解斜視図で示す様に、連結コネクタ６を
実装した基板２Ｅを接続するには、該連結コネクタ６の
上部に接続基板５のパターン回路５３を挿入し、一方連
結コネクタ６の下部には他の連結基板７のカートエツジ
７１を挿入するとともに、下部のカートエツジ７２を基
板２Ｆに実装したカードエツジコネクタｌの上部挿入口
１３に挿入する。すると第８図の側面図で示す如く、各
基板２Ａ〜２Ｆを多段状で且つ複合的に接続できる。Furthermore, as shown in the exploded perspective view in FIG. The cart edge 71 of another connection board 7 is inserted into the lower part, and the lower cart edge 72 is inserted into the upper insertion opening 13 of the card edge connector l mounted on the board 2F. Then, as shown in the side view of FIG. 8, the boards 2A to 2F can be connected in multiple stages and in a complex manner.
〈発明の効果〉
以上の如く本発明のカートエツジコネクタはハウジング
の上面に設けた上部挿入口と下面に設けた下部挿入口と
を内部の装着孔を介して連通させたため、当該カートエ
ツジコネクタを実装した基板の上下両面からカートエツ
ジを接続させることがてきる。よってカードエツジコネ
クタを実装した基板を多段状に接続できる等、基板の取
付けを多面に展開することが可能となる。又本コネクタ
は他の実装部品とともにデツプツルダルリングを行なう
ことが出来るので、ハンダ付施工か簡略化される結実施
工コストを大幅に低減させる。よって量産化、自動化に
も好適なものとなる。<Effects of the Invention> As described above, in the cart edge connector of the present invention, the upper insertion opening provided on the upper surface of the housing and the lower insertion opening provided on the lower surface of the housing communicate with each other through the internal mounting hole. Cart edges can be connected from both the top and bottom of the mounted board. Therefore, it is possible to attach boards in many ways, such as connecting boards on which card edge connectors are mounted in multiple stages. Moreover, since this connector can be used for deep-dial ringing together with other mounting components, the cost of soldering work is greatly reduced, which simplifies the soldering work. Therefore, it is suitable for mass production and automation.
【図面の簡単な説明】
第１図は、本発明のカートエツジコネクタの斜視図、
第２図は、第１図におけるｘ−Ｘ線矢視断面図、
第３図は、基板の接続を説明する断面概略図。
第４図は、多段状の取付状態を説明する分解斜視図、
第５図は、多段状の取付状態を示す側面図、第６図は、
第５図におけるＹ−Ｙ線矢視断面概略図、
第７図は、他の取付は状態を示す分解斜視図、第８図は
、同取付状態を示す側面図、
第９図は、従来のカートエツジコネクタを説明する断面
概略図である。
ｌ・・・カートエツジコネクタ。
１１−・・ハウジング、 １ｌａ−上面、 １ｌｂ
−・・下面。
１２・・・装着孔、１３・・・上部挿入口。
１４・・・下部挿入口、１５・・・コンタクト。
１５ｃ・・・コンタクト部、 １６・・・端子、２・
・・基板。
２１・・・孔、３，４・・・接続端部（カートエツジ）
。
特許出願人 沖電気工業株式会社第７図[Brief Description of the Drawings] Fig. 1 is a perspective view of the cart edge connector of the present invention, Fig. 2 is a sectional view taken along the line x-X in Fig. 1, and Fig. 3 explains the connection of the board. Cross-sectional schematic diagram. Fig. 4 is an exploded perspective view illustrating the multi-stage mounting state, Fig. 5 is a side view showing the multi-stage mounting state, and Fig. 6 is the
FIG. 5 is a schematic cross-sectional view taken along the Y-Y line in FIG. FIG. 2 is a schematic cross-sectional view illustrating a cart edge connector. l... Cart Edge connector. 11--Housing, 1la-Top surface, 1lb
−・・Bottom surface. 12... Mounting hole, 13... Upper insertion port. 14...Lower insertion port, 15...Contact. 15c...Contact part, 16...Terminal, 2.
··substrate. 21...hole, 3,4...connection end (cart edge)
. Patent applicant Oki Electric Industry Co., Ltd. Figure 7
Claims (1)
、該上部挿入口に連通した内部の装着孔に複数のコンタ
クトを所定ピッチで配列するとともに、 該コンタクトに接続した端子をハウジングの下面に突設
したものであって、 前記ハウジングの下面には前記装着孔を介して上部挿入
口に連通する下部挿入口を形成し、上部挿入口若しくは
下部挿入口の何れか一方から挿入した基板のパターン回
路を上記コンタクトに接続させることを特徴とするカー
ドエッジコネクタ。(1) A long groove-shaped upper insertion opening is formed on the upper surface of the housing, a plurality of contacts are arranged at a predetermined pitch in the internal mounting hole communicating with the upper insertion opening, and the terminals connected to the contacts are connected to the lower surface of the housing. A lower insertion opening is formed on the lower surface of the housing and communicates with the upper insertion opening through the mounting hole, and a board inserted from either the upper insertion opening or the lower insertion opening is inserted into the housing. A card edge connector characterized in that a pattern circuit is connected to the contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325442A JPH01167973A (en) | 1987-12-24 | 1987-12-24 | Card edge connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325442A JPH01167973A (en) | 1987-12-24 | 1987-12-24 | Card edge connector |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5009982A Division JPH0722031B2 (en) | 1993-01-25 | 1993-01-25 | Board assembly |
| JP7281507A Division JPH08213122A (en) | 1995-10-30 | 1995-10-30 | Card edge connector and board assembly using it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01167973A true JPH01167973A (en) | 1989-07-03 |
| JPH0418438B2 JPH0418438B2 (en) | 1992-03-27 |
Family
ID=18176906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62325442A Granted JPH01167973A (en) | 1987-12-24 | 1987-12-24 | Card edge connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01167973A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5462442A (en) * | 1993-02-24 | 1995-10-31 | Hitachi, Ltd. | Module for information processing apparatus using stacked printed circuit boards and connector for stacking printed circuit boards |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133686A (en) * | 1983-12-21 | 1985-07-16 | 株式会社リコー | heating element |
| JPS60133686U (en) * | 1984-02-16 | 1985-09-06 | オンキヨー株式会社 | Connection device for acoustic components |
-
1987
- 1987-12-24 JP JP62325442A patent/JPH01167973A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133686A (en) * | 1983-12-21 | 1985-07-16 | 株式会社リコー | heating element |
| JPS60133686U (en) * | 1984-02-16 | 1985-09-06 | オンキヨー株式会社 | Connection device for acoustic components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5462442A (en) * | 1993-02-24 | 1995-10-31 | Hitachi, Ltd. | Module for information processing apparatus using stacked printed circuit boards and connector for stacking printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0418438B2 (en) | 1992-03-27 |
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